LFSC3GA15E-6FN900I
| Part Description |
SC Field Programmable Gate Array (FPGA) IC 300 1054720 15000 900-BBGA |
|---|---|
| Quantity | 411 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FPBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 105°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA | Number of I/O | 300 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3750 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1054720 |
Overview of LFSC3GA15E-6FN900I – SC Field Programmable Gate Array (FPGA) IC
The LFSC3GA15E-6FN900I is an industrial-grade SC family FPGA from Lattice Semiconductor, packaged in a 900-ball BBGA (900-FPBGA, 31×31) surface-mount package. It delivers a balance of programmable logic, on-chip RAM and I/O density tailored for communication and system-level designs that require deterministic performance across a wide temperature range.
Built on the LatticeSC/M family architecture, this device is suited for applications that need significant logic capacity, substantial embedded memory, and a high count of I/O channels while operating from a low-voltage core supply.
Key Features
- Logic Capacity Approximately 15,000 logic elements providing flexible programmable fabric for implementing control, data-path and protocol logic.
- On‑Chip Memory Approximately 1.05 Mbits of total embedded RAM to support FIFOs, buffers and memory-intensive functions.
- I/O Density 300 I/O pins to support wide parallel interfaces, multiple high-speed links or dense peripheral connectivity.
- High‑Performance Family Features Built on the LatticeSC/M family architecture, which includes advanced FPGA fabric, high-speed SERDES and high-performance I/O capabilities described in the LatticeSC/M data sheet.
- Voltage and Power Core supply operation from 0.95 V to 1.26 V to accommodate low-voltage system designs.
- Industrial Temperature Rating Rated for operation from −40 °C to 105 °C for deployment in industrial environments.
- Package and Mounting 900-BBGA (900-FPBGA, 31×31) surface-mount package for compact, high-pin-count board designs.
- Regulatory Compliance RoHS compliant, supporting environmental and manufacturing requirements.
Typical Applications
- Industrial Networking and Control Use the device for protocol bridging, deterministic control logic and I/O aggregation where industrial temperature operation and robust I/O are required.
- Communications Interfaces Deploy as a protocol or interface engine in network equipment leveraging the SC family’s high-speed I/O and SERDES capabilities for link handling and packet processing.
- Embedded System Acceleration Implement hardware-accelerated data-paths, custom peripherals or offload functions using the device’s logic capacity and embedded RAM.
- Memory-Intensive Logic Leverage the approximately 1.05 Mbits of on-chip RAM for FIFOs, buffering and temporary storage in streaming or packetized designs.
Unique Advantages
- High integration in a compact package: 900-ball BBGA package provides a high pin count in a compact footprint, reducing board area while enabling dense connectivity.
- Substantial logic and memory resources: Combination of ~15,000 logic elements and ~1.05 Mbits of embedded RAM supports complex control and data-path implementations without large external memory requirements.
- Wide operating temperature range: Industrial rating from −40 °C to 105 °C supports deployment in harsh environments and industrial applications.
- Low-voltage core operation: 0.95 V to 1.26 V core supply fits low-power system designs and modern power-rail architectures.
- High I/O count for flexible system interfacing: 300 I/Os enable broad peripheral support and multiple simultaneous interfaces.
- Standards-focused family capabilities: The underlying LatticeSC/M family delivers architectural features and I/O performance designed for communication and system-level functions (as described in the family's data sheet).
Why Choose LFSC3GA15E-6FN900I?
The LFSC3GA15E-6FN900I combines a sizable programmable fabric with meaningful embedded memory and a high I/O count in a compact 900-BBGA package, making it a practical choice for industrial and communications-focused designs that require low-voltage operation and extended temperature capability. Its placement within the LatticeSC/M family provides access to a family architecture optimized for high-performance I/O and system-level integration.
Choose this device when your design demands balanced logic density, on-chip buffering and extensive I/O in an industrial-rated FPGA that fits into space-constrained board layouts while supporting low-voltage systems.
Request a quote today to evaluate LFSC3GA15E-6FN900I for your next design and to obtain pricing and availability information.