LFSC3GA15E-6FN900I

IC FPGA 300 I/O 900FBGA
Part Description

SC Field Programmable Gate Array (FPGA) IC 300 1054720 15000 900-BBGA

Quantity 411 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package900-FPBGA (31x31)GradeIndustrialOperating Temperature-40°C – 105°C
Package / Case900-BBGANumber of I/O300Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3750Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1054720

Overview of LFSC3GA15E-6FN900I – SC Field Programmable Gate Array (FPGA) IC

The LFSC3GA15E-6FN900I is an industrial-grade SC family FPGA from Lattice Semiconductor, packaged in a 900-ball BBGA (900-FPBGA, 31×31) surface-mount package. It delivers a balance of programmable logic, on-chip RAM and I/O density tailored for communication and system-level designs that require deterministic performance across a wide temperature range.

Built on the LatticeSC/M family architecture, this device is suited for applications that need significant logic capacity, substantial embedded memory, and a high count of I/O channels while operating from a low-voltage core supply.

Key Features

  • Logic Capacity  Approximately 15,000 logic elements providing flexible programmable fabric for implementing control, data-path and protocol logic.
  • On‑Chip Memory  Approximately 1.05 Mbits of total embedded RAM to support FIFOs, buffers and memory-intensive functions.
  • I/O Density  300 I/O pins to support wide parallel interfaces, multiple high-speed links or dense peripheral connectivity.
  • High‑Performance Family Features  Built on the LatticeSC/M family architecture, which includes advanced FPGA fabric, high-speed SERDES and high-performance I/O capabilities described in the LatticeSC/M data sheet.
  • Voltage and Power  Core supply operation from 0.95 V to 1.26 V to accommodate low-voltage system designs.
  • Industrial Temperature Rating  Rated for operation from −40 °C to 105 °C for deployment in industrial environments.
  • Package and Mounting  900-BBGA (900-FPBGA, 31×31) surface-mount package for compact, high-pin-count board designs.
  • Regulatory Compliance  RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

  • Industrial Networking and Control  Use the device for protocol bridging, deterministic control logic and I/O aggregation where industrial temperature operation and robust I/O are required.
  • Communications Interfaces  Deploy as a protocol or interface engine in network equipment leveraging the SC family’s high-speed I/O and SERDES capabilities for link handling and packet processing.
  • Embedded System Acceleration  Implement hardware-accelerated data-paths, custom peripherals or offload functions using the device’s logic capacity and embedded RAM.
  • Memory-Intensive Logic  Leverage the approximately 1.05 Mbits of on-chip RAM for FIFOs, buffering and temporary storage in streaming or packetized designs.

Unique Advantages

  • High integration in a compact package: 900-ball BBGA package provides a high pin count in a compact footprint, reducing board area while enabling dense connectivity.
  • Substantial logic and memory resources: Combination of ~15,000 logic elements and ~1.05 Mbits of embedded RAM supports complex control and data-path implementations without large external memory requirements.
  • Wide operating temperature range: Industrial rating from −40 °C to 105 °C supports deployment in harsh environments and industrial applications.
  • Low-voltage core operation: 0.95 V to 1.26 V core supply fits low-power system designs and modern power-rail architectures.
  • High I/O count for flexible system interfacing: 300 I/Os enable broad peripheral support and multiple simultaneous interfaces.
  • Standards-focused family capabilities: The underlying LatticeSC/M family delivers architectural features and I/O performance designed for communication and system-level functions (as described in the family's data sheet).

Why Choose LFSC3GA15E-6FN900I?

The LFSC3GA15E-6FN900I combines a sizable programmable fabric with meaningful embedded memory and a high I/O count in a compact 900-BBGA package, making it a practical choice for industrial and communications-focused designs that require low-voltage operation and extended temperature capability. Its placement within the LatticeSC/M family provides access to a family architecture optimized for high-performance I/O and system-level integration.

Choose this device when your design demands balanced logic density, on-chip buffering and extensive I/O in an industrial-rated FPGA that fits into space-constrained board layouts while supporting low-voltage systems.

Request a quote today to evaluate LFSC3GA15E-6FN900I for your next design and to obtain pricing and availability information.

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