LFSC3GA15E-6F900C

The LFSC3GA15E-6F900C is a Lattice Semiconductor SC/M family Field Programmable Gate Array (FPGA) in a 900‑ball BGA package. It combines high logic density, abundant I/O and on‑chip memory to address communication, networking and general embedded system designs that require programmable logic and flexible interfacing.

Built on the Lattice SC/M architecture, the device targets applications that benefit from high performance FPGA fabric, significant embedded memory and robust I/O capability while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity  15,000 logic elements (approximately 15K LUT4 equivalents) for implementing complex logic, control and data‑path functions.
• On‑chip Memory  Approximately 1.05 Mbits of total RAM bits for embedded block RAM and distributed memory use in buffering, FIFOs and local data storage.
• I/O Density  300 I/O pins available to support wide parallel interfaces and numerous peripherals.
• Package & Mounting  900‑BBGA (900‑FPBGA, 31×31 mm) surface‑mount package for high pin‑count board designs.
• Supply Voltage  Core supply range 0.95 V to 1.26 V, enabling integration into standard low‑voltage FPGA power rails.
• Operating Conditions  Commercial grade operation from 0 °C to 85 °C.
• Family‑Level Performance  Built on the Lattice SC/M family architecture, which includes high‑performance FPGA fabric, high‑speed SERDES, and advanced clocking and memory features as described in the SC/M family data sheet.
• Standards & Supportive Infrastructure  Family data describes support for high‑speed protocols, programmable termination options and a range of electrical I/O standards (as provided in the Lattice SC/M family documentation).
• RoHS Compliant  Device meets RoHS requirements.

Typical Applications

• Networking & Telecom  Implement protocol processing, packet buffering and custom datapaths using the device's logic density and on‑chip memory.
• High‑Speed I/O Interfaces  Use the available 300 I/Os and SC/M family high‑speed serial capabilities for bridging and interface adaptation between subsystems.
• Embedded Systems & Controllers  Integrate custom control logic, peripheral interfaces and local data handling in industrial and commercial embedded designs.
• Memory‑Intensive Logic  Leverage approximately 1.05 Mbits of embedded RAM for FIFO buffering, packet queues or temporary data storage in real‑time systems.

Unique Advantages

• High Logic Density: 15,000 logic elements enable substantial on‑chip integration of control and data‑path logic, reducing external glue logic.
• Substantial I/O Count: 300 I/Os support wide buses and multiple peripherals without external expander ICs, simplifying board design.
• Embedded Memory Capacity: Approximately 1.05 Mbits of on‑chip RAM reduces dependency on external memory for many buffering and storage tasks.
• Robust Packaging: 900‑BBGA (31×31 mm) provides the pin count required for complex systems while maintaining a compact PCB footprint.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation, suitable for a broad range of commercial and enterprise applications.
• RoHS Compliance: Aligns with common environmental and manufacturing requirements.

Why Choose LFSC3GA15E-6F900C?

The LFSC3GA15E-6F900C positions itself as a versatile programmable logic device for designs that require a balance of logic capacity, significant on‑chip memory and broad I/O. It is suitable for engineering teams implementing communication interfaces, complex control logic or memory‑intensive datapaths within commercial temperature and supply constraints.

Choosing this FPGA gives designers access to the Lattice SC/M family architecture and its system‑level features while providing a straightforward footprint and power envelope for integration into medium‑to‑high complexity board designs.

If you would like pricing or availability information for LFSC3GA15E-6F900C, request a quote or submit a pricing inquiry to receive immediate assistance.