LFSC3GA15E-5FN256C
| Part Description |
SC Field Programmable Gate Array (FPGA) IC 139 1054720 15000 256-BGA |
|---|---|
| Quantity | 132 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 139 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3750 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1054720 |
Overview of LFSC3GA15E-5FN256C – SC Field Programmable Gate Array (FPGA), approximately 15,000 logic elements, 139 I/Os, 256-BGA
The LFSC3GA15E-5FN256C is a Lattice SC family FPGA in a 256-ball BGA package designed for commercial-grade embedded and communications applications. The device combines approximately 15,000 logic elements with about 1.05 Mbits of on-chip RAM and 139 I/O pins, delivering a balanced mix of logic capacity, embedded memory, and system I/O for mid-range programmable designs.
With low-voltage core operation and surface-mount 256-FPBGA packaging, this part is intended for designers who need compact, high-density programmable logic with commercial operating range and RoHS compliance.
Key Features
- Logic Capacity Approximately 15,000 logic elements, providing multi-function programmable fabric for control, data processing, and glue-logic implementations.
- Embedded Memory Approximately 1.05 Mbits of on-chip RAM to support FIFOs, buffers, and local data storage for system-level tasks.
- I/O Count and Flexibility 139 user I/Os accommodate dense peripheral and bus interfaces, sensor front-ends, and board-level signaling requirements.
- Package and Mounting 256-FPBGA (17×17) surface-mount package for compact PCB footprint and high pin density.
- Power Supply Core voltage operation from 0.95 V to 1.26 V to match low-voltage system rails and reduce power dissipation in modern designs.
- Operating Temperature and Grade Commercial temperature range of 0 °C to 85 °C, suitable for a wide set of consumer and industrial-adjacent applications requiring commercial-grade components.
- Regulatory Compliance RoHS compliant for environmental and manufacturing process compatibility.
- LatticeSC/M Family Capabilities The LatticeSC/M family includes high-performance fabric, multi-megahertz clocking and memory resources—features that align with the platform used by this device series.
Typical Applications
- Networking and Communications Mid-range packet processing, protocol bridging, and interface adaptation where flexible logic and embedded memory accelerate data path functions.
- Embedded Control System control, state machines, and custom peripheral aggregation for instrumentation, test equipment, and embedded platforms.
- Protocol and Interface Bridging Implementing glue logic and protocol conversion between disparate buses and I/O standards using the device’s plentiful I/Os and on-chip RAM.
- Memory-Intensive Functions Local buffering, FIFO implementation, and data staging for sensors or streaming data applications leveraging the integrated RAM.
Unique Advantages
- Balanced logic and memory: Combines roughly 15,000 logic elements with about 1.05 Mbits of embedded memory to support both control logic and data buffering on a single device.
- High I/O density: 139 I/Os enable integration of multiple interfaces and peripherals without needing external glue chips, simplifying BOM and board layout.
- Compact, manufacturable package: 256-FPBGA (17×17) surface-mount package supports compact PCB designs while providing high pin-count connectivity.
- Low-voltage core operation: 0.95 V to 1.26 V supply range allows compatibility with modern low-voltage power domains to help reduce system power.
- Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS-compliant, making it appropriate for a wide range of commercial applications.
Why Choose LFSC3GA15E-5FN256C?
The LFSC3GA15E-5FN256C delivers a practical balance of programmable logic, embedded memory, and I/O density in a compact 256-BGA package for commercial applications. Its combination of approximately 15,000 logic elements, roughly 1.05 Mbits of on-chip RAM, and 139 I/Os makes it well suited to mid-range designs that require on-chip data buffering, flexible interfacing, and consolidated system logic.
Engineers targeting space-constrained boards or designs that must minimize external components will find this device a suitable option for consolidating control, interface, and memory functions while keeping to commercial temperature and RoHS compliance requirements.
Request a quote or submit a pricing and availability inquiry to evaluate LFSC3GA15E-5FN256C for your next design.