LFSC3GA15E-5FN256C

IC FPGA 139 I/O 256FBGA
Part Description

SC Field Programmable Gate Array (FPGA) IC 139 1054720 15000 256-BGA

Quantity 132 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O139Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3750Number of Logic Elements/Cells15000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1054720

Overview of LFSC3GA15E-5FN256C – SC Field Programmable Gate Array (FPGA), approximately 15,000 logic elements, 139 I/Os, 256-BGA

The LFSC3GA15E-5FN256C is a Lattice SC family FPGA in a 256-ball BGA package designed for commercial-grade embedded and communications applications. The device combines approximately 15,000 logic elements with about 1.05 Mbits of on-chip RAM and 139 I/O pins, delivering a balanced mix of logic capacity, embedded memory, and system I/O for mid-range programmable designs.

With low-voltage core operation and surface-mount 256-FPBGA packaging, this part is intended for designers who need compact, high-density programmable logic with commercial operating range and RoHS compliance.

Key Features

  • Logic Capacity  Approximately 15,000 logic elements, providing multi-function programmable fabric for control, data processing, and glue-logic implementations.
  • Embedded Memory  Approximately 1.05 Mbits of on-chip RAM to support FIFOs, buffers, and local data storage for system-level tasks.
  • I/O Count and Flexibility  139 user I/Os accommodate dense peripheral and bus interfaces, sensor front-ends, and board-level signaling requirements.
  • Package and Mounting  256-FPBGA (17×17) surface-mount package for compact PCB footprint and high pin density.
  • Power Supply  Core voltage operation from 0.95 V to 1.26 V to match low-voltage system rails and reduce power dissipation in modern designs.
  • Operating Temperature and Grade  Commercial temperature range of 0 °C to 85 °C, suitable for a wide set of consumer and industrial-adjacent applications requiring commercial-grade components.
  • Regulatory Compliance  RoHS compliant for environmental and manufacturing process compatibility.
  • LatticeSC/M Family Capabilities  The LatticeSC/M family includes high-performance fabric, multi-megahertz clocking and memory resources—features that align with the platform used by this device series.

Typical Applications

  • Networking and Communications  Mid-range packet processing, protocol bridging, and interface adaptation where flexible logic and embedded memory accelerate data path functions.
  • Embedded Control  System control, state machines, and custom peripheral aggregation for instrumentation, test equipment, and embedded platforms.
  • Protocol and Interface Bridging  Implementing glue logic and protocol conversion between disparate buses and I/O standards using the device’s plentiful I/Os and on-chip RAM.
  • Memory-Intensive Functions  Local buffering, FIFO implementation, and data staging for sensors or streaming data applications leveraging the integrated RAM.

Unique Advantages

  • Balanced logic and memory: Combines roughly 15,000 logic elements with about 1.05 Mbits of embedded memory to support both control logic and data buffering on a single device.
  • High I/O density: 139 I/Os enable integration of multiple interfaces and peripherals without needing external glue chips, simplifying BOM and board layout.
  • Compact, manufacturable package: 256-FPBGA (17×17) surface-mount package supports compact PCB designs while providing high pin-count connectivity.
  • Low-voltage core operation: 0.95 V to 1.26 V supply range allows compatibility with modern low-voltage power domains to help reduce system power.
  • Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS-compliant, making it appropriate for a wide range of commercial applications.

Why Choose LFSC3GA15E-5FN256C?

The LFSC3GA15E-5FN256C delivers a practical balance of programmable logic, embedded memory, and I/O density in a compact 256-BGA package for commercial applications. Its combination of approximately 15,000 logic elements, roughly 1.05 Mbits of on-chip RAM, and 139 I/Os makes it well suited to mid-range designs that require on-chip data buffering, flexible interfacing, and consolidated system logic.

Engineers targeting space-constrained boards or designs that must minimize external components will find this device a suitable option for consolidating control, interface, and memory functions while keeping to commercial temperature and RoHS compliance requirements.

Request a quote or submit a pricing and availability inquiry to evaluate LFSC3GA15E-5FN256C for your next design.

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