LFSC3GA115E-6FCN1152I

The LFSC3GA115E-6FCN1152I is a high-capacity FPGA from Lattice Semiconductor’s LatticeSC/M family, packaged in a 1152‑FCBGA (35×35) surface-mount package. It provides a large programmable fabric and extensive I/O for demanding communication and system integration tasks.

Designed for applications that require dense logic, significant embedded memory and high-speed serial interfaces, this device targets networking, communications and industrial system designs where performance, integration and industrial temperature operation are important.

Key Features

• High-density logic — 115,000 logic elements (LUT4 equivalent) supporting complex logic and system integration.
• Memory capacity — Approximately 7.99 Mbits of embedded RAM to support large buffering, packet processing and on-chip data storage.
• Extensive I/O — 660 I/O pins enable broad connectivity for parallel interfaces, memory buses and board-level signaling.
• High-speed SERDES and flexiPCS — Family-level support for 4 to 32 SERDES channels with performance from 600 Mbps to 3.8 Gbps and embedded PCS options for common serial protocols.
• Advanced I/O standards — PURESPEED™ I/O supports differential and single-ended standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, LVDS variants, LVPECL and others for memory and high-speed link interfacing.
• Robust clocking — Family features include multi‑MHz PLLs and DLLs with primary clocks up to 700 MHz and I/O edge clocks to 1 GHz for high-performance timing.
• Industrial temperature range — Operating range from −40 °C to 105 °C for demanding environments.
• Power and packaging — Low-voltage core operation from 0.95 V to 1.26 V in a 1152‑FCBGA (35×35) package; RoHS compliant.

Typical Applications

• Network and communications equipment — Implement protocol processing, packet buffering and high-speed serial links using the device’s SERDES and embedded memory.
• Industrial automation and control — Integrate motor control logic, sensor aggregation and deterministic I/O handling within the industrial temperature rating.
• Data plane and interface bridging — Use the large logic capacity and wide I/O set for protocol bridging, data formatting and custom interface logic.
• High-bandwidth buffering and packet processing — Leverage approximately 7.99 Mbits of embedded RAM for packet queues, FIFOs and local data stores.

Unique Advantages

• Highly integrated platform: Combines large logic resources, substantial embedded memory and extensive I/O in a single 1152‑FCBGA package to reduce board-level complexity.
• Scalable serial connectivity: Family-level SERDES and flexiPCS support enables high-speed links for common communications protocols and disciplined jitter performance.
• Flexible I/O standards: Broad electrical standard support simplifies interface to a wide range of memories, transceivers and legacy logic families.
• Industrial-ready operation: Specified operation from −40 °C to 105 °C and RoHS compliance make the device suitable for harsh-environment systems.
• Low-voltage core: Operation at 0.95 V to 1.26 V supports modern power-optimized system designs.

Why Choose LFSC3GA115E-6FCN1152I?

The LFSC3GA115E-6FCN1152I provides a combination of large logic capacity, nearly 8 Mbits of embedded RAM and extensive I/O in a compact 1152‑FCBGA package, making it well suited for systems that require on-chip memory, dense logic and high-speed connectivity. Its clocking and SERDES capabilities support demanding timing and serial link requirements found in communications and industrial designs.

This device is a strong choice for engineers building scalable, integrated systems that need robust operation across industrial temperatures, a wide range of I/O standards and a compact, surface-mount package.

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