LFSC3GA115E-6FCN1152C

The LFSC3GA115E-6FCN1152C is a commercial‑grade SC‑family FPGA from Lattice Semiconductor. It delivers high logic density, large embedded memory and extensive I/O in a 1152‑ball FCBGA package for space‑constrained, high‑performance system designs.

Designed for communication and compute‑oriented applications, this device combines approximately 115,000 logic elements, roughly 7.99 Mbits of on‑chip RAM and 660 I/Os to address complex interfaces, memory‑intensive functions and high‑speed connectivity requirements.

Key Features

• Logic Capacity  Approximately 115,000 logic elements provide the fabric needed for large designs and advanced custom logic implementations.
• Embedded Memory  Total on‑chip RAM is 7,987,200 bits (approximately 7.99 Mbits) to support large buffers, FIFOs and memory‑intensive processing.
• I/O Density and Flexibility  660 I/Os in a single device support extensive peripheral and bus interfacing requirements.
• High‑Performance Family Features  SC/M family capabilities include four‑input LUT architecture up to 115K, high‑speed SERDES with embedded PCS, and a precision clocking network (family‑level features described in the SC/M data sheet).
• Power and Voltage  Supported core supply range is 0.95 V to 1.26 V, enabling low‑voltage system designs.
• Package and Mounting  1152‑FBGA (1152‑FCBGA 35×35) ball‑grid package, surface mount for compact board integration.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial environments.
• RoHS Compliant  Conforms to RoHS environmental requirements.

Typical Applications

• Network and Communications  Implements protocol processing, packet handling and interface bridging where high logic density and on‑chip memory are required.
• High‑Speed Interface Gateways  Supports designs requiring large numbers of I/Os and series family SERDES/PCS features for multi‑Gbps links.
• Memory‑Intensive Data Processing  On‑chip RAM and logic resources enable buffering, data path acceleration and custom memory controllers.
• Embedded System Integration  Acts as a central programmable fabric for combining multiple peripherals, custom state machines and system glue logic.

Unique Advantages

• High Logic Density: Approximately 115,000 logic elements let you implement complex functions and multiple subsystems in a single device, reducing part count.
• Significant On‑Chip Memory: Nearly 8 Mbits of embedded RAM minimize external memory dependence for latency‑sensitive buffering and data pipelines.
• Large I/O Count: 660 I/Os provide flexibility for wide buses, multiple peripherals and parallel interfaces without external multiplexing.
• Compact, High‑Pin Package: 1152‑FCBGA (35×35) delivers dense connectivity in a surface‑mount footprint suited to space‑conscious boards.
• Low‑Voltage Core Operation: 0.95 V–1.26 V supply range supports integration into modern low‑power system domains.
• Vendor Family Features: Access to SC/M family architecture characteristics—such as high‑performance LUTs, advanced clocking and SERDES/PCS capabilities—helps accelerate system design when leveraging family‑level IP and tools.

Why Choose LFSC3GA115E-6FCN1152C?

This LFSC3GA115E‑6FCN1152C FPGA is positioned for designs that need a high logic count, substantial embedded memory and broad I/O in a compact FCBGA package. Its commercial temperature rating and RoHS compliance make it suitable for mainstream communications, data handling and embedded applications where performance and integration reduce BOM complexity.

Engineers targeting scalable, memory‑heavy or interface‑rich systems will find the combination of logic resources, on‑chip RAM and I/O density beneficial for consolidating functions and accelerating time to market while relying on the SC family capabilities described in the vendor datasheet.

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