LFSC3GA115E-5FFN1152I

The LFSC3GA115E-5FFN1152I is a high-capacity SC-family FPGA from Lattice Semiconductor offered in a 1152-ball BGA package. It delivers a large programmable fabric with approximately 115,000 logic elements and extensive on-chip memory, designed for demanding industrial applications that require high I/O density and flexible SERDES connectivity.

This device targets communications, networking and high-performance embedded systems where integration, deterministic clocking and robust I/O are required. Key value propositions include high logic and memory capacity, advanced I/O and SERDES capabilities, and industrial-grade temperature support.

Key Features

• Programmable Fabric – Approximately 115,000 logic elements and support for four-input LUTs to implement complex custom logic.
• On-chip Memory – Approximately 7.99 Mbits of embedded RAM to support large buffering, FIFOs and memory-intensive functions.
• I/O Density – 660 I/Os providing broad external connectivity for high-pin-count designs.
• High-Speed SERDES and flexiPCS – Family-level support for 4 to 32 high-speed SERDES channels with performance up to multi-gigabit rates (600 Mbps to 3.8 Gbps) and embedded PCS options for protocols such as GbE, PCI Express and Fibre Channel.
• High-Performance I/O – PURESPEED™ I/O capability with support for differential and single-ended interfaces, programmable input delay and on-die termination options to help meet timing and signal-integrity requirements.
• Clocking and Timing – Multi-PLL/DLL clock resources including up to 700 MHz global clocks and 1 GHz edge clocks for low-jitter, high-frequency designs.
• Power and Supply – Core supply range documented at 0.95 V to 1.26 V to match system power architectures.
• Industrial Temperature – Rated for operation from −40 °C to 105 °C for deployment in industrial environments.
• Package and Mounting – 1152-ball BGA (1152-FPBGA, 35×35) in a surface-mount package suitable for high-density assemblies.
• Standards and System Support – Family-level features include on-chip PLLs, DLLs, MACO pre-engineered IP blocks, system bus architecture, and support for in-system configuration and boundary-scan for board-level debug and integration.
• RoHS Compliant – Device meets RoHS environmental compliance requirements.

Typical Applications

• High-speed Networking – Implement packet processing, protocol bridging and SERDES-based line interfaces where multi-gigabit links and large buffering are required.
• Communications Infrastructure – Use as a programmable dataplane or interface controller in switches, routers and transport equipment leveraging the device’s I/O density and embedded memory.
• Embedded Systems and Appliances – Integrate complex control logic, custom peripherals and memory-intensive functions in industrial control, instrumentation and automation systems.
• Storage and Fibre Channel Interfaces – Implement protocol-specific PCS/PMA and high-speed serialization for fibre channel and storage front-end applications.

Unique Advantages

• Large Logic Capacity: Approximately 115,000 logic elements enable dense implementation of complex functions and multi‑module designs.
• Substantial On‑Chip Memory: Approximately 7.99 Mbits of embedded RAM reduces external memory requirements and simplifies board design for buffering and packet storage.
• Extensive I/O and SERDES: 660 I/Os combined with family-level multi-gigabit SERDES support allow flexible interfacing to a wide range of peripherals and high-speed links.
• Robust Clocking: Multiple PLLs and DLLs with high-frequency, low-jitter clock domains support timing-critical designs and high-speed data paths.
• Industrial Temperature Range: Rated from −40 °C to 105 °C for reliable operation in industrial environments.
• High-density Packaging: 1152-ball BGA (35×35) lets you fit a large FPGA in a compact board footprint for space-constrained systems.

Why Choose LFSC3GA115E-5FFN1152I?

The LFSC3GA115E-5FFN1152I combines a very large programmable fabric with nearly 8 Mbits of embedded RAM, high I/O count and family-level high-speed SERDES and clocking resources—making it a strong choice for industrial and communications designs that demand integration and performance. Its industrial operating temperature range and RoHS compliance further support deployment in rugged or production environments.

Designers seeking a scalable, memory-rich FPGA platform with flexible I/O and multi-gigabit connectivity will find this device suitable for reducing external components, simplifying system architecture and accelerating time-to-market while maintaining rigorous operating-temp requirements.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the LFSC3GA115E-5FFN1152I.