LFSC3GA115E-5FCN1152I

The LFSC3GA115E-5FCN1152I is a high-density SC-family FPGA from Lattice Semiconductor designed for memory- and I/O-intensive system designs. It combines a large logic fabric with embedded block RAM, extensive I/O count and high-speed SERDES to address communications, networking and data-processing applications that require flexible interfacing and on-chip memory.

Key Features

• Core Logic  115,000 logic elements provide substantial routing and compute fabric for complex FPGA designs.
• Embedded Memory  Approximately 7.99 Mbits of on-chip RAM (sysMEM block RAM plus distributed RAM) for buffering, FIFOs and memory-intensive algorithms.
• High-Speed SERDES  Support for 4 to 32 high-speed SERDES channels with performance spanning 600 Mbps to 3.8 Gbps and embedded PCS functionality for common serial protocols.
• Extensive I/O  660 user I/Os with broad electrical standard support including LVCMOS (3.3 / 2.5 / 1.8 / 1.5 / 1.2), LVTTL, SSTL, HSTL, LVDS and others for flexible system interfacing.
• Advanced Clocking  Eight analog PLLs and 12 DLLs with support for primary clocks up to 700 MHz and I/O edge clocks to 1 GHz, enabling precise timing and high-speed data transfers.
• Programmable I/O Features  Per-pin programmable input delay, adaptive input logic and programmable on-die termination options to support robust interfacing and timing alignment.
• Packaging & Power  1152-FCBGA package (35x35) in a surface-mount form factor. Core supply voltage range: 0.95 V to 1.26 V.
• Industrial Temperature & Compliance  Operates from −40 °C to 105 °C and is RoHS compliant.
• System-Level Support  Includes IEEE 1149.1 boundary scan, IEEE 1532 in-system configuration support, onboard oscillator and embedded interfaces for system integration.

Typical Applications

• Network Infrastructure  High-speed SERDES and embedded PCS support make the device suitable for switches, routers and line cards requiring multi-gigabit serial links.
• Telecommunications Equipment  Large on-chip RAM and precise clocking are useful for packet buffering, protocol processing and timing-critical telecom functions.
• High-Density Data Processing  Large logic capacity and abundant I/O enable complex signal processing, packet inspection and custom compute accelerators.
• Interface Bridging and Aggregation  Flexible I/O standards and programmable termination allow the FPGA to act as a protocol bridge or aggregate multiple high-speed links.

Unique Advantages

• High integration density: Consolidates large logic capacity and nearly 8 Mbits of embedded memory on-chip, reducing external memory requirements and BOM complexity.
• Robust serial connectivity: Multi-channel SERDES with embedded PCS and broad protocol support simplifies integration of multi-gigabit links.
• Flexible I/O and timing control: Extensive I/O standards, programmable input delay and on-die termination provide deterministic interfacing across diverse subsystems.
• Comprehensive clocking resources: Multiple PLLs and DLLs with high-frequency support deliver fine-grained timing control for high-performance designs.
• Industrial-rated operation: Specified operation from −40 °C to 105 °C and RoHS compliance support deployment in industrial environments.
• System integration features: Boundary-scan, in-system configuration and onboard oscillator facilitate production test, configuration and system bring-up.

Why Choose LFSC3GA115E-5FCN1152I?

The LFSC3GA115E-5FCN1152I targets designs that demand a combination of high logic density, substantial on-chip memory and flexible high-speed I/O. Its large logic array and approximately 7.99 Mbits of embedded RAM support complex algorithms and buffering on a single device, while extensive SERDES and I/O standard support enable interfacing to a wide range of high-performance subsystems.

This device is suitable for engineers building communications, networking and data-processing equipment who need deterministic timing, multi-gigabit serial links, and industrial temperature operation in a compact FCBGA package.

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