LFMXO5-55T-9BBG400C

FPGA MACHXO5T-NX W/FLASH 400BGA
Part Description

MachXO5-NX Field Programmable Gate Array (FPGA) IC 298 6008832 53000 400-LFBGA

Quantity 1,166 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case400-LFBGANumber of I/O298Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6625Number of Logic Elements/Cells53000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits6008832

Overview of LFMXO5-55T-9BBG400C – MachXO5-NX FPGA, 53,000 logic elements, 298 I/O, 400‑LFBGA

The LFMXO5-55T-9BBG400C is a MachXO5-NX family field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It provides a fabric of 53,000 logic elements (LEs) organized across 6,625 CLBs, plus substantial on-chip memory and a high I/O count for complex glue logic and system integration tasks.

Key hardware attributes include approximately 6.0 Mbits of embedded RAM, 298 user I/O pins, a compact 400‑LFBGA (400‑CABGA, 17×17) package for surface-mount assembly, and a core supply operating range of 0.95 V to 1.05 V. The device is specified for commercial temperature operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

  • Core and Logic 53,000 logic elements arranged across 6,625 CLBs to implement complex digital functions and glue logic.
  • Embedded Memory Approximately 6.0 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory for many use cases.
  • High I/O Count 298 user I/O pins suitable for multi‑interface designs and high‑pin‑count peripheral connectivity.
  • Package and Mounting 400‑LFBGA package (supplier device package: 400‑CABGA, 17×17) designed for surface‑mount PCB assembly in compact board layouts.
  • Power Supply Core supply operational range of 0.95 V to 1.05 V, enabling designs that adhere to the device’s specified voltage window.
  • Temperature and Grade Commercial grade device rated for 0 °C to 85 °C operation.
  • Environmental Compliance RoHS compliant for environmental and regulatory alignment in a wide range of commercial products.

Typical Applications

  • Interface Bridging and Glue Logic Use the device’s high logic density and 298 I/Os to implement protocol bridging, bus interfacing, and custom glue logic between subsystems.
  • Embedded Control and Sequencing Implement control state machines, peripheral control, and sequencing functions using the available CLBs and on‑chip RAM.
  • Prototyping and Development Leverage the MachXO5‑NX family architecture and on‑chip resources for prototype platforms that require reprogrammable logic and significant I/O.

Unique Advantages

  • High Logic Capacity: 53,000 logic elements across 6,625 CLBs offer ample programmable fabric for medium‑to‑large logic designs without requiring external ASICs.
  • Substantial On‑Chip Memory: Approximately 6.0 Mbits of embedded RAM reduces dependence on external memory for many buffering and data‑storage needs.
  • Extensive I/O Availability: 298 user I/O pins accommodate multi‑interface designs and simplify board‑level routing for complex systems.
  • Compact, Production‑Ready Packaging: 400‑LFBGA (400‑CABGA, 17×17) supports high‑density PCB designs and surface‑mount manufacturing processes.
  • Commercial Temperature Coverage: Specified operation from 0 °C to 85 °C to meet a wide range of commercial product requirements.
  • Regulatory Alignment: RoHS compliance facilitates integration into products targeting markets with environmental restrictions.

Why Choose LFMXO5-55T-9BBG400C?

The LFMXO5-55T-9BBG400C positions itself as a capable MachXO5‑NX FPGA option for designs that require substantial logic resources, embedded memory, and a high count of user I/Os in a compact, surface‑mount package. Its commercial temperature rating and RoHS compliance make it suitable for a broad range of commercial applications where reprogrammable logic, board‑level integration, and moderate environmental tolerance are required.

Engineers designing system glue logic, interface bridges, or embedded control functions will find the combination of 53,000 logic elements, approximately 6.0 Mbits of RAM, and 298 I/Os advantageous for reducing external components and consolidating functionality on a single device.

Request a quote or submit a product inquiry to obtain pricing, availability, and additional technical information for the LFMXO5-55T-9BBG400C.

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