LFMXO5-55T-8BBG400I
| Part Description |
MachXO5-NX Field Programmable Gate Array (FPGA) IC 298 6008832 53000 400-LFBGA |
|---|---|
| Quantity | 124 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 298 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6625 | Number of Logic Elements/Cells | 53000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6008832 |
Overview of LFMXO5-55T-8BBG400I – MachXO5-NX Field Programmable Gate Array (FPGA) IC 298 6008832 53000 400-LFBGA
The LFMXO5-55T-8BBG400I is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation that delivers a balanced combination of logic capacity, embedded memory and I/O density. It provides 53,000 logic elements, approximately 6 Mbits of embedded memory, and up to 298 general-purpose I/Os in a 400-ball LFBGA package for industrial applications.
Designed for surface-mount implementation, this device operates over a 0.95 V to 1.05 V core supply range and is specified for industrial temperature operation from -40 °C to 100 °C.
Key Features
- Logic capacity 53,000 logic elements suitable for mid- to high-density logic integration.
- On-chip memory Approximately 6 Mbits of embedded memory for buffering, lookup tables and state storage.
- I/O density Up to 298 I/O pins to support a wide range of external interfaces and parallel connections.
- Power Core voltage supply range of 0.95 V to 1.05 V to match system power requirements.
- Package and mounting 400-LFBGA (supplier package: 400-CABGA, 17 × 17 mm) in a surface-mount form factor for compact board-level integration.
- Industrial temperature range Specified for operation from -40 °C to 100 °C, suitable for industrial environments.
- Environmental compliance RoHS compliant to meet common environmental and manufacturing requirements.
Unique Advantages
- High integration density: 53,000 logic elements and substantial on-chip memory reduce the need for external logic and memory components.
- Flexible I/O resources: 298 I/Os provide headroom for complex interfacing and parallel connectivity without immediate expansion hardware.
- Compact surface-mount package: 400-LFBGA (17 × 17 mm) enables space-efficient board designs while supporting high pin counts.
- Industrial-grade operation: Rated for -40 °C to 100 °C, supporting deployment in temperature-challenging environments.
- Low-voltage core operation: 0.95 V to 1.05 V core supply range for compatibility with modern low-voltage power systems.
- Regulatory readiness: RoHS compliance for environmental and manufacturing standards.
Why Choose LFMXO5-55T-8BBG400I?
The LFMXO5-55T-8BBG400I positions itself as a versatile FPGA option for industrial designs that require substantial logic resources, significant embedded memory and a high count of I/Os in a compact BGA package. Its specification set—53,000 logic elements, approximately 6 Mbits of on-chip RAM, 298 I/Os, and industrial temperature rating—addresses designs that need a balance of capacity, connectivity and environmental robustness.
Engineers selecting this device benefit from a combination of integration and specification-driven reliability, making it suitable for systems where board space, I/O density and temperature tolerance are key considerations.
Request a quote or submit a purchase inquiry to get pricing and lead-time information for the LFMXO5-55T-8BBG400I.
