LFSC3GA115E-5FCN1152C

The LFSC3GA115E-5FCN1152C is a Lattice Semiconductor SC-series FPGA in a 1152-FCBGA package that delivers a high-density programmable fabric for complex logic, memory and I/O integration. Designed for commercial-grade embedded systems, this device targets applications that require large logic capacity, extensive I/O and substantial on-chip memory while operating at low core voltages.

Built on the Lattice SC/M family architecture, the device pairs a large number of logic elements with substantial embedded RAM and a broad I/O count to support communications, networking and advanced system integration tasks.

Key Features

• Logic Capacity  115,000 logic elements (four-input LUT4 equivalent) for implementing complex control, signal processing and custom logic functions.
• Embedded Memory  Approximately 7.99 Mbits of on-chip RAM (7,987,200 total RAM bits) to support large buffers, FIFOs and memory-intensive designs.
• I/O Density  660 user I/Os to support wide parallel buses, high-pin-count interfaces and dense peripheral connectivity.
• Family High‑Speed I/O Options  The SC/M family includes high-speed SERDES and flexiPCS capabilities (family-level feature) for multi‑Gbps serial links and protocol support as described in the SC/M data sheet.
• Clocking and Timing  SC/M family architecture provides extensive clock management features including multiple PLLs and DLLs for clock multiplication, division and phase control (family-level features).
• Power and Voltage  Core supply operation from 0.95 V to 1.26 V to meet low-voltage system requirements; device is surface-mount compatible.
• Package  1152-FCBGA (35×35) package suitable for high-pin-count board designs and automated assembly.
• Operating Range & Compliance  Commercial temperature grade with an operating range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Communications & Networking  Implement protocol engines, packet processing and buffering using the large logic array and nearly 8 Mbits of embedded RAM.
• High‑Performance Embedded Systems  Offload compute-intensive tasks and custom accelerators into the FPGA fabric while using abundant I/O for sensor and peripheral aggregation.
• Data Aggregation & Interface Bridging  Support wide parallel interfaces and multiple serial links—use the dense I/O and family SERDES capabilities for bridging and aggregation tasks.
• Memory‑Intensive Logic  Use on-chip RAM for large FIFOs, packet queues and buffering in real-time applications.

Unique Advantages

• High logic density: 115,000 logic elements enable complex, high-function-count designs without external FPGA fabrics.
• Substantial on-chip memory: Approximately 7.99 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Extensive I/O resources: 660 I/Os provide flexibility for wide buses, multiple peripherals and simultaneous interface support.
• Low-voltage core operation: 0.95 V to 1.26 V supply range supports low-power system architectures and modern power rails.
• Commercial-grade readiness: 0 °C to 85 °C operating range and RoHS compliance align the device with mainstream embedded product requirements.
• High-pin-count packaging: 1152-FCBGA (35×35) package supports dense system routing and automated assembly processes.

Why Choose LFSC3GA115E-5FCN1152C?

The LFSC3GA115E-5FCN1152C delivers a balance of large logic capacity, near 8 Mbits of embedded RAM and a high I/O count in a compact 1152-FCBGA package. It is well suited for commercial embedded designs that need substantial on-chip resources for protocol processing, buffering and custom acceleration while operating on low core voltages.

This device is appropriate for engineering teams building scalable systems that require tight integration of logic, memory and I/O—providing a platform that leverages the Lattice SC/M family architecture for system-level functionality and configuration flexibility.

Request a quote or submit a request for pricing and availability to include the LFSC3GA115E-5FCN1152C in your next design.