LFSC3GA115E-5FFN1152C

The LFSC3GA115E-5FFN1152C is a Lattice Semiconductor SC-family FPGA offering high logic capacity and extensive I/O in a 1152-ball BGA package. It combines a high-performance FPGA fabric with large on-chip memory and family-level support for high-speed serial interfaces and advanced clocking resources.

This device is designed for commercial-temperature applications that require substantial logic density, broad I/O connectivity, and flexible power operation between 0.95 V and 1.26 V. Typical uses include communication and networking systems, high-speed interface bridging, and complex embedded logic integration.

Key Features

• Core / Logic Density 115,000 logic elements providing large programmable fabric for complex designs.
• High I/O Count 660 general-purpose I/Os to support wide parallel interfaces and mixed-signal connectivity.
• High-Speed Serial Capability (family-level) Lattice SC family support for 4 to 32 high-speed SERDES with embedded flexiPCS™ for standards such as GbE, XAUI, PCI Express, SONET and Serial RapidIO.
• Embedded Memory Approximately 7.9872 Mbits of on-chip RAM for packet buffers, frame stores and large FIFOs.
• Advanced Clocking (family-level) Multiple PLLs and DLLs with primary clocks up to 700 MHz and I/O edge clocks to 1 GHz for demanding timing and interface requirements.
• I/O Standards (family-level) Supports a broad set of electrical standards including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI/PCI-X, LVDS variants, LVPECL and RSDS for flexible system interfacing.
• Package & Mounting 1152-BBGA (supplier package 1152-FPBGA, 35 × 35 mm), surface-mount configuration for compact system integration.
• Power & Temperature Device supply range 0.95 V to 1.26 V and commercial operating temperature 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Networking & Telecom — Implements packet processing, protocol bridging and high-speed links using the family’s SERDES and embedded PCS IP for standards such as GbE, XAUI, PCI Express, SONET and Serial RapidIO.
• High-Speed Interface Bridging — Acts as a protocol adapter or interface controller for DDR and multi-gigabit differential links, leveraging high-performance I/O and programmable input delay for timing alignment.
• Embedded Systems & Acceleration — Uses large on-chip RAM and dense logic to implement buffering, lookup tables and custom acceleration blocks in communications and data-path applications.
• Custom Logic and Prototyping — Provides a high-density platform for designers building complex state machines, controllers and mixed I/O subsystems in a compact BGA footprint.

Unique Advantages

• High logic capacity: 115,000 logic elements enable implementation of large, integrated designs on a single device, reducing external component count.
• Broad I/O resources: 660 general-purpose I/Os accommodate wide parallel buses and multiple peripheral interfaces without immediate need for external expanders.
• Substantial on-chip memory: Nearly 8 Mbits of embedded RAM provides native storage for FIFOs, buffers and packet data, simplifying system memory architecture.
• Family-level high-speed serial support: SC-family SERDES and flexiPCS options enable deployment of common communications protocols with pre-engineered PCS implementations.
• Flexible clocking: Rich PLL/DLL resources and high-frequency clocking options from the family-level architecture support precise timing and high-throughput designs.
• Compact, production-ready package: 1152-BBGA (35 × 35 mm) surface-mount package and RoHS compliance support standard manufacturing flows for commercial products.

Why Choose LFSC3GA115E-5FFN1152C?

This FPGA balances very high logic density with extensive I/O and substantial embedded memory, making it a strong choice for commercial communication, networking, and high-performance embedded applications that require integrated serial interfaces and flexible clocking. Its 1152-ball BGA package and surface-mount mounting make it suitable for space-conscious board designs.

Designed within the Lattice SC family, this device offers a path to scale between different device sizes in the same architecture while maintaining access to family-level SERDES, memory and clocking features—providing design continuity and long-term platform flexibility for development teams and system integrators.

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