LFSC3GA115E-6FFN1152I

The LFSC3GA115E-6FFN1152I is an industrial‑grade SC family FPGA in a 1152‑ball BGA package designed for high‑performance, memory‑intensive and high‑I/O applications. It combines a large programmable fabric with substantial on‑chip memory and extensive I/O to address demanding communication, networking and embedded processing tasks.

Built for integration and scalability, this device provides a wide operating temperature range and a low core voltage window, enabling deployment in industrial environments where robust operation and high data throughput are required.

Key Features

• Programmable Fabric — Approximately 115,000 logic elements for implementing complex logic, state machines and custom processing pipelines.
• Embedded Memory — Approximately 7.99 Mbits of on‑chip embedded memory to support large buffers, FIFOs and memory‑intensive designs.
• High I/O Count — 660 user I/Os providing dense external connectivity for peripherals, memories and high‑speed transceivers.
• High‑Speed SERDES and flexiPCS (family feature) — Family supports 4 to 32 high‑speed SERDES with performance up to 3.8 Gbps and built‑in PCS functionality for standards‑oriented link implementations; typical SERDES channel power quoted in the family datasheet is ≈105 mW per channel.
• Advanced I/O Performance — PURESPEED™ I/O performance up to 2 Gbps DDR and support for multiple electrical standards as described in the family datasheet, plus programmable on‑die termination and per‑pin input delay alignment features in the family architecture.
• Clocking and Timing — Family features include high‑performance clocking with up to 700 MHz global clocks and 1 GHz edge clocks, multiple PLLs/DLLs and dynamic clock control for high‑frequency designs.
• Power and Supply — Core supply range of 0.95 V to 1.26 V to match system power rails and optimize power/performance tradeoffs.
• Package and Mounting — 1152‑BBGA (1152‑FPBGA, 35 × 35 mm) surface‑mount package suited to high‑pin‑count, high‑density board designs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 105 °C for use in industrial environments.
• Standards and System Support (family) — Family datasheet documents system features such as IEEE 1149.1 boundary scan and IEEE 1532 in‑system configuration support, plus on‑chip system resources referenced in the family documentation.
• RoHS Compliant — Device is RoHS compliant.

Typical Applications

• Communication and Networking Equipment — Implements packet processing, protocol conversion and high‑speed SERDES interfaces for network line cards and backhaul equipment.
• High‑Performance Embedded Systems — Hosts custom accelerators, preprocessing engines and bridging logic where large logic capacity and on‑chip memory reduce external memory dependence.
• Data Transport and Storage Interfaces — Provides dense I/O and high‑speed serial connectivity for storage controllers, fabrics and interconnect bridges.
• Memory‑Intensive Processing — Suitable for designs requiring substantial on‑chip buffering and FIFO logic for streaming data, DSP front‑ends or packet buffering.

Unique Advantages

• Highly integrated programmable fabric: Large logic element count and significant embedded memory enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Extensive I/O and high‑speed links: 660 I/Os combined with family‑level high‑speed SERDES and PURESPEED I/O capabilities provide flexibility for diverse interface requirements and high data‑rate connectivity.
• Industrial reliability: Rated −40 °C to 105 °C and RoHS compliant, making the device suitable for demanding industrial applications.
• Flexible power options: Core supply range of 0.95–1.26 V supports integration into modern low‑voltage systems and power‑optimized designs.
• Comprehensive clocking and timing resources: High‑frequency clocking and multiple PLL/DLL resources from the family architecture simplify implementation of timing‑sensitive designs.
• System configuration and debug support (family): Family documentation describes boundary scan and in‑system configuration features to aid development and manufacturing test.

Why Choose LFSC3GA115E-6FFN1152I?

The LFSC3GA115E-6FFN1152I positions itself as a high‑capacity, memory‑rich FPGA option for engineers designing communication, networking and high‑performance embedded systems. With roughly 115,000 logic elements, nearly 8 Mbits of embedded memory and 660 I/Os in a 1152‑BBGA package, it enables consolidation of complex subsystems while maintaining the I/O density and memory bandwidth needed for demanding applications.

Its industrial temperature rating and flexible supply range make it suitable for deployed systems that require robustness and long‑term scalability. Use this device where a combination of logic capacity, embedded memory and high‑speed I/O is required to simplify system architecture and accelerate time to market.

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