LFSC3GA15E-6F256C

The LFSC3GA15E-6F256C is a Lattice SC family FPGA in a 256‑BGA (256‑FPBGA, 17×17) surface-mount package. It integrates approximately 15,000 logic elements and about 1.05 Mbits of on-chip RAM with 139 I/O pins, targeting high-performance embedded and communications-oriented designs. Voltage operation is specified from 0.95 V to 1.26 V with commercial temperature rating (0 °C to 85 °C) and RoHS compliance.

Key Features

• FPGA Core  Approximately 15,000 logic elements (LUT-based architecture) suitable for mid-density logic integration and custom digital processing.
• On‑chip Memory  Approximately 1.05 Mbits of embedded RAM for block and distributed memory needs, supporting data buffering and on‑chip storage.
• I/O Density & Package  139 I/O pins in a 256‑BGA (256‑FPBGA, 17×17) surface-mount package, enabling dense board-level interfaces and compact implementations.
• Power and Temperature  Core supply range of 0.95 V to 1.26 V with commercial operating temperature from 0 °C to 85 °C.
• Family-Level Connectivity & Performance  SC family devices include high-performance fabric and SERDES options, high-speed I/O standards, and advanced clocking networks (as described in the SC family datasheet).
• Regulatory  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Network & Communications Modules  Implements protocol processing, packet handling, and interface bridging where mid-density logic and on-chip memory are required.
• Embedded System Integration  Custom control logic, peripheral aggregation, and real‑time signal processing in space-constrained, surface-mount designs.
• High‑Speed I/O Interfaces  Suitable for designs requiring multiple I/Os and on-chip buffering for memory interfaces, serializers/deserializers, or interface conversion.
• Prototyping & Product Development  Used to validate algorithms and integrate IP in a compact package for commercial-grade embedded products.

Unique Advantages

• Mid-density integration: Approximately 15,000 logic elements balance capability and cost for designs that need significant logic without high-end device overhead.
• On‑chip memory capacity: Around 1.05 Mbits of embedded RAM enables local buffering and reduces external memory requirements in many applications.
• High I/O count in compact package: 139 I/Os delivered in a 256‑BGA (17×17) footprint simplifies board integration while preserving interface flexibility.
• Commercial temperature and RoHS compliance: Designed for commercial operating environments with RoHS-compliant materials for standard manufacturing processes.
• Surface-mount assembly: 256‑BGA (FPBGA) package supports modern SMT production and dense PCB layouts.

Why Choose LFSC3GA15E-6F256C?

The LFSC3GA15E-6F256C positions itself as a versatile mid-density FPGA solution for commercial embedded and communications applications. Its combination of approximately 15,000 logic elements, roughly 1.05 Mbits of embedded memory, and 139 I/Os in a compact 256‑BGA package provides a practical balance of performance, integration, and board-level density.

This device is well suited for teams developing network interfaces, custom controllers, and embedded systems that require reliable commercial-grade operation, flexible I/O, and on-chip RAM for buffering and state storage. The SC family feature set described in the datasheet supports advanced clocking, SERDES and high-performance I/O standards, delivering a scalable platform for product development and deployment.

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