LFSC3GA15E-7F900C

The LFSC3GA15E-7F900C is a field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial-temperature embedded applications. It combines up to 15,000 logic elements with approximately 1.05 Mbits of on-chip RAM and a high I/O count to address mid-range programmable logic requirements.

With a 900-ball BGA package and surface-mount mounting, this device targets compact, board-level designs that require significant logic density, embedded memory, and abundant external connectivity while operating from a low-voltage core supply.

Key Features

• Core / Logic Provides 15,000 logic elements to implement moderate to complex programmable logic functions within a single device.
• Embedded Memory Approximately 1.05 Mbits of total on-chip RAM for data buffering, state storage, and glue-logic memory needs.
• I/O Density Up to 300 device I/O pins, enabling extensive peripheral interfacing and flexible board-level connectivity.
• Power Core supply voltage range of 0.95 V to 1.26 V for low-voltage operation and system-level power planning.
• Package & Mounting 900-ball FPBGA package (900-BBGA, 31 × 31 mm) in a surface-mount form factor suitable for high-pin-count, space-efficient layouts.
• Temperature Range Commercial operating temperature from 0 °C to 85 °C for general-purpose embedded applications.
• Environmental Compliance RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Commercial Embedded Systems — Implements control logic, protocol bridging, and customization in commercial electronics operating within 0 °C to 85 °C.
• I/O-Intensive Control Systems — Leverages 300 I/O pins for sensor arrays, user interfaces, or multi-channel peripheral connectivity.
• Memory-Dependent Logic — Uses approximately 1.05 Mbits of embedded memory for buffering, lookup tables, and state machines in logic-heavy designs.
• Compact, High-Pin-Count Boards — The 900-FPBGA (31 × 31 mm) package supports dense PCB layouts where board space and pin count are critical.

Unique Advantages

• High Logic Capacity: 15,000 logic elements enable implementation of moderately complex digital systems without multiple devices.
• Significant On-Chip Memory: Approximately 1.05 Mbits of embedded RAM reduces dependence on external memory for many applications.
• Extensive I/O: 300 I/O pins provide flexibility for interfacing with numerous peripherals and external devices.
• Compact High-Pin-Count Package: 900-BBGA (900-FPBGA, 31 × 31 mm) balances pin availability with a space-efficient footprint.
• Low-Voltage Core Operation: 0.95 V to 1.26 V core supply supports power-conscious designs and system-level power budgeting.
• RoHS Compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose LFSC3GA15E-7F900C?

The LFSC3GA15E-7F900C delivers a balanced combination of logic capacity, embedded memory, and high I/O count in a compact 900-BBGA package from Lattice Semiconductor Corporation. Its specifications are well suited to commercial embedded designs that require substantial programmable logic, on-chip RAM, and extensive external connectivity within a low-voltage power envelope.

This device is ideal for engineering teams building mid-range programmable logic solutions where board space, I/O density, and integrated memory are important considerations. RoHS compliance and a defined commercial operating range make it a practical choice for production-focused applications in commercial markets.

Request a quote or submit a procurement inquiry to receive pricing and availability for the LFSC3GA15E-7F900C.