LFSC3GA25E-5F900C

The LFSC3GA25E-5F900C is a commercial-grade SC-family FPGA from Lattice Semiconductor Corporation, packaged in a 900-ball FBGA (31 × 31 mm). It combines a high-performance FPGA fabric with extensive I/O and embedded memory to address mid- to high-density programmable logic applications.

This device is suited for designs that require up to 378 I/O pins, approximately 25,000 logic elements, and nearly 1.97 Mbits of on-chip RAM, while operating within a 0.95 V to 1.26 V supply range and a 0 °C to 85 °C ambient temperature window.

Key Features

• FPGA Fabric  Approximately 25,000 logic elements provide the programmable resources needed for custom logic, control, and interface functions.
• Embedded Memory  Approximately 1.97 Mbits of on-chip RAM (1966080 bits) for block and distributed memory requirements.
• I/O Capacity  378 I/O pins in a 900-ball FBGA package enable high pin-count interfaces and dense board integration.
• High‑Performance I/O and SERDES (family-level)  Family datasheet documents support for high-speed SERDES and PURESPEED™ I/O technology, enabling multi-gigabit links and advanced electrical standards (see family datasheet for full details).
• Clocking Resources (family-level)  Extensive sysCLOCK™ network including multiple PLLs and DLLs as described in the family datasheet to support high-frequency global and edge clocks.
• Power and Mounting  Operates from 0.95 V to 1.26 V and is supplied in a 900-FPBGA (31 × 31 mm) surface-mount package suitable for automated assembly.
• Commercial Grade and Compliance  Commercial operating grade with RoHS compliance for lead-free manufacturing.

Typical Applications

• High‑speed communications  Leverage the device’s high I/O count and family-level SERDES/I/O features for protocol bridging, line cards, and interface aggregation.
• Networking and switching  Use the FPGA fabric and embedded memory for packet processing, buffering, and custom switching logic.
• Custom embedded processing  Implement control logic, peripheral interfaces, and application-specific accelerators using the device’s logic elements and on-chip RAM.
• Storage and data paths  Deploy the device where moderate embedded memory and dense I/O are needed for data-path management and protocol handling.

Unique Advantages

• Balanced integration:  A combination of approximately 25,000 logic elements, ~1.97 Mbits of embedded RAM, and 378 I/Os reduces the need for external components and simplifies board-level design.
• Compact, board-ready package:  900-FPBGA (31 × 31 mm) surface-mount packaging supports high-density layouts and automated assembly processes.
• Flexible power envelope:  Supported supply range of 0.95 V to 1.26 V enables designs targeting modern low-voltage architectures.
• Commercial availability and compliance:  Commercial grade operation with RoHS compliance for mainstream electronics production.
• Family-level system features:  Access to the Lattice SC/M family’s clocking, SERDES, and memory architectures for scalable system-level designs (refer to family datasheet for details).

Why Choose LFSC3GA25E-5F900C?

The LFSC3GA25E-5F900C positions itself as a versatile mid-density FPGA option for designers who need a balance of logic capacity, embedded memory, and high I/O in a compact FBGA package. Its specification set—approximately 25,000 logic elements, roughly 1.97 Mbits of on-chip RAM, 378 I/Os, and a commercial operating range—makes it appropriate for communication, networking, storage, and custom embedded applications.

Choosing this Lattice SC-family device provides access to the family’s documented clocking, I/O and SERDES capabilities, delivering a scalable platform for systems that require programmable logic with integrated memory and robust interface support.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for LFSC3GA25E-5F900C.