LFSC3GA15E-6FN256C
| Part Description |
SC Field Programmable Gate Array (FPGA) IC 139 1054720 15000 256-BGA |
|---|---|
| Quantity | 259 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 139 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3750 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1054720 |
Overview of LFSC3GA15E-6FN256C – SC Field Programmable Gate Array (FPGA) IC 139 1054720 15000 256-BGA
The LFSC3GA15E-6FN256C is a commercial-grade FPGA from the Lattice SC family, delivered in a 256-ball FPBGA (17×17) surface-mount package. The device combines a high-density logic fabric with substantial on-chip memory and a large I/O count, making it suitable for communication, embedded processing, and interface-bridging designs that require moderate logic capacity and integrated memory.
Built on the LatticeSC architecture, the device provides 15,000 logic elements, approximately 1.05 Mbits of embedded RAM, and 139 I/O pins at a supply range of 0.95 V to 1.26 V. It is RoHS compliant and specified for commercial operating temperatures (0 °C to 85 °C).
Key Features
- Logic Capacity 15,000 logic elements for mid-range combinational and sequential logic integration.
- Embedded Memory Approximately 1.05 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage without external memory.
- I/O Count and Package 139 I/Os in a 256-ball FPBGA (17×17) package; surface-mount mounting for compact board designs.
- Voltage and Temperature Core supply range of 0.95 V to 1.26 V and commercial operating range of 0 °C to 85 °C.
- Family-Level High-Speed Interfaces Built on the LatticeSC family architecture that includes high-performance I/O and SERDES capabilities, enabling high-speed serial and parallel interface implementations (family-level feature).
- Clocking and Timing Resources Family architecture includes multiple PLLs and DLLs and a precision clock network for high-frequency clocking (family-level feature).
- Standards and Compliance RoHS compliant; commercial-grade classification for general-purpose electronics and embedded applications.
Typical Applications
- Networking & Communications Implement mid-density protocol bridging, packet handling, or interface conversion using integrated logic, memory, and family-level high-speed I/O capabilities.
- Embedded Processing Offload control and preprocessing tasks with on-chip memory and 15,000 logic elements to reduce external components and simplify board-level design.
- High-Density I/O Control Manage complex parallel and serial I/O requirements—139 user I/Os enable sensor interfaces, peripheral control, and custom bus implementations.
- Memory-Intensive Logic Use the approximately 1.05 Mbits of embedded RAM for buffering, FIFOs, and data path storage in streaming or packetized systems.
Unique Advantages
- Balanced Integration: A combination of 15,000 logic elements and ~1.05 Mbits of embedded RAM reduces the need for external logic and memory, lowering BOM and board complexity.
- Compact, Surface-Mount Package: 256-FPBGA (17×17) provides a high pin-count footprint in a compact form factor for space-constrained designs.
- Flexible I/O Count: 139 I/Os enable a wide range of parallel and serial interfaces without excessive external multiplexing.
- Commercial Temperature Rating: Specified 0 °C to 85 °C operation for mainstream electronic and embedded applications.
- Controlled Power Domain: Core supply range of 0.95 V to 1.26 V for integration with low-voltage power architectures.
- RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.
Why Choose LFSC3GA15E-6FN256C?
LFSC3GA15E-6FN256C is positioned for engineers who need a compact, mid-capacity FPGA that combines substantial on-chip memory, a sizable I/O complement, and the LatticeSC family architecture. Its 15,000 logic elements and approximately 1.05 Mbits of embedded RAM make it a practical choice for communication interfaces, embedded control, and data buffering tasks where reducing external components and conserving PCB area matter.
Designed as a commercial-grade device in a 256-FPBGA package, it delivers a clear specification set—logic capacity, memory, I/O count, supply voltage, and operating temperature—that supports predictable design and procurement decisions. The device’s placement within the LatticeSC family also aligns it with family-level clocking, I/O, and SERDES capabilities for designers who may want to scale or reuse architecture concepts across projects.
Request a quote or submit an RFQ to receive pricing and availability for LFSC3GA15E-6FN256C. Our team can assist with lead times, packaging options, and volume pricing to support your design and production needs.

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Headquarters: Hillsboro, Oregon, USA
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