LFSC3GA15E-6FN256C

IC FPGA 139 I/O 256FBGA
Part Description

SC Field Programmable Gate Array (FPGA) IC 139 1054720 15000 256-BGA

Quantity 259 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O139Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3750Number of Logic Elements/Cells15000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1054720

Overview of LFSC3GA15E-6FN256C – SC Field Programmable Gate Array (FPGA) IC 139 1054720 15000 256-BGA

The LFSC3GA15E-6FN256C is a commercial-grade FPGA from the Lattice SC family, delivered in a 256-ball FPBGA (17×17) surface-mount package. The device combines a high-density logic fabric with substantial on-chip memory and a large I/O count, making it suitable for communication, embedded processing, and interface-bridging designs that require moderate logic capacity and integrated memory.

Built on the LatticeSC architecture, the device provides 15,000 logic elements, approximately 1.05 Mbits of embedded RAM, and 139 I/O pins at a supply range of 0.95 V to 1.26 V. It is RoHS compliant and specified for commercial operating temperatures (0 °C to 85 °C).

Key Features

  • Logic Capacity 15,000 logic elements for mid-range combinational and sequential logic integration.
  • Embedded Memory Approximately 1.05 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage without external memory.
  • I/O Count and Package 139 I/Os in a 256-ball FPBGA (17×17) package; surface-mount mounting for compact board designs.
  • Voltage and Temperature Core supply range of 0.95 V to 1.26 V and commercial operating range of 0 °C to 85 °C.
  • Family-Level High-Speed Interfaces Built on the LatticeSC family architecture that includes high-performance I/O and SERDES capabilities, enabling high-speed serial and parallel interface implementations (family-level feature).
  • Clocking and Timing Resources Family architecture includes multiple PLLs and DLLs and a precision clock network for high-frequency clocking (family-level feature).
  • Standards and Compliance RoHS compliant; commercial-grade classification for general-purpose electronics and embedded applications.

Typical Applications

  • Networking & Communications Implement mid-density protocol bridging, packet handling, or interface conversion using integrated logic, memory, and family-level high-speed I/O capabilities.
  • Embedded Processing Offload control and preprocessing tasks with on-chip memory and 15,000 logic elements to reduce external components and simplify board-level design.
  • High-Density I/O Control Manage complex parallel and serial I/O requirements—139 user I/Os enable sensor interfaces, peripheral control, and custom bus implementations.
  • Memory-Intensive Logic Use the approximately 1.05 Mbits of embedded RAM for buffering, FIFOs, and data path storage in streaming or packetized systems.

Unique Advantages

  • Balanced Integration: A combination of 15,000 logic elements and ~1.05 Mbits of embedded RAM reduces the need for external logic and memory, lowering BOM and board complexity.
  • Compact, Surface-Mount Package: 256-FPBGA (17×17) provides a high pin-count footprint in a compact form factor for space-constrained designs.
  • Flexible I/O Count: 139 I/Os enable a wide range of parallel and serial interfaces without excessive external multiplexing.
  • Commercial Temperature Rating: Specified 0 °C to 85 °C operation for mainstream electronic and embedded applications.
  • Controlled Power Domain: Core supply range of 0.95 V to 1.26 V for integration with low-voltage power architectures.
  • RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose LFSC3GA15E-6FN256C?

LFSC3GA15E-6FN256C is positioned for engineers who need a compact, mid-capacity FPGA that combines substantial on-chip memory, a sizable I/O complement, and the LatticeSC family architecture. Its 15,000 logic elements and approximately 1.05 Mbits of embedded RAM make it a practical choice for communication interfaces, embedded control, and data buffering tasks where reducing external components and conserving PCB area matter.

Designed as a commercial-grade device in a 256-FPBGA package, it delivers a clear specification set—logic capacity, memory, I/O count, supply voltage, and operating temperature—that supports predictable design and procurement decisions. The device’s placement within the LatticeSC family also aligns it with family-level clocking, I/O, and SERDES capabilities for designers who may want to scale or reuse architecture concepts across projects.

Request a quote or submit an RFQ to receive pricing and availability for LFSC3GA15E-6FN256C. Our team can assist with lead times, packaging options, and volume pricing to support your design and production needs.

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