LFSC3GA25E-5FFN1020C

The LFSC3GA25E-5FFN1020C is a commercial-grade SC family FPGA in a 1020-ball fine-pitch BGA (33×33) package designed for high-density, memory-rich logic integration. It delivers approximately 25,000 logic elements, roughly 1.9 Mbits of embedded RAM, and 476 I/Os, making it suitable for communication, networking, and advanced embedded systems that require significant I/O and on-chip memory.

Built on the Lattice SC/M architecture, the device pairs a high-performance FPGA fabric with family-level features such as high-speed SERDES, extensive clocking resources and system-level support to simplify complex interface and memory-centric designs.

Key Features

• Logic Capacity Approximately 25,000 logic elements for mid-range logic integration and custom hardware acceleration.
• Embedded Memory Approximately 1.9 Mbits of on-chip RAM to support data buffering, FIFOs and memory-intensive processing.
• I/O Density 476 user I/Os provide extensive external connectivity for multi-channel interfaces and parallel buses.
• High-Speed SERDES & Protocol Support (family) SC/M family devices include 4 to 32 high-speed SERDES with performance ranging from 600 Mbps to 3.8 Gbps and embedded PCS options for common serial standards.
• Clocking and Timing (family) Family-level clock resources include high-performance PLLs and DLLs with global clocks up to 700 MHz and I/O edge clocks up to 1 GHz, enabling precise clock management and fast I/O timing.
• Package & Mounting 1020-BBGA (FCBGA) surface-mount package, supplier package 1020-OFCBGA (33×33), offering a compact footprint for board-level integration.
• Supply & Temperature Core supply range 0.95 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C to match standard commercial applications.
• Regulatory RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• Communication Infrastructure High I/O count and family-level high-speed SERDES make this FPGA suitable for packet processing, protocol bridging and line-card interfaces.
• Embedded Systems On-chip RAM and ample logic resources enable complex control, signal processing and custom accelerators in embedded platforms.
• Data Movement & Buffering Approximately 1.9 Mbits of embedded memory supports large FIFOs and buffering used in streaming and data acquisition systems.
• Multi-Channel I/O Control 476 I/Os allow integration of multiple parallel interfaces, sensor arrays, or multi-lane bus systems on a single device.

Unique Advantages

• Balanced Logic and Memory: Combines ~25,000 logic elements with ~1.9 Mbits of embedded RAM for designs that need both compute logic and on-chip storage.
• High I/O Count: 476 available I/Os reduce the need for external I/O expanders and simplify board-level routing for multi-interface designs.
• Family-Level High-Speed Serial Options: Access to SC/M family SERDES and PCS features enables reliable high-speed serial links where required.
• Flexible Clocking: Family clock resources including PLLs and DLLs help meet tight timing requirements and support synchronized multi-domain designs.
• Compact BGA Packaging: 1020-ball FCBGA (33×33) delivers high pin count in a compact form factor for space-constrained PCBs.
• RoHS Compliant: Supports modern, lead-free manufacturing and environmental compliance.

Why Choose LFSC3GA25E-5FFN1020C?

This LFSC3GA25E-5FFN1020C FPGA positions itself as a commercially graded, mid-to-high density programmable logic device that balances logic capacity, embedded memory and extensive I/O. It is appropriate for teams building communication, data buffering, and multi-interface embedded systems that require significant on-chip RAM and broad connectivity in a compact BGA package.

Choosing this device offers a route to consolidate logic, high-speed interfaces and memory on a single device while maintaining design flexibility through the SC/M family’s architecture and system-level features.

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