LFSC3GA25E-6FFA1020I

The LFSC3GA25E-6FFA1020I is an industrial-grade, surface-mount FPGA in the Lattice SC/M family designed for high-density, memory-rich embedded designs. It combines 25,000 logic elements with a high I/O count and significant on-chip RAM to support communication systems and industrial control applications that require flexible logic, large local buffering and extensive I/O integration.

Built in a 1020-BBGA (FCBGA) package, this device supports low-voltage operation and a wide industrial temperature range for robust deployment in harsh environments.

Key Features

• Logic Capacity  25,000 logic elements for implementing medium-to-high complexity logic, finite state machines, and peripheral glue logic.
• Embedded Memory  Approximately 1.97 Mbits of on-chip RAM (1,966,080 bits) for data buffering, FIFOs and embedded storage.
• High I/O Count  476 user I/Os to support multi-channel interfaces, wide parallel buses, and dense peripheral connectivity.
• High-speed Serial and Protocol Support (Family)  As a member of the Lattice SC/M family, the architecture includes 4 to 32 high-speed SERDES and flexiPCS™ options per device with family-reported performance ranges up to 3.8 Gbps and built-in pre-emphasis and equalization.
• Clocking and Timing (Family)  The SC/M family provides extensive clock resources including analog PLLs and DLLs with support for primary and edge clocks—enabling high-performance synchronous logic and I/O timing schemes.
• Power and Voltage  Operates from 0.95 V to 1.26 V, supporting low-voltage system rails and efficient power distribution in compact board designs.
• Package and Mounting  1020-BBGA, FCBGA package (supplier package: 1020-OFcBGA Rev 2, 33×33) with surface-mount mounting type for high pin-count, space-efficient assemblies.
• Industrial-Grade Temperature Range  Rated for –40 °C to 105 °C operation to meet industrial deployment requirements.
• Standards & Configuration (Family)  SC/M family-level system features include IEEE 1149.1 boundary scan and IEEE 1532 in-system configuration support to simplify board bring-up and in-field updates.
• Environment  RoHS compliant for global electronics manufacturing and regulatory alignment.

Typical Applications

• Communication Systems  High-speed SERDES capability and large on-chip RAM make this FPGA suitable for packet processing, interface bridging and protocol adaptation in networking equipment.
• Industrial Control & Automation  Wide temperature range and high I/O count enable robust motor control, sensor aggregation and deterministic I/O processing in factory and process automation systems.
• Embedded Networking & Storage  Ample logic and embedded memory support data buffering, traffic shaping and custom interface implementations in embedded routers, switches and storage controllers.
• High-Density I/O Gateways  476 I/Os and programmable logic density allow consolidation of multiple peripheral interfaces into a single device for space- and cost-efficient board designs.

Unique Advantages

• High integration in a compact package: 25,000 logic elements and 476 I/Os in a 1020-BBGA reduce system BOM and board area by consolidating functions into one device.
• Substantial on-chip memory: Approximately 1.97 Mbits of embedded RAM supports large FIFOs, buffering and local data storage without external memory for many use cases.
• Industrial robustness: Rated for –40 °C to 105 °C and RoHS compliant for reliable long-term operation in industrial environments.
• Low-voltage operation: 0.95 V to 1.26 V supply range accommodates modern low-voltage system rails while enabling efficient power design.
• Family-level high-speed features: Access to SC/M family SERDES, flexiPCS™ and advanced clocking resources enables migration to higher-throughput designs within the same architecture.

Why Choose LFSC3GA25E-6FFA1020I?

LFSC3GA25E-6FFA1020I places balanced logic capacity, significant embedded memory and a high I/O count into a surface-mount 1020-BBGA package suited for industrial applications. It is a practical choice where medium-to-high logic density, large on-chip buffers and robust I/O are required without sacrificing board-level density or industrial temperature performance.

This device is ideal for engineers designing communication interfaces, industrial control systems, and embedded networking equipment who need a single FPGA solution that combines programmable logic, abundant local memory and family-level high-speed I/O capabilities to simplify system design and accelerate time-to-market.

Request a quote or submit an inquiry for pricing and availability of LFSC3GA25E-6FFA1020I to begin specifying this FPGA in your next design.