LFSC3GA25E-6FN900I

The LFSC3GA25E-6FN900I is a high-performance SC-family FPGA from Lattice Semiconductor designed for demanding industrial applications. It combines a dense logic fabric, abundant I/O, and substantial on-chip memory to support complex digital designs and system-level integration.

Targeted at communications, industrial control and embedded systems, this device delivers a balance of integration and configurability suited to designs that require significant logic capacity, high I/O density, and operation across an extended temperature range.

Key Features

• Logic Capacity  Approximately 25,000 logic elements to implement complex digital functions and custom processing pipelines.
• Embedded Memory  Approximately 1.97 Mbits of on-chip RAM to support data buffering, FIFOs and local storage for system logic.
• I/O Density  378 I/O pins provide flexible interfacing options for high-pin-count systems and multi-channel connectivity.
• Package & Mounting  900-BBGA package (supplier device package: 900-FPBGA, 31 × 31 mm) with surface-mount mounting for high-density board designs.
• Power Supply  Core voltage support from 0.95 V to 1.26 V to match system power architectures.
• Industrial Temperature Range  Rated for operation from -40 °C to 105 °C for deployment in industrial environments.
• RoHS Compliant  Meets RoHS requirements for environmental and regulatory compatibility.
• Family-Level Capabilities (Lattice SC/M)  The Lattice SC/M family offers advanced FPGA fabric features such as high-speed SERDES, a rich I/O standard set, dedicated block RAM, and an extensive clocking network—allowing designs to leverage enhanced serial connectivity and precision clocking where applicable.

Typical Applications

• Networking & Communications  Use in packet processing, protocol bridging, and interface aggregation where high I/O count and on-chip memory accelerate data handling.
• Industrial Control  Suitable for PLCs, motor control interfaces and machine automation systems that require reliable operation across extended temperature ranges.
• Embedded Systems  Implement custom accelerators, peripheral controllers, and glue-logic for complex embedded platforms.
• High-Density I/O Platforms  Ideal for board designs that need many parallel interfaces or channelized front-ends due to its 378 I/Os and compact 900-BBGA package.

Unique Advantages

• High Integration: Combines ~25k logic elements with ~1.97 Mbits of embedded RAM to reduce external components and simplify system architecture.
• Significant I/O Count: 378 I/Os allow direct connection to multiple peripherals and data channels without extensive multiplexing.
• Industrial Reliability: Specified for -40 °C to 105 °C operation to meet the environmental needs of industrial applications.
• Compact, High-Pin Package: 900-BBGA (31 × 31 mm) provides a high pin count in a compact footprint for dense board layouts.
• Flexible Power Envelope: Core voltage range of 0.95 V to 1.26 V supports integration into a variety of power architectures.
• Family-Level Feature Set: Leverage Lattice SC/M family capabilities—such as advanced clocking and high-speed serial options—to accelerate system-level design where those features are required.

Why Choose LFSC3GA25E-6FN900I?

The LFSC3GA25E-6FN900I is positioned for engineers who need a robust, industrial-grade FPGA with a strong balance of logic capacity, on-chip memory and I/O density. Its packaging and temperature rating make it suitable for compact, high-channel-count systems deployed in industrial environments.

Choosing this device supports scalable designs that benefit from the SC-family architecture and the combination of integration and configurability—helping to reduce board-level complexity while providing the building blocks for communication, control and embedded processing applications.

Request a quote or submit an inquiry for LFSC3GA25E-6FN900I to discuss availability, pricing, and how this FPGA can fit your next design.