LFSC3GA40E-5FF1020C

IC FPGA 562 I/O 1020BGA
Part Description

SC Field Programmable Gate Array (FPGA) IC 562 4075520 40000 1020-BBGA, FCBGA

Quantity 362 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-OFCBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGA, FCBGANumber of I/O562Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4075520

Overview of LFSC3GA40E-5FF1020C – SC FPGA, 40,000 Logic Elements, 1020-BBGA

The LFSC3GA40E-5FF1020C is a commercial-grade SC family Field Programmable Gate Array from Lattice Semiconductor, supplied in a 1020-BBGA (FCBGA) package. It delivers 40,000 logic elements, extensive on-chip memory, and a large I/O count for communication and system-integration designs that require dense logic, flexible I/O and embedded RAM.

This device targets applications in communication systems and embedded platforms where high logic capacity, abundant I/O and memory, and programmable clocking and SERDES capabilities are required. Its combination of logic density, roughly 4.08 Mbits of embedded memory, and 562 I/Os supports complex protocol handling, buffering and high-speed interfacing in a single package.

Key Features

  • Core Logic  40,000 logic elements (cells) provide programmable fabric suitable for moderate-to-high density logic implementations within the Lattice SC family.
  • Embedded Memory  Approximately 4.08 Mbits of total on-chip RAM (4,075,520 bits) to support block and distributed memory needs for buffering, queues and local data storage.
  • I/O Capacity and Standards  562 user I/Os with broad electrical standard support across the SC/M family, enabling diverse single-ended and differential interfaces for system interconnects.
  • High-Speed SERDES and Protocol Support  SC family devices feature 4 to 32 high-speed SERDES and flexiPCS implementations for multi‑Gbps serial links and common communication protocols (family-level feature).
  • Clocking and Timing  Family-provided sysCLOCK resources include multiple PLLs and DLLs to support high-performance clock networks and edge-clocking up to 1 GHz (family-level capabilities described in datasheet).
  • Power and Supply  Supports core supply range from 0.95 V to 1.26 V to match system power architectures.
  • Packaging and Mounting  Surface-mount 1020-BBGA, FCBGA package with supplier device package listed as 1020-OFCBGA (33x33), offering high pin-count routing density.
  • Commercial Temperature and Compliance  Rated for 0°C to 85°C operating temperature range and RoHS compliant for global product requirements.

Typical Applications

  • Network & Telecom Equipment  Implements protocol handling, packet buffering and SERDES-based line interfaces for switches, routers and telecom endpoints.
  • Backplane & Interconnect Bridging  Enables protocol bridging and protocol-aware logic for high-density board-level interconnects using abundant I/O and serial interface capability.
  • Embedded Systems & Appliances  Provides programmable logic and on-chip memory for offload tasks, custom peripheral control and system glue logic in commercial embedded products.
  • High-Speed Serial Interface Design  Supports multi‑Gbps serial channels and associated PCS functionality for designs that require robust link management and jitter tolerance (family-level features).

Unique Advantages

  • High Logic Density: 40,000 logic elements let you implement complex state machines, datapaths and control logic without external ASICs.
  • Substantial On-Chip RAM: Approximately 4.08 Mbits of embedded memory reduces external memory needs for buffering and local data storage, simplifying BOM and board layout.
  • Large I/O Count: 562 I/Os provide direct connectivity to wide buses, multiple peripherals and dense inter-board interfaces, minimizing multiplexing overhead.
  • Flexible High-Speed Links: Family-level SERDES and flexiPCS support multi‑Gbps serial protocols to integrate high-throughput channels in communication applications.
  • Programmable Clocking: Multiple PLL/DLL resources in the SC family enable precise, high-frequency clocking and edge-clock support for timing-critical designs.
  • Commercial-Grade Availability: Surface-mount 1020-BBGA packaging and a 0°C to 85°C rating match standard commercial system manufacturing and operating environments.

Why Choose LFSC3GA40E-5FF1020C?

The LFSC3GA40E-5FF1020C balances high logic capacity, generous embedded memory and a high I/O count in a single, surface-mount FCBGA package—making it a practical choice for communication-centric and memory‑intensive embedded designs. Its supply voltage range and commercial temperature rating align with standard system power and operating envelopes.

This SC-family device is suited for OEMs and system designers who need programmable logic with integrated memory and extensive I/O to consolidate functions, reduce board-level components and accelerate time-to-market while relying on documented family capabilities for SERDES, clocking and I/O flexibility.

Request a quote or submit a procurement inquiry to receive pricing and availability for LFSC3GA40E-5FF1020C. Our team will provide the information you need to move your design forward.

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