LFSC3GA40E-5FFN1020C

IC FPGA 562 I/O 1020BGA
Part Description

SC Field Programmable Gate Array (FPGA) IC 562 4075520 40000 1020-BBGA, FCBGA

Quantity 332 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-OFCBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGA, FCBGANumber of I/O562Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4075520

Overview of LFSC3GA40E-5FFN1020C – SC Field Programmable Gate Array (FPGA), 40,000 Logic Elements, 562 I/Os, 1020‑BBGA

The LFSC3GA40E-5FFN1020C is a surface-mount SC-family FPGA offering a high-performance programmable fabric with extensive I/O and embedded memory for demanding communication and embedded system designs. Built on the Lattice SC family architecture, this device addresses applications that require large logic capacity, dense I/O, and substantial on-chip RAM.

Key value comes from a combination of 40,000 logic elements, approximately 4.08 Mbits of embedded memory, and up to 562 I/O pins in a 1020‑BBGA (33 × 33) package, with RoHS compliance and commercial temperature grading.

Key Features

  • Core Logic  40,000 logic elements provide a flexible FPGA fabric suitable for complex logic integration and system-level functions.
  • Embedded Memory  Approximately 4.08 Mbits of on-chip RAM to support buffering, packet processing, and state storage without external memory in many designs.
  • I/O Density & Standards Support  562 I/Os deliver high pin-count connectivity for multi-channel interfaces and board-level aggregation. The SC family includes high-performance I/O features and wide electrical standard support.
  • High‑Speed Serial & Clocking (family features)  The Lattice SC family offers high-speed SERDES and an extensive clocking network (PLLs/DLLs) for applications that require multi-gigabit serial links and precise clock management.
  • Power and Supply  Core supply range is 0.95 V to 1.26 V, enabling low-voltage operation consistent with modern system power domains.
  • Package & Mounting  1020‑BBGA (FCBGA) package, 33 × 33 mm, for high-density board integration and surface-mount assembly.
  • Operating Conditions & Compliance  Commercial grade operation from 0 °C to 85 °C and RoHS-compliant manufacturing.

Typical Applications

  • High‑Speed Networking  Ideal for packet processing, protocol bridging and line-card functions where high logic capacity, embedded RAM and robust I/O are required.
  • Interface Aggregation & Bridging  Use for consolidating multiple I/O channels, protocol conversion, and interfacing to high-speed serial standards supported by the SC family.
  • Embedded Systems & Acceleration  On-chip memory and abundant logic enable hardware acceleration, buffering and deterministic control tasks within embedded platforms.
  • Communications Infrastructure  Suitable for PHY, backplane, and switch/router subsystems that need high I/O density and substantial on-chip RAM.

Unique Advantages

  • High Logic Capacity: 40,000 logic elements let you implement complex state machines, packet processing pipelines, and custom accelerators on a single device.
  • Substantial On‑Chip RAM: Approximately 4.08 Mbits of embedded memory reduces dependence on external DRAM for many buffering and FIFO needs, simplifying BOM and board layout.
  • Large I/O Count: 562 I/Os enable dense peripheral interfacing and multi-channel aggregation without sacrificing headroom for future expansion.
  • Low‑Voltage Core Operation: 0.95–1.26 V supply range supports integration with modern power architectures and helps minimize core power consumption.
  • Commercial Grade & RoHS Compliant: Designed for commercial deployments with RoHS-compliant materials for global manufacturing compatibility.
  • FCBGA Package for Dense Boards: 1020‑BBGA (33 × 33) package provides the pin count needed for complex, high-density board layouts.

Why Choose LFSC3GA40E-5FFN1020C?

This FPGA targets designers who need a balance of high logic density, significant on-chip memory, and very large I/O capability in a single, surface-mount package. Its SC family architecture brings advanced I/O and clocking capabilities together with the memory resources required for networking and embedded applications.

The LFSC3GA40E-5FFN1020C is a strong fit for system designers building communication equipment, high-channel-count interfaces, and embedded accelerators who require a scalable, integrated FPGA solution backed by documented family capabilities and RoHS-compliant manufacturing.

Request a quote or submit a sales inquiry to learn more about availability, pricing, and lead time for LFSC3GA40E-5FFN1020C.

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