LFSC3GA40E-5FFN1152C

IC FPGA 604 I/O 1152FBGA
Part Description

SC Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA

Quantity 997 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGANumber of I/O604Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4075520

Overview of LFSC3GA40E-5FFN1152C – SC Field Programmable Gate Array (FPGA) IC, 40k logic elements, 1152-BBGA

The LFSC3GA40E-5FFN1152C is a Lattice SC family field programmable gate array delivered in a 1152-BBGA package optimized for surface-mount assembly. It combines a high-performance FPGA fabric with abundant I/O and embedded memory, making it suitable for communication, networking, and compute-centric embedded designs that require programmable logic, multi-gigabit serial links, and substantial on-chip RAM.

This device provides a balance of logic capacity, memory and I/O density with a commercial operating temperature range and low-voltage core operation, enabling compact board-level integration for high-density applications.

Key Features

  • Logic Capacity — 40,000 logic elements for implementing complex digital functions and custom accelerators.
  • Embedded Memory — Approximately 4.08 Mbits of on-chip RAM (total RAM bits: 4,075,520) to support data buffering, FIFOs and embedded storage.
  • I/O Density — 604 I/O pins to support wide parallel interfaces, multiplexed buses and diverse peripheral connections.
  • High‑Speed Serial and I/O Technology — Family-level SERDES and high-performance I/O features (family datasheet describes multi‑Gbps SERDES and PURESPEED™ I/O capabilities) for high-bandwidth serial links and memory interfaces.
  • Clocking Resources — Advanced clocking network referenced in the family datasheet, including analog PLLs and DLLs for high-frequency and phase‑matched clocking.
  • Package and Mounting — 1152-BBGA (supplier package: 1152-FPBGA, 35×35) in a surface-mount form factor for compact, high-pin-count designs.
  • Power and Voltage — Core supply range from 0.95 V to 1.26 V to match modern low-voltage systems; family supports 1.2 V and 1.0 V operation per datasheet.
  • Operating Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

  • Telecommunications & Networking — Implement packet processing, protocol adaptation and multi‑Gbps serial interfaces using the device’s high I/O count and family-level SERDES capabilities.
  • Data Acquisition & Processing — Use embedded RAM and dense logic to buffer, preprocess and route high-throughput sensor or ADC data streams.
  • Custom Compute & Acceleration — Realize application-specific accelerators, DSP pipelines and control logic with the device’s 40,000 logic elements and on-chip memory.
  • Interface Bridging — Bridge between parallel buses and serial links or implement protocol converters leveraging abundant I/O and programmable fabric.

Unique Advantages

  • High integration in a compact package: 1152-BBGA delivers 604 I/Os and 40k logic elements in a surface-mount footprint, reducing board area and simplifying routing for high-density systems.
  • Substantial on-chip memory: Approximately 4.08 Mbits of embedded RAM supports FIFOs, buffering and on‑chip storage without immediate external memory needs.
  • Flexible power options: Core supply range (0.95 V–1.26 V) aligns with low-voltage system architectures and family-level support for 1.2 V and 1.0 V operation.
  • Ready for high-bandwidth links: Family datasheet describes high‑speed SERDES and advanced I/O features suitable for multi‑Gbps connectivity and tolerant serial performance.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic products and assemblies.

Why Choose LFSC3GA40E-5FFN1152C?

The LFSC3GA40E-5FFN1152C positions itself as a well-balanced FPGA option where substantial logic capacity, significant embedded memory and high I/O density are required in a single compact package. Its low-voltage operation and family-level support for advanced clocking and SERDES technology enable designers to implement high-performance, board‑level systems for networking, data processing and custom compute tasks.

Choose this device when your design needs a mid-to-high density programmable fabric with on-chip memory and extensive I/O in a surface-mount BBGA package—offering scalability for evolving system requirements while maintaining commercial-grade operating conditions.

Request a quote or submit a sales inquiry to check availability, pricing and lead times for LFSC3GA40E-5FFN1152C.

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