LFSC3GA40E-6FFN1152C
| Part Description |
SC Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA |
|---|---|
| Quantity | 484 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FPBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 604 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10000 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4075520 |
Overview of LFSC3GA40E-6FFN1152C – SC Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA
The LFSC3GA40E-6FFN1152C is a member of the Lattice SC family of field programmable gate arrays, delivering a high-performance FPGA fabric with large on-chip memory and high I/O density. It is designed for communication and embedded applications that require substantial logic capacity, extensive I/O, and integrated memory.
As an SC-class device, the part benefits from the family architecture that emphasizes programmable logic, embedded memory, and high-speed serial interfaces to support network, data‑transport and high‑bandwidth embedded system designs.
Key Features
- Logic Capacity Approximately 40,000 logic elements, suitable for complex glue logic, protocol handling and custom hardware acceleration.
- Embedded Memory Approximately 4.08 Mbits of on-chip RAM (4,075,520 bits) to support frame buffering, FIFOs and local data storage.
- I/O Density 604 I/Os provide broad connectivity for parallel interfaces, memory buses and mixed-signal front-ends.
- Package & Mounting 1152-BBGA package (supplier device package: 1152-FPBGA, 35×35 mm) with surface-mount mounting for high pin-count board designs.
- Power Supply Core voltage operation from 0.95 V to 1.26 V to match system power rails and low-voltage designs.
- Operating Range & Compliance Commercial grade operation from 0 °C to 85 °C and RoHS compliant.
- Family-Level High-Speed I/O Lattice SC/M family features include multi-gigabit SERDES (4 to 32 per device) with PCS support and high-performance PURESPEED I/O capable of multi-hundred‑MHz operation (family characteristic).
- Advanced Clocking & Memory Architecture Family features include multiple PLLs and DLLs and a sysMEM embedded Block RAM architecture for flexible clocking and memory configurations (family characteristic).
Typical Applications
- High‑Performance Networking Implements packet processing, protocol bridging and interface aggregation leveraging abundant logic, embedded memory and high-speed serial links.
- Telecom & Data Transport Suitable for line cards, transport modules and protocol engines where multiple SERDES lanes and dense I/O are required.
- Storage & Connectivity Handles interface adaptation, buffering and custom data paths for storage controllers and interconnects using available RAM and logic resources.
- Embedded System Integration Acts as a central glue-and-acceleration device for complex embedded platforms requiring wide I/O and substantial local memory.
Unique Advantages
- High Logic Density: Approximately 40,000 logic elements enable implementation of sizeable custom accelerators and protocol stacks without external logic.
- Large On‑Chip Memory: Around 4.08 Mbits of embedded RAM reduces dependence on external DRAM for buffering and temporary storage, simplifying board-level design.
- Extensive I/O Count: 604 I/Os let you implement wide parallel buses, multiple interfaces and flexible pin assignments in a single device.
- High‑Speed Serial Capability (Family): The SC/M family’s multi-gigabit SERDES and embedded PCS IP support common serial protocols and simplify high-bandwidth link design.
- Compact High‑Pin Package: 1152-BBGA (35×35 mm) offers high pin density in a surface-mount footprint for space-constrained, high-function designs.
- Regulatory & Temperature Suitability: Commercial-grade temperature range and RoHS compliance meet standard electronic product requirements for most embedded and networking equipment.
Why Choose LFSC3GA40E-6FFN1152C?
The LFSC3GA40E-6FFN1152C combines substantial logic capacity, multi‑megabit on‑chip memory and a high I/O count in a single, surface‑mount 1152‑pin BGA package. It is well suited to engineers designing communication, networking and embedded platforms that need integrated buffering, wide interfacing and family-level support for high-speed serial links.
For designs that require a balance of performance, integration and board-level density, this SC-family FPGA offers a compelling platform that scales within the Lattice SC/M architecture and supports a range of high-bandwidth and memory‑intensive use cases.
Request a quote or submit a purchase inquiry today to get pricing and availability for LFSC3GA40E-6FFN1152C.

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