LFSC3GA40E-6FFN1152C

IC FPGA 604 I/O 1152FBGA
Part Description

SC Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA

Quantity 484 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGANumber of I/O604Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10000Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4075520

Overview of LFSC3GA40E-6FFN1152C – SC Field Programmable Gate Array (FPGA) IC 604 4075520 40000 1152-BBGA

The LFSC3GA40E-6FFN1152C is a member of the Lattice SC family of field programmable gate arrays, delivering a high-performance FPGA fabric with large on-chip memory and high I/O density. It is designed for communication and embedded applications that require substantial logic capacity, extensive I/O, and integrated memory.

As an SC-class device, the part benefits from the family architecture that emphasizes programmable logic, embedded memory, and high-speed serial interfaces to support network, data‑transport and high‑bandwidth embedded system designs.

Key Features

  • Logic Capacity  Approximately 40,000 logic elements, suitable for complex glue logic, protocol handling and custom hardware acceleration.
  • Embedded Memory  Approximately 4.08 Mbits of on-chip RAM (4,075,520 bits) to support frame buffering, FIFOs and local data storage.
  • I/O Density  604 I/Os provide broad connectivity for parallel interfaces, memory buses and mixed-signal front-ends.
  • Package & Mounting  1152-BBGA package (supplier device package: 1152-FPBGA, 35×35 mm) with surface-mount mounting for high pin-count board designs.
  • Power Supply  Core voltage operation from 0.95 V to 1.26 V to match system power rails and low-voltage designs.
  • Operating Range & Compliance  Commercial grade operation from 0 °C to 85 °C and RoHS compliant.
  • Family-Level High-Speed I/O  Lattice SC/M family features include multi-gigabit SERDES (4 to 32 per device) with PCS support and high-performance PURESPEED I/O capable of multi-hundred‑MHz operation (family characteristic).
  • Advanced Clocking & Memory Architecture  Family features include multiple PLLs and DLLs and a sysMEM embedded Block RAM architecture for flexible clocking and memory configurations (family characteristic).

Typical Applications

  • High‑Performance Networking  Implements packet processing, protocol bridging and interface aggregation leveraging abundant logic, embedded memory and high-speed serial links.
  • Telecom & Data Transport  Suitable for line cards, transport modules and protocol engines where multiple SERDES lanes and dense I/O are required.
  • Storage & Connectivity  Handles interface adaptation, buffering and custom data paths for storage controllers and interconnects using available RAM and logic resources.
  • Embedded System Integration  Acts as a central glue-and-acceleration device for complex embedded platforms requiring wide I/O and substantial local memory.

Unique Advantages

  • High Logic Density:  Approximately 40,000 logic elements enable implementation of sizeable custom accelerators and protocol stacks without external logic.
  • Large On‑Chip Memory:  Around 4.08 Mbits of embedded RAM reduces dependence on external DRAM for buffering and temporary storage, simplifying board-level design.
  • Extensive I/O Count:  604 I/Os let you implement wide parallel buses, multiple interfaces and flexible pin assignments in a single device.
  • High‑Speed Serial Capability (Family):  The SC/M family’s multi-gigabit SERDES and embedded PCS IP support common serial protocols and simplify high-bandwidth link design.
  • Compact High‑Pin Package:  1152-BBGA (35×35 mm) offers high pin density in a surface-mount footprint for space-constrained, high-function designs.
  • Regulatory & Temperature Suitability:  Commercial-grade temperature range and RoHS compliance meet standard electronic product requirements for most embedded and networking equipment.

Why Choose LFSC3GA40E-6FFN1152C?

The LFSC3GA40E-6FFN1152C combines substantial logic capacity, multi‑megabit on‑chip memory and a high I/O count in a single, surface‑mount 1152‑pin BGA package. It is well suited to engineers designing communication, networking and embedded platforms that need integrated buffering, wide interfacing and family-level support for high-speed serial links.

For designs that require a balance of performance, integration and board-level density, this SC-family FPGA offers a compelling platform that scales within the Lattice SC/M architecture and supports a range of high-bandwidth and memory‑intensive use cases.

Request a quote or submit a purchase inquiry today to get pricing and availability for LFSC3GA40E-6FFN1152C.

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