LFSC3GA80E-5FCN1152C

The LFSC3GA80E-5FCN1152C is a commercial-grade SC family Field Programmable Gate Array (FPGA) in a 1152‑ball FCBGA package. It combines a high-density programmable fabric with ample I/O and on-chip memory to support complex system designs.

Targeted at communications, embedded processing and high‑performance digital systems, this device delivers 80,000 logic elements, approximately 5.8 Mbits of embedded RAM, and 660 I/Os in a surface‑mount 1152‑FCBGA (35 × 35) package—allowing integration of high‑functionality subsystems in space-constrained designs.

Key Features

• Logic Capacity — 80,000 logic elements for implementing complex digital functions and custom logic blocks.
• On‑chip Memory — Approximately 5.8 Mbits of embedded RAM (total RAM bits: 5,816,320) to support large buffers, FIFOs and memory‑intensive algorithms.
• I/O Density — 660 user I/Os to interface with high‑pin‑count peripherals, memory, and multi‑lane serial links.
• Power Supply — Low‑voltage core operation from 0.95 V to 1.26 V to match modern low‑power system rails.
• Package & Mounting — 1152‑FCBGA (35 × 35) surface‑mount package for high‑density PCB layouts and reliable board mounting.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Standards & Family Capabilities — As part of the Lattice SC family, the platform includes high‑performance fabric, high‑speed SERDES and advanced clocking resources (family-level features described in the device data sheet).
• Environmental Compliance — RoHS compliant.

Typical Applications

• Networking & Communications — Implement packet processing, protocol bridging and multi‑lane serial interfaces using the device’s high logic count and abundant I/O.
• Embedded Systems — Offload compute‑intensive tasks, create custom accelerators or bridge processors and peripherals with on‑chip memory and rich I/O resources.
• High‑Speed Data Paths — Use the FPGA for lane aggregation, serialization/deserialization, and protocol adaptation in systems requiring many I/Os and embedded RAM.
• Prototyping & System Integration — Integrate complex proof‑of‑concept designs or replace multiple discrete components with a single programmable device to reduce BOM and PCB area.

Unique Advantages

• High logic density: 80,000 logic elements support large-scale designs without moving to larger packages.
• Substantial embedded memory: Approximately 5.8 Mbits of on‑chip RAM reduces external memory dependence and improves system latency.
• Extensive I/O: 660 I/Os provide flexibility for complex board-level interfacing and high channel counts.
• Compact, manufacturable package: 1152‑FCBGA (35 × 35) allows high-density PCB routing while retaining surface‑mount assembly compatibility.
• Commercial temperature rating: Operation from 0 °C to 85 °C aligns with a wide range of commercial and enterprise applications.
• RoHS compliance: Environmentally compliant for modern manufacturing requirements.

Why Choose LFSC3GA80E-5FCN1152C?

The LFSC3GA80E-5FCN1152C provides a balance of high logic capacity, significant on‑chip memory and large I/O resources in a single, surface‑mount FCBGA package. It is well suited for designers who need to consolidate functionality, accelerate processing, and interface with many peripherals without expanding PCB real estate.

Backed by the Lattice SC family architecture (as documented in the device datasheet), this device offers system-level clocking and high‑performance fabric features that help scale designs from prototype to production while keeping BOM and system complexity under control.

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