LFSC3GA80E-5FF1152I

IC FPGA 660 I/O 1152FCBGA
Part Description

SC Field Programmable Gate Array (FPGA) IC 660 5816320 80000 1152-BBGA, FCBGA

Quantity 665 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 105°C
Package / Case1152-BBGA, FCBGANumber of I/O660Voltage950 mV - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs20000Number of Logic Elements/Cells80000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5816320

Overview of LFSC3GA80E-5FF1152I – SC Field Programmable Gate Array (FPGA) IC, 660 I/Os, ~5.8 Mbits embedded RAM, 80,000 logic elements, 1152-FCBGA

The LFSC3GA80E-5FF1152I is a high-performance SC-series FPGA from Lattice Semiconductor Corporation. It delivers a large programmable fabric with 80,000 logic elements, approximately 5.8 Mbits of on-chip RAM and 660 I/O pins in a 1152‑pin FCBGA package, addressing demanding digital integration needs for communications, networking and industrial systems.

Designed for industrial-grade applications, this surface-mount FPGA operates across a wide supply range and extended temperature window, enabling robust deployment in systems that require high I/O density, embedded memory and flexible I/O standards support.

Key Features

  • Programmable Logic 80,000 logic elements provide a substantial fabric for implementing complex digital logic, protocol engines and system glue logic.
  • Embedded Memory Approximately 5.8 Mbits of on-chip RAM suitable for large buffers, FIFOs and memory-intensive functions.
  • High I/O Density 660 general-purpose I/Os support extensive external interfacing and parallel connectivity for high-pin-count systems.
  • High‑Performance I/O and SERDES (family-level) Family-level features include high-speed SERDES and flexible physical coding sublayer support, plus PURESPEED™ I/O performance up to multi-hundred‑MHz/DDR operation and programmable input delay for robust timing alignment.
  • Voltage Supply Operates from 0.95 V to 1.26 V, enabling low-voltage system integration and power management strategies.
  • Package & Mounting 1152‑pin FCBGA (35 × 35 mm) package in a surface-mount form factor for compact, high-density board designs.
  • Industrial Temperature Grade Rated for operation from −40 °C to 105 °C to meet extended-temperature industrial deployments.
  • Standards & Compliance RoHS compliant, supporting environmentally responsible manufacturing and deployment.

Typical Applications

  • Communications Infrastructure Implement protocol processing and high-density interfacing for network equipment using the device’s large logic capacity and abundant I/Os.
  • High‑Speed Networking Deploy the FPGA in switching, aggregation or transport systems where embedded RAM and high-performance I/O are required for packet buffering and timing-sensitive data paths.
  • Industrial Control & Automation Use the industrial temperature rating and extensive I/O to consolidate control, motor drive logic and sensor interfacing in factory and process environments.
  • Memory Interfaces & Data Buffers Leverage the on-chip RAM and wide I/O complement for high-throughput buffering, bridging and temporary storage in data-flow designs.

Unique Advantages

  • High Logic Capacity: 80,000 logic elements enable integration of complex state machines, protocol stacks and custom accelerators on a single device.
  • Large On‑Chip Memory: Approximately 5.8 Mbits of embedded RAM reduces external memory dependency and simplifies board-level BOM and timing considerations.
  • Extensive I/O Resources: 660 I/Os support broad external connectivity, allowing consolidation of multiple interfaces and sensors without external multiplexing.
  • Industrial Reliability: −40 °C to 105 °C operating range and RoHS compliance support long-term use in industrial environments with environmental and regulatory considerations addressed.
  • Compact, High‑Density Packaging: The 1152‑FCBGA package provides a compact footprint for high-pin-count designs while maintaining board-level routing efficiency.
  • Low‑Voltage Operation: 0.95 V to 1.26 V supply range helps reduce system power and align with modern low-voltage architectures.

Why Choose LFSC3GA80E-5FF1152I?

The LFSC3GA80E-5FF1152I sits at the intersection of high logic density, substantial embedded memory and large I/O capability, making it well-suited for engineers designing communications, networking and industrial systems that demand integration and flexibility. Its industrial temperature rating and surface-mount FCBGA package support durable, space-efficient board designs.

Selection of this FPGA is appropriate for teams looking to consolidate multiple functions into a single programmable device, reduce external component count, and leverage family-level high-speed I/O features for robust system-level performance.

Request a quote or submit a pricing and availability inquiry to receive detailed ordering and lead-time information for the LFSC3GA80E-5FF1152I. Our team can provide part pricing, availability and support for integration into your next-generation design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up