LFSC3GA80E-5FF1152I
| Part Description |
SC Field Programmable Gate Array (FPGA) IC 660 5816320 80000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 665 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 105°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 660 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 20000 | Number of Logic Elements/Cells | 80000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5816320 |
Overview of LFSC3GA80E-5FF1152I – SC Field Programmable Gate Array (FPGA) IC, 660 I/Os, ~5.8 Mbits embedded RAM, 80,000 logic elements, 1152-FCBGA
The LFSC3GA80E-5FF1152I is a high-performance SC-series FPGA from Lattice Semiconductor Corporation. It delivers a large programmable fabric with 80,000 logic elements, approximately 5.8 Mbits of on-chip RAM and 660 I/O pins in a 1152‑pin FCBGA package, addressing demanding digital integration needs for communications, networking and industrial systems.
Designed for industrial-grade applications, this surface-mount FPGA operates across a wide supply range and extended temperature window, enabling robust deployment in systems that require high I/O density, embedded memory and flexible I/O standards support.
Key Features
- Programmable Logic 80,000 logic elements provide a substantial fabric for implementing complex digital logic, protocol engines and system glue logic.
- Embedded Memory Approximately 5.8 Mbits of on-chip RAM suitable for large buffers, FIFOs and memory-intensive functions.
- High I/O Density 660 general-purpose I/Os support extensive external interfacing and parallel connectivity for high-pin-count systems.
- High‑Performance I/O and SERDES (family-level) Family-level features include high-speed SERDES and flexible physical coding sublayer support, plus PURESPEED™ I/O performance up to multi-hundred‑MHz/DDR operation and programmable input delay for robust timing alignment.
- Voltage Supply Operates from 0.95 V to 1.26 V, enabling low-voltage system integration and power management strategies.
- Package & Mounting 1152‑pin FCBGA (35 × 35 mm) package in a surface-mount form factor for compact, high-density board designs.
- Industrial Temperature Grade Rated for operation from −40 °C to 105 °C to meet extended-temperature industrial deployments.
- Standards & Compliance RoHS compliant, supporting environmentally responsible manufacturing and deployment.
Typical Applications
- Communications Infrastructure Implement protocol processing and high-density interfacing for network equipment using the device’s large logic capacity and abundant I/Os.
- High‑Speed Networking Deploy the FPGA in switching, aggregation or transport systems where embedded RAM and high-performance I/O are required for packet buffering and timing-sensitive data paths.
- Industrial Control & Automation Use the industrial temperature rating and extensive I/O to consolidate control, motor drive logic and sensor interfacing in factory and process environments.
- Memory Interfaces & Data Buffers Leverage the on-chip RAM and wide I/O complement for high-throughput buffering, bridging and temporary storage in data-flow designs.
Unique Advantages
- High Logic Capacity: 80,000 logic elements enable integration of complex state machines, protocol stacks and custom accelerators on a single device.
- Large On‑Chip Memory: Approximately 5.8 Mbits of embedded RAM reduces external memory dependency and simplifies board-level BOM and timing considerations.
- Extensive I/O Resources: 660 I/Os support broad external connectivity, allowing consolidation of multiple interfaces and sensors without external multiplexing.
- Industrial Reliability: −40 °C to 105 °C operating range and RoHS compliance support long-term use in industrial environments with environmental and regulatory considerations addressed.
- Compact, High‑Density Packaging: The 1152‑FCBGA package provides a compact footprint for high-pin-count designs while maintaining board-level routing efficiency.
- Low‑Voltage Operation: 0.95 V to 1.26 V supply range helps reduce system power and align with modern low-voltage architectures.
Why Choose LFSC3GA80E-5FF1152I?
The LFSC3GA80E-5FF1152I sits at the intersection of high logic density, substantial embedded memory and large I/O capability, making it well-suited for engineers designing communications, networking and industrial systems that demand integration and flexibility. Its industrial temperature rating and surface-mount FCBGA package support durable, space-efficient board designs.
Selection of this FPGA is appropriate for teams looking to consolidate multiple functions into a single programmable device, reduce external component count, and leverage family-level high-speed I/O features for robust system-level performance.
Request a quote or submit a pricing and availability inquiry to receive detailed ordering and lead-time information for the LFSC3GA80E-5FF1152I. Our team can provide part pricing, availability and support for integration into your next-generation design.

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