LFSC3GA40E-6FFA1020C

The LFSC3GA40E-6FFA1020C is a commercial-grade SC family FPGA from Lattice Semiconductor, packaged in a high-pin-count 1020-BBGA (FCBGA) format. It combines a large logic capacity, extensive I/O count and substantial on-chip RAM to address complex logic integration and high-density interface designs.

Built on the Lattice SC/M family architecture, this device targets communication and memory‑intensive systems that benefit from high I/O density, significant embedded memory and flexible clocking and I/O capabilities provided by the family.

Key Features

• Approx. 40,000 logic elements  Provides a substantial logic fabric for implementing complex custom logic, state machines and protocol handling.
• Approximately 4.08 Mbits of embedded memory  4,075,520 total RAM bits support large FIFOs, buffering and on-chip data storage for high-throughput designs.
• High I/O density  562 I/O pins enable dense external interfacing for multi-channel I/O, wide parallel busses and numerous peripherals.
• Family-level high-performance architecture  As part of the Lattice SC/M family, the device benefits from a high-performance FPGA fabric, high-speed I/O capabilities and advanced clocking resources described in the family datasheet.
• Compact BGA package  1020-BBGA (FCBGA) with a 33×33 ball array provides a high pin count in a compact footprint for board-level density.
• Commercial operating range  Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial and enterprise applications.
• Core voltage range  Supports a core supply between 0.95 V and 1.26 V to match system power rails and low-voltage designs.
• RoHS compliant  Meets RoHS environmental requirements for lead-free designs.

Typical Applications

• Communication and networking equipment  High I/O count and substantial embedded RAM make this FPGA suitable for line cards, interface bridging and protocol adaptation in networking systems.
• High-speed data buffering and packet processing  On-chip memory and dense logic resources support buffering, queuing and mid‑pipeline processing tasks.
• Multi-channel interface aggregation  Large I/O availability enables aggregation of multiple serial or parallel channels for gateway or backplane applications.
• Complex system glue logic  Use as a centralized logic hub to integrate multiple peripherals, memory interfaces and control paths on system boards.

Unique Advantages

• High logic and memory capacity: Approximately 40,000 logic elements paired with ~4.08 Mbits of on-chip RAM reduces the need for external memory and offloads processing to the FPGA fabric.
• Exceptional I/O scalability: 562 I/Os provide flexibility to support wide buses, many peripherals or multi-lane interfaces without multiplexing compromises.
• Compact, high-density packaging: The 1020-BBGA (33×33) package delivers high pin count in a compact footprint, helping lower board area for dense designs.
• Commercial temperature suitability: Rated 0 °C to 85 °C for reliable operation in standard commercial and enterprise environments.
• Flexible core supply: Support for 0.95–1.26 V core supply accommodates low-voltage system designs and power-optimized architectures.
• RoHS compliance: Environmentally compliant for modern assembly and production requirements.

Why Choose LFSC3GA40E-6FFA1020C?

The LFSC3GA40E-6FFA1020C combines a large logic fabric, substantial embedded memory and a very high I/O count in a compact FCBGA package—making it well suited for communication, data buffering and complex interface integration in commercial systems. As a member of the Lattice SC/M family, it leverages an architecture designed for memory-intensive and high-performance I/O tasks.

This device is appropriate for designers who need a scalable, high-density FPGA solution for board-level integration where on-chip memory and large numbers of I/Os can simplify system design and reduce external component count.

Request a quote or submit a quote to obtain pricing and availability for the LFSC3GA40E-6FFA1020C.