LFSC3GA25E-7FN900C

The LFSC3GA25E-7FN900C is a commercial-grade SC family FPGA from Lattice Semiconductor, offering a balance of programmable logic, on-chip memory and a high I/O count in a compact 900-pin BGA package. It is suitable for designs that require significant logic capacity, substantial embedded RAM and dense external connectivity while operating within standard commercial temperature and supply ranges.

Key Features

• Programmable Logic  25,000 logic elements to implement custom control, datapath or glue logic for mid-density FPGA designs.
• Embedded Memory  Approximately 1.97 Mbits of total on-chip RAM (1,966,080 bits) for buffering, FIFOs and local storage.
• High I/O Count  378 I/O pins provide broad external interface capability for peripherals, buses and multi-channel I/O requirements.
• Power and Supply  Operates from a core supply range of 950 mV to 1.26 V to match system power rails and modern low-voltage designs.
• Package & Mounting  900-BBGA (supplier package: 900-FPBGA, 31 × 31 mm) in a surface-mount format for high-pin-count, space-efficient board layouts.
• Operating Range  Commercial temperature grade: 0 °C to 85 °C suitable for standard commercial environments.
• Environmental Compliance  RoHS compliant.
• Based on Lattice SC Family Architecture  Built on the Lattice SC family foundation that combines FPGA fabric, high-performance I/Os and embedded RAM (family-level characteristics described in the datasheet).

Typical Applications

• Communication Infrastructure  Use the high I/O count and embedded memory for protocol bridging, packet buffering and interface aggregation in network equipment.
• Data Acquisition & Processing  Implement front-end data aggregation, pre-processing and temporary storage leveraging the device’s logic density and on-chip RAM.
• Custom Peripherals & Interface Controllers  Create proprietary interface controllers or glue logic between processors and peripherals where many I/O signals and local memory are required.
• Embedded System Prototyping  Rapidly prototype mid-density FPGA functions that require a balance of logic, I/O and memory in a single component.

Unique Advantages

• Significant Logic Capacity: 25,000 logic elements provide the resources needed for complex state machines, datapaths and control logic without external ASICs.
• Substantial On-Chip Memory: Approximately 1.97 Mbits of embedded RAM reduces external memory dependency for buffering and temporary storage.
• Dense Connectivity: 378 I/Os enable diverse peripheral interfaces and multi-channel signal handling from a single FPGA package.
• Compact, High-Pin Package: 900-BBGA (31 × 31 mm) allows high pin counts in a compact surface-mount form factor to save board real estate.
• Low-Voltage Core Operation: 950 mV to 1.26 V core supply support aligns with modern low-voltage system designs.
• Commercial Temperature Rating: 0 °C to 85 °C suits a wide range of non-industrial, commercial applications where standard environmental ranges apply.

Why Choose LFSC3GA25E-7FN900C?

The LFSC3GA25E-7FN900C combines a mid-to-high density of programmable logic, nearly 2 Mbits of on-chip RAM and a large bank of I/Os in a single surface-mount 900-BBGA package. This combination supports designs that need substantial internal resources and dense external connectivity without expanding board-level component counts.

Designed for commercial applications, the device is appropriate for customers who require a scalable FPGA solution with verified family-level architecture and RoHS compliance. It is a solid choice for engineering teams building communication, data acquisition or custom interface solutions that benefit from integrated logic and memory resources.

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