LFSCM3GA80EP1-5FFN1152C
| Part Description |
SCM Field Programmable Gate Array (FPGA) IC 660 5816320 80000 1152-BBGA |
|---|---|
| Quantity | 573 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FPBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 660 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 20000 | Number of Logic Elements/Cells | 80000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5816320 |
Overview of LFSCM3GA80EP1-5FFN1152C – SCM FPGA, 80K Logic Elements, 1152‑BBGA
The LFSCM3GA80EP1-5FFN1152C is a commercial‑grade SCM Field Programmable Gate Array (FPGA) from Lattice Semiconductor built on the LatticeSC/M family architecture. It delivers high logic density and large embedded memory in a high‑pin‑count 1152‑BBGA (35×35) surface‑mount package for complex system integration.
Designed for high‑performance communications and embedded system applications, this device pairs approximately 80,000 logic elements with abundant I/O and memory to support data‑intensive and interface‑rich designs while operating within a 0.95 V to 1.26 V supply range and a 0 °C to 85 °C commercial temperature window.
Key Features
- Logic Capacity Approximately 80,000 logic elements (cells) to implement complex digital logic and state machines.
- Embedded Memory Approximately 5.8 Mbits of on‑chip RAM (total RAM bits 5,816,320) for buffering, packet staging, and embedded data structures.
- High I/O Count 660 available I/O pins to support broad connectivity and parallel interfaces in dense system designs.
- Package & Mounting 1152‑BBGA footprint (supplier package: 1152‑FPBGA, 35×35) with surface‑mount assembly for compact, high‑pin‑count board designs.
- Power Low‑voltage core operation with a specified supply range of 0.95 V to 1.26 V for compatibility with modern low‑voltage systems.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C to suit standard commercial and enterprise applications.
- LatticeSC/M Family Capabilities (series‑level) The LatticeSC/M family provides a high‑performance FPGA fabric with family features such as high‑speed SERDES and flexiPCS, extensive clocking resources (including high‑frequency global and edge clocks), and a large sysMEM block RAM architecture. Refer to the family datasheet for series‑level details.
- Compliance RoHS compliant for regulatory and manufacturing compatibility.
Typical Applications
- High‑performance Networking Use in network switches, line cards, and protocol bridges where large logic capacity and abundant I/O enable packet processing and interface aggregation.
- Communication Interfaces Ideal for systems requiring dense physical connectivity and embedded memory for buffering and protocol handling.
- Embedded Compute & Acceleration Implements custom datapaths and hardware accelerators that benefit from high logic density and sizable on‑chip RAM.
- System Integration & Prototyping Suitable for consolidating multiple functions into a single FPGA for faster time‑to‑market in commercial products.
Unique Advantages
- High Logic Density: Approximately 80,000 logic elements provide the capacity to implement complex control and processing functions on one device, reducing BOM and interconnect complexity.
- Substantial On‑chip Memory: Approximately 5.8 Mbits of embedded RAM enables local buffering, FIFOs, and state storage without external memory for many use cases.
- Extensive I/O Resources: 660 I/Os support multiple parallel buses, high‑pin‑count interfaces, and mixed signal domain connectivity on a single package.
- Compact High‑Pin Package: The 1152‑BBGA (35×35) package delivers high pin‑count in a compact footprint for space‑constrained board designs.
- Commercial‑grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant, aligning with standard commercial manufacturing and deployment.
- Series‑level Feature Set: Built on the LatticeSC/M family architecture, benefiting from family features such as advanced clocking and high‑speed SERDES at the series level (see family datasheet for details).
Why Choose LFSCM3GA80EP1-5FFN1152C?
This FPGA balances substantial logic capacity, significant embedded memory, and a very large I/O count in a compact 1152‑BBGA package, making it well suited for communication‑centric and compute‑intensive commercial applications. Its low‑voltage core and commercial temperature rating align with modern system power architectures and standard commercial deployments.
Designers seeking to consolidate multiple functions, implement high‑speed interfaces, or accelerate algorithms in hardware will find the LFSCM3GA80EP1-5FFN1152C a flexible platform that leverages the LatticeSC/M family architecture for expanded system capability.
Request a quote or submit an availability inquiry for LFSCM3GA80EP1-5FFN1152C to discuss pricing, lead times and how this device can fit into your next design.

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