LFSCM3GA80EP1-5FFN1152I

The LFSCM3GA80EP1-5FFN1152I is a LatticeSC/M series FPGA offering a high-performance programmable fabric with 80,000 logic elements, approximately 5.8 Mbits of on-chip embedded memory, and 660 user I/O pins. Packaged in a 1152-BBGA (1152-FPBGA, 35×35) surface-mount package, this device targets designs that require large logic capacity, substantial embedded RAM, and extensive I/O connectivity.

Designed for systems-level applications in communications, industrial control and embedded processing, the device combines scalable FPGA resources with the LatticeSC/M family feature set to deliver flexible integration, advanced I/O options, and broad clocking capability.

Key Features

• Logic Capacity — 80,000 logic elements suitable for complex glue logic, protocol handling and custom accelerators.
• Embedded Memory — Approximately 5.8 Mbits of total on-chip RAM, supporting data buffering, FIFOs and local storage.
• High I/O Count — 660 user I/O pins in a high-pin-count BGA package for extensive external interface connectivity.
• Advanced Family I/O and SERDES — LatticeSC/M family features include high-performance I/O up to 2 Gbps and family-level high-speed SERDES (4 to 32 per device) and PCS options as described in the LatticeSC/M data material.
• Clocking and Timing — Family-level analog PLLs and DLLs with support up to 1 GHz and extensive clock networks for multi-domain designs.
• Power and Supply — Core voltage supply range from 0.95 V to 1.26 V to match modern low-voltage system rails.
• Package and Mounting — 1152-BBGA (supplier package: 1152-FPBGA, 35×35) suitable for surface-mount assembly in space-constrained, high-density designs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 105 °C for industrial environments.
• Regulatory — RoHS compliant.

Typical Applications

• Networking & Telecom: Use the device where large logic capacity, embedded memory and family-level SERDES and PCS support are needed for packet processing, protocol bridging or line interface logic.
• Industrial Control: Ideal for motion control, PLC I/O aggregation and deterministic interface bridging where extended temperature range and high I/O count are required.
• Embedded Acceleration: Deploy as a compute offload or custom datapath accelerator leveraging the abundant logic elements and on-chip RAM for local buffering and high-throughput logic.
• High-density Interface Hubs: Use the 660 I/Os and compact BGA package to consolidate multiple peripherals and memory interfaces on space-constrained PCBs.

Unique Advantages

• High logic and memory integration: 80,000 logic elements combined with approximately 5.8 Mbits of embedded RAM reduces the need for external components and simplifies board-level design.
• Extensive I/O reach: 660 user I/Os provide flexibility to connect multiple high-pin-count interfaces without external multiplexing.
• Industrial-ready thermal range: −40 °C to 105 °C operation supports deployment in industrial environments that require extended temperature tolerance.
• Compact, high-density packaging: The 1152-BBGA (1152-FPBGA, 35×35) delivers large pin count in a compact surface-mount form factor for modern PCBs.
• Family-level high-speed features: Beneficial family technologies such as PURESPEED I/O up to 2 Gbps and integrated clocking resources (PLLs/DLLs) enable high-performance interface and timing architectures.
• Standards-oriented building blocks: The LatticeSC/M family provides pre-engineered IP and system-level support useful for communications and complex digital systems.

Why Choose LFSCM3GA80EP1-5FFN1152I?

This LFSCM3GA80EP1-5FFN1152I FPGA positions itself as a high-capacity, system-oriented programmable device combining large logic depth, substantial embedded memory and a very high I/O count in a single compact BGA package. It is especially suitable for designers who need to consolidate interfaces, implement complex protocol logic or add custom acceleration while operating across industrial temperature ranges.

Backed by the LatticeSC/M family architecture and family-level features documented in the device literature, the part offers scalability and integration that help reduce BOM count and simplify board-level design for communications, industrial and embedded processing applications.

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