LFSCM3GA80EP1-6FFN1152C

The LFSCM3GA80EP1-6FFN1152C is a field programmable gate array from Lattice Semiconductor’s SCM family, built for high-performance, memory-intensive system designs. It combines a large logic fabric with extensive on-chip memory and high-density I/O to address communication, networking and advanced embedded applications.

Designed for surface-mount deployment in a 1152-BBGA package, this commercial-grade device operates from 0 °C to 85 °C and supports low-voltage core operation between 0.95 V and 1.26 V, enabling efficient power profiles for compact systems.

Key Features

• Logic Capacity  Approximately 80,000 logic elements provide a large programmable fabric for complex control, signal processing and protocol implementations.
• High-density I/O  660 available I/Os support broad interfacing needs for sensors, memory, peripherals and high-speed links.
• Embedded Memory  Approximately 5.8 Mbits of on-chip RAM delivers substantial local storage for buffering, FIFOs and memory-intensive functions.
• SCM Family High-speed SERDES and flexiPCS  The SCM family includes high-speed SERDES with flexiPCS support and link performance up to multiple Gbps, enabling implementation of common network and serial protocols.
• Advanced I/O and Timing  Family features include 2 Gbps class I/O capability, programmable input delay, precision clock network with PLLs/DLLs and 700 MHz global clocks for demanding timing and interface requirements.
• Package and Mounting  1152-BBGA (1152-FPBGA, 35 × 35 mm) surface-mount package provides high pin count in a compact footprint for dense PCB layouts.
• Voltage and Grade  Core supply range of 0.95 V to 1.26 V; commercial grade operation from 0 °C to 85 °C.
• Standards and Tools Support (Family)  SCM family devices are described with built-in support for common system-level blocks and configuration options to streamline integration in communications and embedded systems.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• High-speed Networking and Communications  Use the device’s SERDES-capable family architecture and large I/O count to implement protocol bridging, packet processing and interface aggregation.
• Memory-Intensive Embedded Systems  Approximately 5.8 Mbits of embedded RAM and abundant logic enable buffering, data manipulation and custom memory architectures for throughput-sensitive designs.
• Multi-interface Aggregation  High I/O density supports systems that consolidate multiple serial, parallel and differential interfaces on a single FPGA.
• Signal Processing and Control  Large logic capacity and precision clocking resources suit moderate-to-high complexity signal processing, real-time control and protocol offload functions.

Unique Advantages

• Highly Integrated Solution:  Combines large programmable logic, significant embedded memory and extensive I/O in a single package to reduce BOM and board complexity.
• High I/O Bandwidth:  660 I/Os support wide data buses and multiple simultaneous interfaces without external multiplexing.
• Memory-rich Fabric:  Approximately 5.8 Mbits of on-chip RAM enables deep buffering and efficient local data handling for latency-sensitive tasks.
• Low-voltage Core Operation:  0.95 V to 1.26 V supply range allows integration into low-power system designs while matching platform voltage requirements.
• Commercial Temperature Range:  Rated 0 °C to 85 °C for reliable operation in typical commercial and industrial-adjacent environments.
• RoHS Compliant Packaging:  Manufactured to environmental compliance standards for streamlined regulatory acceptance.

Why Choose LFSCM3GA80EP1-6FFN1152C?

LFSCM3GA80EP1-6FFN1152C positions itself as a robust, memory-capable FPGA option for designers who need a balance of large logic capacity, high I/O density and substantial on-chip memory in a surface-mount BGA package. Its voltage range and commercial temperature grade make it suitable for a wide range of embedded and communications applications where integration and board-level density matter.

Selecting this device provides access to the SCM family architecture and its system-oriented features—helpful when implementing multi-protocol interfaces, high-throughput data paths and integrated system functions while minimizing external components and simplifying board design.

Request a quote or submit an inquiry to obtain pricing, availability and technical assistance for LFSCM3GA80EP1-6FFN1152C. A sales request will help you confirm lead times and integration support for your project.