LFSCM3GA80EP1-6FFN1152I
| Part Description |
SCM Field Programmable Gate Array (FPGA) IC 660 5816320 80000 1152-BBGA |
|---|---|
| Quantity | 1,575 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 105°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 660 | Voltage | 950 mV - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 20000 | Number of Logic Elements/Cells | 80000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5816320 |
Overview of LFSCM3GA80EP1-6FFN1152I – SCM Field Programmable Gate Array (FPGA) IC 660 5816320 80000 1152-BBGA
The LFSCM3GA80EP1-6FFN1152I is a field programmable gate array from Lattice Semiconductor's LatticeSC/M family, delivering high logic capacity, large on-chip memory and a high I/O count for complex embedded and communication designs. It combines 80,000 logic elements, approximately 5.8 Mbits of embedded RAM and 660 I/Os in a dense 1152-BBGA package for space-efficient deployments.
Designed for industrial applications, this device supports low-voltage core operation (0.95–1.26 V) and a wide operating temperature range (−40 °C to 105 °C), making it suitable for demanding systems that require robust performance and high integration.
Key Features
- Logic Capacity 80,000 logic elements provide programmable logic resources for complex state machines, data paths and custom processing.
- High I/O Density 660 programmable I/O pins enable dense external interfacing for high-channel-count systems and multi-protocol front-ends.
- Embedded Memory Approximately 5.8 Mbits of on-chip RAM (5,816,320 bits) supports large buffering, FIFOs and memory-intensive functions.
- Low-Voltage Core Core supply range of 0.95 V to 1.26 V allows integration into low-power system architectures and modern power-rail domains.
- Industrial Temperature & Grade Industrial grade device rated for −40 °C to 105 °C operation for reliability in industrial environments.
- Package & Mounting 1152-BBGA package (supplier: 1152-FPBGA, 35×35) with surface-mount construction for high-density board designs.
- Family-Level High-Speed Interfaces LatticeSC/M family devices include high-speed SERDES and embedded PCS implementations with performance ranges cited in the family datasheet, enabling high-bandwidth serial links and protocol support (family-level feature).
- Advanced Clocking & Memory Architecture (Family Feature) The family includes multi-PLL/DLL clock resources and dedicated sysMEM block RAM architecture to support high-performance clocking and memory-intensive designs (family-level feature).
- RoHS Compliant Manufactured in accordance with RoHS requirements.
Typical Applications
- Networking & Telecom Equipment High logic density, large embedded memory and family-level SERDES/PCS features make this device suitable for packet processing, protocol bridging and line-card functions.
- High-Speed Serial Interfaces Use in designs requiring dense I/O and high-bandwidth serial links where the family’s SERDES and PCS capabilities enable industry-standard interfaces.
- Embedded Compute & Acceleration Large programmable fabric and on-chip RAM support hardware acceleration, signal processing and real-time data handling in embedded systems.
- Multi-Channel I/O Aggregation High I/O count supports aggregation, crosspoint switching and complex peripheral interfacing on compact PCBs.
Unique Advantages
- High Integration Density: Combines 80,000 logic elements, ~5.8 Mbits RAM and 660 I/Os in a single 1152-BBGA package to reduce board-level component count.
- Industrial Reliability: Rated for −40 °C to 105 °C and specified as industrial grade for use in robust, temperature-challenging environments.
- Low-Voltage Operation: 0.95–1.26 V supply range supports modern low-voltage system rails and power-optimized designs.
- Family-Level High-Speed Connectivity: Access to LatticeSC/M family SERDES and PCS features provides a path to implement high-speed serial protocols and reduce integration time (family-level capability).
- Space-Efficient Packaging: 1152-pin BBGA (35×35 FPBGA) enables high pin-count implementations on compact boards.
- Standards-Friendly Architecture: Family datasheet documents pre-engineered PCS cores for common protocols, aiding protocol implementation and verification (family-level feature).
Why Choose LFSCM3GA80EP1-6FFN1152I?
This FPGA delivers a balanced combination of logic capacity, embedded memory and extensive I/O in a compact, industrial-grade package. It is positioned for designers who need a highly integrated programmable device for communication systems, high-density I/O applications and memory-intensive processing tasks.
Choosing this device provides a scalable platform within the LatticeSC/M family, offering family-level high-speed interface support and clocking/memory architecture to accelerate system-level integration while maintaining industrial temperature performance and RoHS compliance.
Request a quote or submit a procurement inquiry to receive pricing and lead-time information for LFSCM3GA80EP1-6FFN1152I.
