LFX1200EB-03F900C

The LFX1200EB-03F900C is an ispXPGA® family field programmable gate array (FPGA) IC providing a balanced mix of programmable logic, on-chip memory, and high I/O density in a compact 900‑ball BGA package. It is optimized for designs that require a moderate number of logic elements and large external interfacing in a commercial-temperature device.

Key hardware characteristics include 15,376 logic elements, approximately 0.42 Mbits of embedded memory, 496 general-purpose I/Os, and an equivalent gate count of 1,250,000 — all supported by a 2.3 V to 3.6 V supply range and surface-mount 900‑FPBGA (31×31) package.

Key Features

• Core Logic  15,376 logic elements provide programmable fabric for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 0.42 Mbits of on-chip RAM to support buffers, FIFOs, and small lookup tables.
• I/O Density  496 I/O pins deliver extensive external interfacing options for sensors, peripherals, and board-level signals.
• Gate Equivalent  An equivalent of 1,250,000 gates enables integration of sizeable logic functions within a single device.
• Power Supply  Broad supply voltage range of 2.3 V to 3.6 V for compatibility with common system power rails.
• Package & Mounting  900‑BBGA (supplier package: 900‑FPBGA, 31×31) in a surface-mount form factor suitable for compact PCB layouts.
• Temperature & Grade  Commercial grade device specified for 0 °C to 85 °C operating temperature range.
• Environmental Compliance  RoHS compliant for reduced hazardous substance content.

Unique Advantages

• High Logic Capacity: 15,376 logic elements enable implementation of complex digital functions without external logic.
• Substantial On‑Chip Memory: Approximately 0.42 Mbits of embedded RAM reduces dependence on external memory for mid‑sized buffering needs.
• Extensive I/O Count: 496 I/Os simplify board-level connections and reduce the need for external I/O expanders.
• Compact, High‑Density Package: 900‑ball FPBGA (31×31) provides a small footprint for dense PCB designs while keeping connection density high.
• Flexible Power Options: 2.3 V to 3.6 V supply range supports common system rails and integration with a variety of peripheral voltages.
• Regulatory Readiness: RoHS compliance supports environmental and regulatory requirements for many commercial products.

Why Choose LFX1200EB-03F900C?

The LFX1200EB-03F900C combines a substantial logic element count, meaningful on-chip memory, and very high I/O density in a single 900‑ball BGA package, making it well suited to commercial designs that require integrated programmable logic and extensive external interfacing. Its voltage flexibility and surface-mount packaging support compact, board-level implementations.

This device is a practical choice for engineering teams seeking a programmable solution that balances integration and board real estate, while providing verifiable electrical and environmental specifications for commercial deployments.

Request a quote or submit a pricing and availability inquiry for the LFX1200EB-03F900C to receive current commercial terms and lead‑time information.