LFX1200EC-04F900C

The LFX1200EC-04F900C is an ispXPGA® family Field Programmable Gate Array (FPGA) offered in a high-pin-count 900-BBGA package. It provides a balanced combination of logic density, on-chip memory, and I/O count suitable for commercial embedded designs that require flexible, reprogrammable digital logic.

Key on-chip resources include 15,376 logic elements, approximately 0.424 Mbits of embedded memory, and 496 user I/Os. The device operates from a 1.65 V to 1.95 V supply and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Logic Capacity  15,376 logic elements and an architecture from the ispXPGA family provide substantial programmable logic resources for complex glue logic, protocol bridging, and custom digital functions.
• On-Chip Memory  Approximately 0.424 Mbits of embedded RAM to support buffering, small FIFOs, and state storage for control and data-path functions.
• I/O Resources  496 user I/Os deliver extensive external connectivity for high-pin-count designs and multi-interface applications.
• Gate Equivalent  A device gate complexity of 1,250,000 gives a clear indicator of overall integration capability for combinational and sequential logic.
• Power  Single-supply operation across 1.65 V to 1.95 V allows integration into low-voltage power domains.
• Package & Mounting  Available in a 900-pin BGA format (900-FPBGA, 31 × 31 mm) optimized for surface-mount assembly and compact board-level integration.
• Commercial Grade & Temperature  Specified for commercial operation from 0 °C to 85 °C and offered as a commercial-grade component.
• Environmental Compliance  RoHS-compliant material status supports regulatory and manufacturing considerations for lead-free assembly.

Typical Applications

• High-pin-count interface consolidation  Use the 496 I/Os to consolidate multiple peripheral and protocol interfaces onto a single FPGA, reducing external glue logic.
• Embedded control and glue logic  15,376 logic elements enable implementation of custom control paths, state machines, and bus adaptation functions for embedded systems.
• On-board buffering and small-data storage  Approximately 0.424 Mbits of embedded RAM supports FIFOs, small buffers, and temporary data storage for real-time processing tasks.

Unique Advantages

• Balanced density and I/O  Combines substantial logic capacity with nearly 500 I/Os to address designs that need both compute and wide external connectivity.
• Low-voltage operation  1.65 V–1.95 V supply compatibility enables integration with modern low-voltage logic domains and power-optimized systems.
• BGA package for compact assembly  The 900-pin FPBGA (31 × 31 mm) package supports compact, high-density PCB layouts while maintaining robust signal routing.
• Commercial temperature rating  Specified 0 °C to 85 °C operation matches common commercial and enterprise embedded applications.
• RoHS compliant  Material compliance aligns with lead-free manufacturing processes and regulatory requirements.

Why Choose LFX1200EC-04F900C?

The LFX1200EC-04F900C offers a pragmatic combination of programmable logic capacity, on-chip memory, and high I/O count within a compact 900-BBGA package. Its ispXPGA family architecture and measurable resource set make it suitable for commercial embedded applications that require reconfigurable logic, interface consolidation, and moderate on-chip buffering.

This device is well suited for design teams and procurement groups seeking a commercially graded FPGA with defined electrical and thermal specifications (1.65 V–1.95 V, 0 °C–85 °C), RoHS compliance, and surface-mount BGA packaging for production-scale assembly.

If you would like pricing, availability, or to request a formal quote for LFX1200EC-04F900C, please submit a request and our team will respond with the next steps.