LFX125EB-04F256C

IC FPGA 160 I/O 256FBGA
Part Description

ispXPGA® Field Programmable Gate Array (FPGA) IC 160 94208 1936 256-BGA

Quantity 1,460 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O160Voltage2.3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs484Number of Logic Elements/Cells1936
Number of Gates139000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LFX125EB-04F256C – ispXPGA® Field Programmable Gate Array (FPGA) IC 160 94208 1936 256-BGA

The LFX125EB-04F256C is an ispXPGA® family field programmable gate array from Lattice Semiconductor Corporation. It provides a compact, surface-mount FPGA in a 256-ball BGA package with a balance of logic capacity, on-chip memory, and general-purpose I/O suitable for commercial embedded designs.

With 1,936 logic elements, approximately 0.094 Mbits of embedded memory, and 160 I/O pins, this device targets applications that require moderate programmable logic, flexible I/O connectivity, and a small PCB footprint while operating within a 2.3 V to 3.6 V supply range at commercial temperatures.

Key Features

  • Core Capacity  1,936 logic elements (as specified) providing programmable logic resources for glue logic, protocol bridging, and custom datapath implementation.
  • Embedded Memory  Approximately 0.094 Mbits of on-chip RAM (94,208 bits) for buffering, small lookup tables, or state storage.
  • I/O and Gate Count  160 I/O pins and a gate-equivalent count of 139,000 for diverse peripheral interfacing and moderate logic density.
  • Package & Mounting  256-ball FPBGA (17 × 17 mm) package in a surface-mount form factor for compact board-level integration.
  • Power  Supports a wide supply range from 2.3 V to 3.6 V to accommodate common commercial power rails.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance & Availability  RoHS-compliant; listed as Active / Orderable in the ispXPGA family documentation.

Unique Advantages

  • Balanced logic and memory: Combines 1,936 logic elements with approximately 0.094 Mbits of embedded RAM for versatile implementation of control, interface, and datapath functions.
  • High I/O count in a compact package: 160 user I/Os in a 256-FPBGA (17×17) package supports dense peripheral connections while preserving PCB area.
  • Flexible supply range: Operates across 2.3 V–3.6 V rails to match common system power architectures.
  • Commercial temperature fit: Rated for 0 °C to 85 °C for a wide set of standard embedded and commercial applications.
  • RoHS-compliant manufacturing: Conforms to RoHS requirements for environmentally conscious designs.
  • Surface-mount form factor: 256-ball BGA enables automated assembly and reliable solder joint integrity for production volumes.

Why Choose LFX125EB-04F256C?

The LFX125EB-04F256C is positioned for engineers seeking a compact, commercially rated ispXPGA FPGA with a practical mix of logic elements, embedded memory, and a high I/O count. Its 256-FPBGA package and surface-mount mounting make it suitable for space-constrained PCBs while supporting diverse peripheral interfaces through 160 I/Os.

As part of the ispXPGA family from Lattice Semiconductor, this device provides a verified platform listed as Active / Orderable in the manufacturer documentation, making it a reliable choice for designs that require programmable logic, moderate on-chip RAM, and flexible power operation in commercial environments.

Request a quote or submit a purchasing inquiry to get pricing and availability for the LFX125EB-04F256C.

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