LFX125EB-05F256C

The LFX125EB-05F256C is an ispXPGA® family Field Programmable Gate Array (FPGA) designed for commercial embedded applications that require programmable logic, on-chip memory, and flexible I/O in a compact BGA package. It integrates 1,936 logic elements across 484 logic blocks, approximately 94,208 bits (≈0.094 Mbits) of embedded RAM, and 160 user I/O pins to address control, interface, and glue-logic tasks.

This device targets designers building consumer electronics, communications equipment, and embedded systems that need configurable logic with a standard commercial operating range and RoHS-compliant construction. Key value comes from a balanced combination of logic capacity, embedded memory, and a 256-ball FPBGA (17×17) package suitable for surface-mount assembly.

Key Features

• Core Logic 1,936 logic elements organized across 484 logic blocks to implement custom combinational and sequential logic functions.
• Embedded Memory Approximately 94,208 bits (~0.094 Mbits) of on-chip RAM for buffering, small lookup tables, and state storage.
• I/O 160 user I/O pins to interface with peripherals, sensors, and external logic devices.
• Power Supply Operates from a 2.3 V to 3.6 V supply range to support typical commercial system rails.
• Package & Mounting 256-ball FPBGA (17×17) surface-mount package offering high pin density in a compact footprint.
• Operating Conditions Commercial operating temperature range of 0 °C to 85 °C and RoHS-compliant materials.
• Design Density Approximately 139,000 gates to support a variety of moderate-complexity logic designs.

Typical Applications

• Consumer Electronics Implement custom control logic, peripheral interfacing, and protocol bridging in compact consumer devices.
• Communications Equipment Handle glue logic, data formatting, and I/O adaptation for networking or telecom modules.
• Embedded Control Provide configurable state machines and interface logic for embedded controllers and appliances within commercial temperature ranges.
• Prototyping and Development Rapidly iterate hardware designs that require reprogrammable logic and modest on-chip memory.

Unique Advantages

• Balanced Logic and Memory: 1,936 logic elements paired with approximately 94,208 bits of RAM enable a wide range of mid-density functions without external memory for many use cases.
• High I/O Count in a Compact Package: 160 I/O pins in a 256-ball FPBGA (17×17) package maximize connectivity while minimizing PCB area.
• Flexible Supply Voltage: Support for 2.3 V to 3.6 V systems simplifies integration into designs using common commercial power rails.
• Commercial Temperature Range: Rated 0 °C to 85 °C to meet typical commercial application requirements.
• RoHS Compliant: Manufactured with RoHS-compliant materials for regulatory and manufacturing consistency.

Why Choose LFX125EB-05F256C?

The LFX125EB-05F256C delivers a practical blend of logic density, embedded RAM, and high I/O count in a space-efficient BGA package for commercial embedded designs. Its supply voltage flexibility and standard operating temperature range make it suitable for a wide range of consumer, communications, and general-purpose embedded applications.

Designers seeking a reprogrammable, moderately dense FPGA with verified package options and RoHS compliance will find this ispXPGA device suitable for reducing external components, consolidating glue logic, and accelerating design iterations.

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