LFX125EB-05FN256C
| Part Description |
ispXPGA® Field Programmable Gate Array (FPGA) IC 160 94208 1936 256-BGA |
|---|---|
| Quantity | 243 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 160 | Voltage | 2.3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 484 | Number of Logic Elements/Cells | 1936 | ||
| Number of Gates | 139000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LFX125EB-05FN256C – ispXPGA® Field Programmable Gate Array (FPGA) IC, 160 I/O, 1936 logic elements, 256‑BGA
The LFX125EB-05FN256C is an ispXPGA® field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It provides 1,936 logic elements, approximately 94,208 bits of embedded RAM, and 160 device I/O in a 256‑ball FPBGA (17×17) surface-mount package.
Designed for commercial-grade applications, the device operates from 2.3 V to 3.6 V and across an operating temperature range of 0 °C to 85 °C. The ispXPGA family datasheet lists this device as Active / Orderable.
Key Features
- Core Logic 1,936 logic elements provide configurable logic resources for custom digital functions.
- Embedded Memory Approximately 94,208 bits of on-chip RAM for buffering, FIFOs, or small data storage needs.
- I/O Count 160 general-purpose I/O pins to interface with external peripherals and subsystems.
- Design Density Approximately 139,000 gates for mid-density FPGA implementations.
- Package & Mounting 256‑ball FPBGA (256‑BGA, 17×17) surface-mount package for compact board integration.
- Power Voltage supply range of 2.3 V to 3.6 V to support common low-voltage system domains.
- Temperature & Grade Commercial grade operation from 0 °C to 85 °C.
- Compliance RoHS compliant.
Unique Advantages
- Balanced logic and memory resources: 1,936 logic elements paired with ~94,208 bits of embedded RAM enable efficient implementation of control, glue-logic, and buffering functions.
- High I/O density in a compact package: 160 I/O in a 256‑BGA (17×17) FPBGA provides significant pin count without a large PCB footprint.
- Flexible low-voltage operation: 2.3 V to 3.6 V supply range supports integration into common 3.3 V environments and mixed-voltage designs.
- Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial applications.
- Manufacturer availability: Listed as Active / Orderable in the ispXPGA family datasheet, indicating current product status within the family.
- Regulatory compliance: RoHS compliance simplifies materials and environmental planning.
Why Choose LFX125EB-05FN256C?
The LFX125EB-05FN256C offers a practical balance of logic density, embedded memory, and I/O capacity in a space-efficient 256‑BGA package. Its voltage range and commercial temperature rating make it suitable for a wide range of standard embedded designs that require mid-range FPGA capability and on-chip buffering.
This device is appropriate for engineering teams seeking a commercially rated ispXPGA family FPGA with verifiable logic, memory, and I/O specifications and current availability as indicated in the family datasheet.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the LFX125EB-05FN256C.
