LFX125EB-04FN256C

The LFX125EB-04FN256C is an ispXPGA® family FPGA IC from Lattice Semiconductor Corporation offering 1,936 logic elements, approximately 94,208 bits of embedded memory, and 160 general-purpose I/Os in a compact 256-FPBGA (17×17) surface-mount package. It provides a commercial-grade FPGA option for designs that require moderate logic density and a high I/O count.

Operated from a 2.3 V to 3.6 V supply and specified for 0 °C to 85 °C, this device is targeted at embedded designs that need on-chip logic, state storage, and flexible I/O in a compact BGA footprint.

Key Features

• Core 1,936 logic elements (cells) for implementing combinational and sequential logic functions.
• Memory Total on-chip RAM: 94,208 bits — approximately 0.094 Mbits of embedded memory suitable for state storage and buffering.
• I/O 160 user-accessible I/O pins to support parallel interfaces, control signals, and board-level glue logic.
• Density & Gate Count Targeted device complexity represented by approximately 139,000 gates for integrated logic functions.
• Package & Mounting 256-FPBGA (17×17) package case, surface mount for compact board integration.
• Power Single-supply operation across 2.3 V to 3.6 V for a range of common embedded power domains.
• Temperature & Grade Commercial grade device specified for operation from 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant for regulatory alignment in standard commercial products.

Typical Applications

• Embedded control and glue logic — Use the available 1,936 logic elements and 160 I/Os to implement board-level control, signal conditioning, and interface glue between subsystems.
• I/O expansion and protocol bridging — High I/O count enables bridging between parallel and serial buses or expanding microcontroller/peripheral interfaces.
• On-board buffering and state machines — Approximately 94,208 bits of embedded RAM support buffering, FIFOs, and small state storage for data flow management.
• Prototyping and medium-density FPGA designs — Compact 256-FPBGA footprint and commercial-grade temperature range make it suitable for development boards and production designs with moderate logic requirements.

Unique Advantages

• Broad I/O capacity: 160 I/Os in a 256-FPBGA package provide significant signal routing and peripheral interface capability without a larger package.
• Balanced logic and memory: 1,936 logic elements combined with approximately 0.094 Mbits of embedded memory support both control logic and modest buffering on-chip.
• Compact BGA footprint: 256-FPBGA (17×17) surface-mount package helps minimize PCB area while preserving connectivity and thermal performance for commercial designs.
• Flexible power range: 2.3 V to 3.6 V supply range accommodates a variety of common embedded power rails.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with standard commercial product requirements.
• Regulatory alignment: RoHS compliance simplifies integration into environmentally regulated product lines.

Why Choose LFX125EB-04FN256C?

The LFX125EB-04FN256C from the ispXPGA family delivers a practical combination of logic resources, embedded memory, and a high I/O count in a compact 256-FPBGA package. Its voltage range and commercial temperature rating make it a straightforward choice for embedded systems that require on-chip logic, buffering, and extensive I/O without moving to a larger or more complex FPGA class.

This device is well suited to designers and teams building board-level control, interface bridging, or moderate-density programmable logic into commercial products, offering a verifiable set of specifications to match system requirements.

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