LFX125EB-03FN256I

The LFX125EB-03FN256I is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor’s ispXPGA family. It provides a balanced combination of logic resources, embedded RAM and I/O density in a compact 256‑BGA package optimized for industrial applications.

Key on‑chip resources include 1,936 logic elements, 94,208 bits of RAM and 160 user I/O pins. The device supports a 2.3 V to 3.6 V supply range, a -40 °C to 105 °C operating temperature window, and is listed as active/orderable in the ispXPGA family datasheet.

Key Features

• Core Logic — 1,936 logic elements and 139,000 gates for user-defined digital logic implementations.
• Embedded Memory — 94,208 total RAM bits of on‑chip memory (≈0.094 Mbits) for buffering, state storage and small data structures.
• I/O Capacity — 160 user I/O pins to support multiple interfaces, sensors and peripherals.
• Power Supply — Operates from 2.3 V to 3.6 V, compatible with common system rails.
• Package & Mounting — Surface-mount 256‑BGA; supplier device package listed as 256‑FPBGA (17×17) for board-level density.
• Industrial Temperature & Grade — Industrial grade device with an operating range of -40 °C to 105 °C.
• Environmental Compliance — RoHS compliant.
• Family & Availability — Part of the ispXPGA family; listed as active/orderable in the product datasheet.

Typical Applications

• Industrial Control — Use where industrial temperature range and rugged operation are required for control and automation logic.
• I/O‑Intensive Embedded Systems — 160 I/O pins enable sensor, actuator and peripheral interfacing in compact systems.
• Custom Logic and Glue‑Logic — Deploy the device for bespoke protocol conversion, signal aggregation or application‑specific logic using available logic elements and embedded RAM.
• Communication Peripherals — Implement interface adaptation and I/O management where moderate gate count and on‑chip memory are sufficient.

Unique Advantages

• Compact, high‑density package: 256‑FPBGA (17×17) offers board‑level density for space‑constrained designs.
• Industrial temperature support: Rated from -40 °C to 105 °C for deployment in harsh environments.
• Balanced logic and memory resources: 1,936 logic elements and 94,208 bits of RAM provide flexibility for a range of custom digital functions.
• Broad supply compatibility: 2.3 V to 3.6 V operation supports integration with common system power rails.
• Environmental compliance: RoHS compliant to meet regulatory requirements for many assemblies.
• Documented family support: Device is part of Lattice’s ispXPGA family and is listed as active/orderable in the datasheet.

Why Choose LFX125EB-03FN256I?

The LFX125EB-03FN256I delivers a practical mix of logic density, embedded RAM and extensive I/O in a surface‑mount 256‑BGA package, making it well suited for industrial and embedded designs that require moderate programmable logic and robust thermal performance. Its 2.3 V–3.6 V supply range and RoHS compliance simplify system integration and regulatory alignment.

As part of the ispXPGA family and listed as active/orderable in the product documentation, this device is appropriate for designers seeking a compact, industrial‑grade FPGA for applications that demand configurable logic, multiple I/O channels and reliable operation across a wide temperature range.

Request a quote or submit a purchase inquiry for the LFX125EB-03FN256I to receive pricing and availability information.