LFX125EB-03F256I

The LFX125EB-03F256I is an ispXPGA® field programmable gate array (FPGA) from Lattice Semiconductor. It provides a compact, configurable logic solution in a 256-BGA package with 160 general-purpose I/O and on-chip memory.

Designed for industrial applications, the device supports a wide supply range and extended temperature operation, enabling reliable custom logic, interface bridging and I/O expansion across harsh environments.

Key Features

• Core Logic 1,936 logic elements organized in 484 CLBs for implementing custom digital functions and glue logic.
• Embedded Memory 94,208 bits of on-chip RAM (approximately 0.094 Mbits) for small buffers, FIFOs and state storage.
• I/O Capacity 160 I/O pins to support broad peripheral connectivity and mixed-signal interface routing.
• Package & Mounting 256-BGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for high-density board designs.
• Power Wide voltage supply range from 2.3 V to 3.6 V to accommodate common system rails.
• Industrial Temperature Rated for operation from −40 °C to 105 °C for deployment in industrial and demanding environments.
• Device Status & Family Part of the ispXPGA family; this specific ordering part is listed in the ispXPGA datasheet as Active / Orderable.
• Compliance RoHS compliant for environmental and regulatory conformity in manufacturing.

Typical Applications

• Industrial Control Implement custom control logic and real-time interfacing while meeting extended temperature and industrial-grade requirements.
• Interface Bridging Use the available I/O and logic resources to bridge or adapt between peripherals, protocols or custom sensor arrays.
• Embedded System Glue Logic Provide address decoding, bus arbitration, and peripheral management in compact, surface-mount designs.
• Prototyping and Low- to Mid-Scale Integration Rapidly iterate hardware functions and consolidate discrete logic into a single programmable device.

Unique Advantages

• Balanced Logic and Memory: A combination of approximately 1,936 logic elements and 94,208 bits of RAM supports common control and buffering tasks without external memory.
• High I/O Count in a Compact Package: 160 I/Os in a 256-BGA (17×17) package reduce board area while enabling extensive peripheral connectivity.
• Industrial Reliability: Rated for −40 °C to 105 °C operation, suitable for industrial deployments that require extended temperature performance.
• Flexible Power Range: Operates across 2.3 V to 3.6 V supply rails to simplify integration with common system voltages.
• RoHS Compliance: Supports environmentally conscious manufacturing processes and regulatory requirements.

Why Choose LFX125EB-03F256I?

The LFX125EB-03F256I is positioned as a compact, industrial-grade FPGA option within the ispXPGA family, offering a practical mix of logic, embedded RAM and I/O capacity for embedded control, interface, and glue-logic designs. Its 256-BGA package and surface-mount mounting make it suitable for space-constrained PCBs while maintaining broad connectivity.

Engineers and purchasers looking for a configurable logic device with industrial temperature capability, flexible supply range and RoHS compliance will find this part suitable for mid-range integration tasks and reliable operation in demanding environments.

Request a quote or submit a pricing inquiry to begin procurement or to get additional ordering information for the LFX125EB-03F256I.