LFXP10C-4F256C

The LFXP10C-4F256C is a Lattice XP family Field Programmable Gate Array (FPGA) in a 256‑ball fpBGA package. It integrates approximately 10,000 logic elements and roughly 221 Kbits of on‑chip RAM with flexible I/O and analog clocking resources for reconfigurable system designs.

Designed for commercial applications, the device delivers non‑volatile, instant‑on operation and supports in‑field reconfiguration and low‑power sleep modes, making it suitable for system control, interface logic and memory‑interfacing functions where fast startup, secure configuration and flexible I/O are required.

Key Features

• Core Logic  Approximately 10,000 logic elements (cells) organized for reconfigurable logic implementation.
• Embedded Memory  Approximately 221 Kbits of on‑chip RAM for distributed and block memory usage.
• I/O and Interfaces  Up to 188 I/Os support a wide range of interface requirements in a single device footprint.
• Non‑volatile, Instant‑on Configuration  ispXP technology delivers instant‑on startup in microseconds and eliminates the need for external configuration memory.
• In‑field Reconfiguration  TransFR™ Reconfiguration allows in‑field logic updates while the system operates; designs can be reconfigured via system configuration or JTAG.
• Low‑Power Operation  Sleep mode provides substantial static current reduction for power‑sensitive applications.
• Clocking  Up to four analog PLLs per device enable clock multiply/divide and phase shifting for complex timing requirements.
• Dedicated DDR Memory Support  Implements interfaces up to DDR333 for direct memory controller implementations.
• Flexible Voltage Support  Operates across a broad supply range (1.71 V to 3.465 V) to accommodate multiple I/O standards and system rails.
• Package & Mounting  256‑ball fpBGA (256‑FPBGA, 17 × 17 mm) package, surface‑mount assembly for compact board designs.
• System Support & Testability  IEEE 1149.1 boundary‑scan and integrated trace/logic analyzer capabilities for board‑level debug and bring‑up.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• System Control and Glue Logic  Implement control, protocol translation and custom logic to tie multiple subsystems together with fast startup and reconfigurability.
• Memory Interface & Bridge  Use the device’s DDR support and PLL resources to build memory controllers and high‑speed interface bridges.
• In‑field Updatable Systems  Deploy products that require secure, non‑volatile configuration and field updates without external configuration storage.
• Prototyping & IP Integration  Leverage embedded memory and available IP to accelerate development of complex, reprogrammable designs.

Unique Advantages

• Instant‑on Non‑volatile Architecture: Eliminates external configuration memory and enables microsecond‑scale startup for faster system availability.
• Flexible I/O and Voltage Range: Broad supply range and 188 I/Os reduce the need for level‑shifters and simplify multi‑voltage interfacing.
• In‑field Reconfiguration: TransFR and JTAG programmable options allow iterative updates and repairs without board removal.
• Integrated Clocking: Multiple PLLs provide on‑device clock management to meet diverse timing and synchronization needs.
• Compact, Surface‑Mount Package: 256‑ball fpBGA (17 × 17 mm) balances I/O density and PCB area for space‑constrained designs.
• Designed for System Bring‑up: Boundary scan and internal trace capabilities streamline testing and debug during development.

Why Choose LFXP10C-4F256C?

The LFXP10C-4F256C delivers a balanced combination of logic capacity, embedded memory and flexible I/O in a non‑volatile, reconfigurable FPGA. Its instant‑on behavior, sleep mode and in‑field reconfiguration support are tailored to commercial systems that need fast startup, secure configuration and the ability to evolve in the field.

This device is well suited to engineers and procurement teams building mid‑density, reconfigurable systems that require dependable clocking, DDR memory interfacing and compact package integration, all backed by a family architecture that supports migration across densities.

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