LFXP10C-4FN256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 221184 10000 256-BGA

Quantity 1,213 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1216Number of Logic Elements/Cells10000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of LFXP10C-4FN256C – XP Field Programmable Gate Array (FPGA) IC 188 221184 10000 256-BGA

The LFXP10C-4FN256C is a commercial-grade, non-volatile FPGA delivering 10,000 logic elements and a high I/O count in a compact 256-ball FPBGA (17 × 17 mm) package. Its architecture combines reconfigurable logic, embedded memory, flexible I/O support and on-chip clocking to address a wide range of commercial embedded system designs.

Key capabilities include instant-on non-volatile configuration, in-field reconfiguration, approximately 221,184 bits of on-chip RAM, 188 user I/Os and a supply voltage range of 1.71 V to 3.465 V, making the device suitable for high-density interfacing and control tasks in commercial applications.

Key Features

  • Core Logic Approximately 10,000 logic elements with 1,216 logic blocks (PFU/PFF total) to implement complex combinational and sequential logic.
  • Embedded Memory Approximately 221,184 bits (≈216 Kbits) of on-chip RAM supporting both distributed and block memory usage for buffering, FIFOs and local data storage.
  • I/O Flexibility 188 user I/Os with programmable buffers supporting multiple signaling standards for broad interface compatibility.
  • Non‑volatile, Instant‑On Configuration Built-in non-volatile configuration removes the need for external configuration memory and enables microsecond-scale power-up.
  • In‑field Reconfiguration (TransFR) Supports run-time logic updates for in-field feature upgrades and bug fixes without full system interruption.
  • Low‑Power Mode Sleep mode provides a substantial reduction in static current, enabling lower standby power consumption.
  • Clocking Up to four analog PLLs for clock multiplication, division and phase shifting to support flexible timing architectures.
  • Memory Interface Dedicated DDR memory support up to DDR333 for external memory interfacing where high bandwidth is required.
  • Package & Mounting 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact, high-density board designs.
  • Commercial Temperature & Supply Rated for 0 °C to 85 °C operation and a supply voltage range of 1.71 V to 3.465 V.
  • Standards & System Support IEEE 1149.1 boundary scan, JTAG-based programming and onboard oscillator support, plus internal trace/logic analysis capabilities.
  • Compliance RoHS compliant.

Typical Applications

  • Commercial Embedded Systems Implement control logic, peripheral aggregation and custom interfaces using the device’s 10,000 logic elements and 188 I/Os.
  • Communications & Interface Bridging Leverage flexible programmable I/O standards and DDR memory support to bridge protocols and handle data framing or buffering tasks.
  • Imaging & Signal Processing Use on-chip block and distributed RAM for line buffering and local data storage in compact imaging or sensor-processing modules.
  • Test, Measurement & Instrumentation Deploy the FPGA for timing-critical logic, custom I/O handling and in-field firmware updates without requiring external configuration memory.

Unique Advantages

  • Non‑volatile, instant-on configuration: Eliminates external configuration flash and enables rapid power-up for systems that need immediate responsiveness.
  • In‑field reconfiguration capability: TransFR enables targeted updates to deployed hardware logic, reducing the need for board recalls or hardware swaps.
  • High I/O density in a compact package: 188 user I/Os in a 256-FPBGA (17 × 17 mm) footprint simplifies board routing while supporting numerous interfaces.
  • Integrated clocking and DDR support: Up to four PLLs plus dedicated DDR interface options streamline memory timing and high-speed data paths.
  • Reduced BOM and system complexity: On-chip non-volatile configuration, embedded RAM and programmable I/O lower external component counts and simplify system design.
  • Commercial-grade readiness: Rated for 0 °C to 85 °C operation with RoHS compliance for standard commercial deployments.

Why Choose LFXP10C-4FN256C?

The LFXP10C-4FN256C delivers a balanced mix of logic density, embedded memory and flexible I/O in a non-volatile FPGA that removes the need for external configuration memory. Its instant-on behavior, in-field reconfiguration capability and integrated clocking make it well suited to commercial designs that require fast start-up, remote updates and diverse interface support.

This device is a practical choice for engineers building compact, high-density commercial systems that demand reconfigurable logic, on-chip RAM and robust interface options while keeping BOM complexity and external components to a minimum.

Request a quote or contact sales to discuss availability, lead times and volume pricing for the LFXP10C-4FN256C.

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