LFXP10C-4FN256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 221184 10000 256-BGA |
|---|---|
| Quantity | 1,213 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1216 | Number of Logic Elements/Cells | 10000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of LFXP10C-4FN256C – XP Field Programmable Gate Array (FPGA) IC 188 221184 10000 256-BGA
The LFXP10C-4FN256C is a commercial-grade, non-volatile FPGA delivering 10,000 logic elements and a high I/O count in a compact 256-ball FPBGA (17 × 17 mm) package. Its architecture combines reconfigurable logic, embedded memory, flexible I/O support and on-chip clocking to address a wide range of commercial embedded system designs.
Key capabilities include instant-on non-volatile configuration, in-field reconfiguration, approximately 221,184 bits of on-chip RAM, 188 user I/Os and a supply voltage range of 1.71 V to 3.465 V, making the device suitable for high-density interfacing and control tasks in commercial applications.
Key Features
- Core Logic Approximately 10,000 logic elements with 1,216 logic blocks (PFU/PFF total) to implement complex combinational and sequential logic.
- Embedded Memory Approximately 221,184 bits (≈216 Kbits) of on-chip RAM supporting both distributed and block memory usage for buffering, FIFOs and local data storage.
- I/O Flexibility 188 user I/Os with programmable buffers supporting multiple signaling standards for broad interface compatibility.
- Non‑volatile, Instant‑On Configuration Built-in non-volatile configuration removes the need for external configuration memory and enables microsecond-scale power-up.
- In‑field Reconfiguration (TransFR) Supports run-time logic updates for in-field feature upgrades and bug fixes without full system interruption.
- Low‑Power Mode Sleep mode provides a substantial reduction in static current, enabling lower standby power consumption.
- Clocking Up to four analog PLLs for clock multiplication, division and phase shifting to support flexible timing architectures.
- Memory Interface Dedicated DDR memory support up to DDR333 for external memory interfacing where high bandwidth is required.
- Package & Mounting 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact, high-density board designs.
- Commercial Temperature & Supply Rated for 0 °C to 85 °C operation and a supply voltage range of 1.71 V to 3.465 V.
- Standards & System Support IEEE 1149.1 boundary scan, JTAG-based programming and onboard oscillator support, plus internal trace/logic analysis capabilities.
- Compliance RoHS compliant.
Typical Applications
- Commercial Embedded Systems Implement control logic, peripheral aggregation and custom interfaces using the device’s 10,000 logic elements and 188 I/Os.
- Communications & Interface Bridging Leverage flexible programmable I/O standards and DDR memory support to bridge protocols and handle data framing or buffering tasks.
- Imaging & Signal Processing Use on-chip block and distributed RAM for line buffering and local data storage in compact imaging or sensor-processing modules.
- Test, Measurement & Instrumentation Deploy the FPGA for timing-critical logic, custom I/O handling and in-field firmware updates without requiring external configuration memory.
Unique Advantages
- Non‑volatile, instant-on configuration: Eliminates external configuration flash and enables rapid power-up for systems that need immediate responsiveness.
- In‑field reconfiguration capability: TransFR enables targeted updates to deployed hardware logic, reducing the need for board recalls or hardware swaps.
- High I/O density in a compact package: 188 user I/Os in a 256-FPBGA (17 × 17 mm) footprint simplifies board routing while supporting numerous interfaces.
- Integrated clocking and DDR support: Up to four PLLs plus dedicated DDR interface options streamline memory timing and high-speed data paths.
- Reduced BOM and system complexity: On-chip non-volatile configuration, embedded RAM and programmable I/O lower external component counts and simplify system design.
- Commercial-grade readiness: Rated for 0 °C to 85 °C operation with RoHS compliance for standard commercial deployments.
Why Choose LFXP10C-4FN256C?
The LFXP10C-4FN256C delivers a balanced mix of logic density, embedded memory and flexible I/O in a non-volatile FPGA that removes the need for external configuration memory. Its instant-on behavior, in-field reconfiguration capability and integrated clocking make it well suited to commercial designs that require fast start-up, remote updates and diverse interface support.
This device is a practical choice for engineers building compact, high-density commercial systems that demand reconfigurable logic, on-chip RAM and robust interface options while keeping BOM complexity and external components to a minimum.
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