LFXP10C-5F256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 221184 10000 256-BGA |
|---|---|
| Quantity | 541 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1216 | Number of Logic Elements/Cells | 10000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of LFXP10C-5F256C – XP Field Programmable Gate Array (FPGA), 10,000 Logic Elements, 188 I/O, 256-BGA
The LFXP10C-5F256C is a non-volatile XP family FPGA in a 256-ball fpBGA (17 × 17 mm) package offering 10,000 logic elements and 188 user I/Os. Built for commercial-grade systems, it combines instant-on non-volatile configuration, reconfigurable logic and on-chip embedded memory to enable compact, flexible digital designs.
Key use cases include system-level glue logic, memory and interface control, and in-field updates where rapid configuration, a wide I/O set and flexible voltage support are required. The device supports multiple supply levels and on-chip system features that simplify integration into embedded systems.
Key Features
- Core Architecture Non-volatile XP-family FPGA architecture with instant-on capability and reconfigurable SRAM-based logic.
- Logic Resources Approximately 10,000 logic elements and 1,216 PFU/PFF units to implement medium-density digital designs.
- Embedded Memory Approximately 0.22 Mbits of on-chip RAM (221,184 bits) for block and distributed memory requirements.
- I/O Flexibility 188 user I/O pins in a 256-ball fpBGA package to support broad interface requirements and high pin-count designs.
- Reconfiguration and Security Non-volatile configuration with instant-on, in-system reconfiguration (TFR) and JTAG/system configuration ports for secure and field-updatable designs.
- Clocking Up to four analog PLLs for clock multiply, divide and phase shifting within system clock trees.
- Power and Voltage Flexible supply range from 1.71 V to 3.465 V to support mixed-voltage system environments.
- Low-Power Modes Sleep mode capability enabling significant static current reduction for power-sensitive applications.
- Package & Mounting 256-ball fpBGA (17 × 17 mm) supplier package (256-FPBGA) with surface-mount mounting for compact PCB footprints.
- Operating Conditions Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
- System Support IEEE 1149.1 boundary-scan plus ispTRACY internal logic analyzer capability and an onboard oscillator for configuration.
- Memory Interface Support Dedicated DDR memory interface capability for systems requiring external DDR connectivity (device supports DDR up to DDR333 as part of family features).
Typical Applications
- Interface Bridging and Protocol Conversion Use the 188 I/Os and flexible voltage support to implement protocol translation and board-level glue logic.
- Memory Controller and Buffering Leverage the on-chip embedded RAM and dedicated DDR support for external memory interface logic and buffering.
- Embedded System Control Instant-on configuration and sleep modes enable responsive control functions with lower standby power.
- Field-Upgradable Logic TransFR reconfiguration and JTAG/system configuration ports allow in-field updates and iterative product enhancements.
Unique Advantages
- Instant-on Non-Volatile Architecture: Eliminates the need for external configuration memory and enables immediate startup of logic on power-up.
- Balanced Logic and Memory Resources: Approximately 10,000 logic elements combined with ~0.22 Mbits of embedded memory provide a balanced platform for compute and data buffering.
- Flexible I/O and Voltage Support: Wide supply range (1.71–3.465 V) and 188 I/Os simplify integration with mixed-voltage peripherals and legacy interfaces.
- In-Field Reconfiguration: TransFR capability and system configuration access let you update or refine logic without board-level changes.
- Onboard System Diagnostics: IEEE 1149.1 boundary-scan and ispTRACY internal logic analyzer support aid debug and manufacturing test.
- Compact, Surface-Mount Package: 256-ball fpBGA in a 17 × 17 mm footprint supports high I/O density in space-constrained PCBs.
Why Choose LFXP10C-5F256C?
The LFXP10C-5F256C delivers a commercially graded FPGA option for designers who need instant-on, non-volatile configuration, mid-range logic capacity and significant I/O count in a compact fpBGA package. Its combination of approximately 10,000 logic elements, ~0.22 Mbits of embedded memory and 188 I/Os makes it well suited to system-level control, interface bridging and memory interface functions where in-field reconfiguration and secure configuration are important.
Choosing this device provides a scalable, reprogrammable platform supported by on-chip clocking, boundary-scan and internal logic analysis features that streamline development, testing and field updates—helping reduce BOM complexity and accelerate time to market.
If you would like pricing, availability or to submit a quote request for LFXP10C-5F256C, request a quote or submit your RFQ and our team will respond promptly.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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