LFXP10C-5F256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 221184 10000 256-BGA

Quantity 541 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1216Number of Logic Elements/Cells10000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of LFXP10C-5F256C – XP Field Programmable Gate Array (FPGA), 10,000 Logic Elements, 188 I/O, 256-BGA

The LFXP10C-5F256C is a non-volatile XP family FPGA in a 256-ball fpBGA (17 × 17 mm) package offering 10,000 logic elements and 188 user I/Os. Built for commercial-grade systems, it combines instant-on non-volatile configuration, reconfigurable logic and on-chip embedded memory to enable compact, flexible digital designs.

Key use cases include system-level glue logic, memory and interface control, and in-field updates where rapid configuration, a wide I/O set and flexible voltage support are required. The device supports multiple supply levels and on-chip system features that simplify integration into embedded systems.

Key Features

  • Core Architecture Non-volatile XP-family FPGA architecture with instant-on capability and reconfigurable SRAM-based logic.
  • Logic Resources Approximately 10,000 logic elements and 1,216 PFU/PFF units to implement medium-density digital designs.
  • Embedded Memory Approximately 0.22 Mbits of on-chip RAM (221,184 bits) for block and distributed memory requirements.
  • I/O Flexibility 188 user I/O pins in a 256-ball fpBGA package to support broad interface requirements and high pin-count designs.
  • Reconfiguration and Security Non-volatile configuration with instant-on, in-system reconfiguration (TFR) and JTAG/system configuration ports for secure and field-updatable designs.
  • Clocking Up to four analog PLLs for clock multiply, divide and phase shifting within system clock trees.
  • Power and Voltage Flexible supply range from 1.71 V to 3.465 V to support mixed-voltage system environments.
  • Low-Power Modes Sleep mode capability enabling significant static current reduction for power-sensitive applications.
  • Package & Mounting 256-ball fpBGA (17 × 17 mm) supplier package (256-FPBGA) with surface-mount mounting for compact PCB footprints.
  • Operating Conditions Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
  • System Support IEEE 1149.1 boundary-scan plus ispTRACY internal logic analyzer capability and an onboard oscillator for configuration.
  • Memory Interface Support Dedicated DDR memory interface capability for systems requiring external DDR connectivity (device supports DDR up to DDR333 as part of family features).

Typical Applications

  • Interface Bridging and Protocol Conversion Use the 188 I/Os and flexible voltage support to implement protocol translation and board-level glue logic.
  • Memory Controller and Buffering Leverage the on-chip embedded RAM and dedicated DDR support for external memory interface logic and buffering.
  • Embedded System Control Instant-on configuration and sleep modes enable responsive control functions with lower standby power.
  • Field-Upgradable Logic TransFR reconfiguration and JTAG/system configuration ports allow in-field updates and iterative product enhancements.

Unique Advantages

  • Instant-on Non-Volatile Architecture: Eliminates the need for external configuration memory and enables immediate startup of logic on power-up.
  • Balanced Logic and Memory Resources: Approximately 10,000 logic elements combined with ~0.22 Mbits of embedded memory provide a balanced platform for compute and data buffering.
  • Flexible I/O and Voltage Support: Wide supply range (1.71–3.465 V) and 188 I/Os simplify integration with mixed-voltage peripherals and legacy interfaces.
  • In-Field Reconfiguration: TransFR capability and system configuration access let you update or refine logic without board-level changes.
  • Onboard System Diagnostics: IEEE 1149.1 boundary-scan and ispTRACY internal logic analyzer support aid debug and manufacturing test.
  • Compact, Surface-Mount Package: 256-ball fpBGA in a 17 × 17 mm footprint supports high I/O density in space-constrained PCBs.

Why Choose LFXP10C-5F256C?

The LFXP10C-5F256C delivers a commercially graded FPGA option for designers who need instant-on, non-volatile configuration, mid-range logic capacity and significant I/O count in a compact fpBGA package. Its combination of approximately 10,000 logic elements, ~0.22 Mbits of embedded memory and 188 I/Os makes it well suited to system-level control, interface bridging and memory interface functions where in-field reconfiguration and secure configuration are important.

Choosing this device provides a scalable, reprogrammable platform supported by on-chip clocking, boundary-scan and internal logic analysis features that streamline development, testing and field updates—helping reduce BOM complexity and accelerate time to market.

If you would like pricing, availability or to submit a quote request for LFXP10C-5F256C, request a quote or submit your RFQ and our team will respond promptly.

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