LFXP10C-5FN388C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA |
|---|---|
| Quantity | 1,818 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 244 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1216 | Number of Logic Elements/Cells | 10000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of LFXP10C-5FN388C – XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA
The LFXP10C-5FN388C is a member of the LatticeXP family of non-volatile FPGAs, combining reconfigurable logic, embedded memory and high-performance I/Os in a single surface-mount 388-ball BGA package. It targets designs that require instant-on configurability, flexible I/O support and on-chip memory for mid-density programmable logic implementations.
Built around the LatticeXP architecture, this device provides 10,000 logic elements, 244 I/Os and 221,184 bits of on-chip RAM, making it suitable for applications that need reprogrammable logic, memory resources and a broad supply voltage range.
Key Features
- Non-volatile, instant-on architecture — LatticeXP family technology provides configuration without external memory and fast power-up.
- Reconfiguration and system update — Supports in-field reconfiguration capabilities for design updates while deployed.
- Low-power modes — Sleep mode capability enables significant static current reduction for power-sensitive designs.
- Logic resources — 10,000 logic elements for mid-density implementations and 1,216 logic blocks.
- On-chip memory — 221,184 total RAM bits of embedded and distributed memory for data buffering, state machines and local storage.
- I/O and package — 244 user I/Os in a 388-ball FBGA (23 × 23 mm) surface-mount package, supporting complex pinouts in a compact footprint.
- Flexible supply range — Operates from 1.71 V to 3.465 V to accommodate mixed-voltage system domains.
- Commercial temperature grade — Rated for 0 °C to 85 °C for standard commercial applications.
- Standards and system support — Family-level features include boundary-scan (IEEE 1149.1), PLLs and on-chip configuration support.
- RoHS compliant — Meets lead-free and environmental directives for commercial electronics.
Typical Applications
- Protocol bridging and interface control — Flexible I/O and abundant user I/Os enable implementation of protocol converters and interface logic without external glue.
- Embedded system controllers — On-chip memory and reconfigurable logic support control tasks, custom state machines and local data handling.
- Memory interface logic — Dedicated DDR interface support at the family level enables use in designs requiring external synchronous DRAM controllers and buffering.
Unique Advantages
- Integrated non-volatile configuration: Eliminates the need for external configuration memory, simplifying BOM and enabling fast, secure power-up.
- Instant-on behavior: Powers up in microseconds to accelerate system boot and enable immediate operation after power application.
- Field reprogrammability: Supports in-system updates to logic, reducing maintenance cost and enabling feature upgrades in deployed systems.
- Compact, high-pin-count package: 388-ball FBGA (23 × 23 mm) provides 244 I/Os in a small footprint for dense board designs.
- Broad supply compatibility: 1.71 V–3.465 V range enables integration into systems with multiple voltage domains.
- Commercial-grade reliability with RoHS compliance: Suitable for mainstream embedded and consumer applications where commercial temperature range is appropriate.
Why Choose LFXP10C-5FN388C?
The LFXP10C-5FN388C delivers a balanced combination of reconfigurable logic, on-chip RAM and flexible I/O in a compact 388-ball BGA package. Its non-volatile architecture and instant-on behavior reduce system-level complexity and eliminate external configuration memory, while field reconfiguration capabilities allow in-system updates and feature evolution.
This device is well suited to customers and designs that require mid-density programmable logic with substantial I/O and embedded memory, within a commercial temperature range and RoHS-compliant supply chain requirements. The LatticeXP family features—such as sleep mode, PLLs and boundary-scan—support practical system integration and lifecycle flexibility for a variety of embedded applications.
Request a quote or submit an inquiry to receive pricing, availability and additional ordering information for the LFXP10C-5FN388C.

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