LFXP10E-3FN388I

The LFXP10E-3FN388I is a non-volatile LatticeXP family FPGA that integrates approximately 10,000 logic elements with on-chip embedded memory and a high-density 388-ball BGA package. Targeted for industrial applications, the device provides 244 I/Os, a compact 23 × 23 mm fpBGA package, and an operating temperature range of −40 °C to 100 °C.

This device combines instant-on non-volatile configuration, in-field reconfiguration capability, and multiple clocking resources to support embedded control, interface bridging, and industrial system designs requiring reconfigurability and robust I/O support.

Key Features

• Core Logic  Approximately 10,000 logic elements to implement mid-density logic and control functions.
• Embedded Memory  Total on-chip RAM of 221,184 bits (approximately 0.22 Mbits) for distributed and block memory needs.
• I/O Capacity & Flexibility  244 I/O pins in the 388-ball fpBGA package, with programmable I/O buffers supporting a wide range of interfaces (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS).
• Non-Volatile, Instant-On Architecture  Internal non-volatile configuration removes the need for external configuration memory and enables power-up in microseconds.
• In-Field Reconfiguration  TransFR reconfiguration and reprogrammable SRAM logic allow updates to FPGA logic while the system is operating.
• Clocking  Four analog sysCLOCK PLLs for clock multiply/divide and phase shifting to support complex timing requirements.
• Dedicated DDR Memory Support  Implements interfaces up to DDR333 (166 MHz) to support external high-speed memory subsystems.
• Power and Low-Power Modes  Sleep mode enables significant static current reduction (up to 1000×) for low-power standby operation.
• Power Supply & Mounting  Specified supply voltage range of 1.14 V to 1.26 V. Surface-mount 388-BBGA (388-FPBGA, 23×23 mm) package for compact PCB integration.
• Industrial Grade  Qualified for industrial temperature operation from −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control Systems  Implement motor control logic, sensor interfacing, and field I/O aggregation with robust temperature and I/O capacity.
• Communication & Interface Bridging  Use the device's flexible I/O standards and DDR interface capability to bridge between disparate protocol domains or add custom protocol handling.
• Embedded Processing & Custom Acceleration  Deploy mid-density logic and embedded RAM for offloading tasks, custom datapaths, and control-plane functions in embedded platforms.
• In-Field Updatable Systems  Systems that require in-service logic updates can leverage TransFR reconfiguration and fast SRAM reprogramming.

Unique Advantages

• Instant-on, non-volatile configuration: Eliminate external configuration memory and enable microsecond power-up for faster system availability.
• Mid-density integration: ~10,000 logic elements with ~221,184 bits of embedded RAM provides a balanced mix of logic and memory for control and interface tasks.
• Wide I/O compatibility: Programmable sysIO buffers support many common signaling standards, reducing the need for level translators or external PHYs.
• Field reconfigurability: In-field TransFR updates and fast SRAM reconfiguration let you iterate or upgrade logic without full system downtime.
• Compact, high-density package: 388-ball fpBGA (23×23 mm) enables dense PCB designs while offering 244 available I/Os.
• Industrial temperature range: Designed for −40 °C to 100 °C operation to meet typical industrial environment requirements.

Why Choose LFXP10E-3FN388I?

The LFXP10E-3FN388I brings the LatticeXP family’s non-volatile, instantly configurable architecture into a compact 388-ball fpBGA package with 244 I/Os, approximately 10,000 logic elements, and about 221,184 bits of embedded memory. Its combination of flexible I/O standards, on-chip PLLs, DDR interface support, and in-field reconfiguration makes it well suited for industrial and embedded designs that require reliable, reprogrammable logic in constrained form factors.

Choose this device when you need a mid-density FPGA with instant-on behavior, robust I/O options, and industrial temperature capability—offering scalability within the LatticeXP family and design flexibility for long-term product updates.

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