LFXP10E-4FN388C

IC FPGA 244 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA

Quantity 28 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case388-BBGANumber of I/O244Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1216Number of Logic Elements/Cells10000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of LFXP10E-4FN388C – LatticeXP FPGA, 10K Logic Elements, 388-BBGA

The LFXP10E-4FN388C is a non-volatile LatticeXP family FPGA featuring 10,000 logic elements and approximately 0.22 Mbits of on-chip RAM. Built for applications that require instant-on behavior, flexible I/O and in-field reconfiguration, this device combines embedded and distributed memory with programmable I/O and multi-voltage operation for a wide range of commercial embedded designs.

Key Features

  • Core & Architecture 10,000 logic elements organized across 1,216 logic blocks, providing a balanced logic fabric for mid-density designs.
  • Non-volatile, Instant-on ispXP™-based non-volatile architecture with instant-on operation and no requirement for external configuration memory.
  • Embedded and Distributed Memory Total on-chip RAM of 221,184 bits (approximately 0.22 Mbits) combining block and distributed memory resources for buffering and state storage.
  • Flexible I/O & Interfaces 244 I/Os supported by a programmable sysIO™ buffer. Family-level I/O protocol support includes LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
  • Clocking Up to four analog PLLs per device for clock multiply, divide and phase-shifting functions.
  • Reconfiguration & In-field Updates TransFR™ Reconfiguration (TFR) enables in-field logic updates while the system operates; SRAM logic can be reconfigured in milliseconds. Devices also support sleep mode to reduce static current by up to 1000×.
  • Dedicated Memory Interface Family-level support for dedicated DDR memory interfaces up to DDR333 (166 MHz) for external memory connectivity.
  • Package & Mounting 388-ball fpBGA package (388-BBGA, supplier package: 388-FPBGA, 23 × 23 mm), surface-mount device suitable for compact board layouts.
  • Electrical & Environmental Core voltage supply range 1.14 V to 1.26 V and RoHS-compliant. Commercial-grade operating temperature from 0 °C to 85 °C.

Typical Applications

  • Embedded Control & Gateware Use as a mid-density FPGA for control logic, protocol bridging and custom state machines where instant-on and reconfigurability accelerate system startup and updates.
  • High‑Speed Interfaces Implement DDR interfaces and high-speed serial or parallel I/O protocols using the programmable sysIO buffer and dedicated PLL resources.
  • In‑field Upgradable Systems Systems that require live updates or iterative feature upgrades can leverage TransFR reconfiguration to modify logic while the system remains operational.
  • Prototyping & Density Migration Mid-range FPGA density suitable for prototype designs and as a migration step within the LatticeXP family.

Unique Advantages

  • Instant-on, non-volatile operation: Eliminates the need for external configuration memory and reduces system boot time to microseconds.
  • In-field reconfigurability: TransFR and fast SRAM reconfiguration enable rapid product updates and field fixes without external tools.
  • Flexible I/O support: Broad protocol support from single-ended LVCMOS to differential LVDS/LVPECL and specialized standards simplifies board-level interface design.
  • Integrated clock management: Four analog PLLs provide on-chip clock multiplication, division and phase control for complex timing domains.
  • Compact BGA package: 388-ball fpBGA (23 × 23 mm) offers a space-efficient footprint for applications with dense routing and high I/O counts.
  • Commercial temperature and RoHS compliance: Suitable for mainstream commercial designs with standard environmental and regulatory requirements.

Why Choose LFXP10E-4FN388C?

The LFXP10E-4FN388C delivers a mid-density, non-volatile FPGA platform that balances programmable logic, embedded memory and extensive I/O capability in a compact 388-BBGA package. Its instant-on behavior, in-field reconfiguration features and on-chip clocking resources make it well suited for embedded systems that need quick boot, flexible interfaces and the ability to evolve in the field.

Designed for commercial applications, this device is appropriate for engineers seeking to reduce BOM complexity by eliminating external configuration memory while retaining programmable flexibility and a robust set of I/O and memory resources.

Request a quote or submit an inquiry for pricing and availability to evaluate the LFXP10E-4FN388C for your next design.

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