LFXP10E-5FN388C

IC FPGA 244 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA

Quantity 353 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case388-BBGANumber of I/O244Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1216Number of Logic Elements/Cells10000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of LFXP10E-5FN388C – XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA

The LFXP10E-5FN388C is a LatticeXP family FPGA offering a non-volatile, infinitely reconfigurable architecture optimized for commercial embedded designs. It integrates 10,000 logic elements, approximately 0.22 Mbits of on-chip embedded memory, and up to 244 I/Os in a 388-ball fpBGA (23 × 23 mm) package.

Designed for applications that require instant-on behavior, flexible I/O standards and in-field reconfiguration, this device delivers configurable logic, embedded block RAM and multiple clocking resources while operating over a commercial temperature range of 0 °C to 85 °C and a core supply of 1.14 V to 1.26 V.

Key Features

  • Core Logic — 10,000 logic elements provide the programmable fabric for complex glue logic, control and signal processing.
  • Embedded Memory — Approximately 0.22 Mbits of on-chip RAM (total RAM bits: 221,184) with both embedded block RAM and distributed memory options.
  • I/O and Interfaces — Up to 244 I/Os in a 388-ball fpBGA; the LatticeXP family supports a wide range of I/O standards including multiple LVCMOS levels, LVDS and common memory interfaces.
  • Non-Volatile, Instant-On Architecture — Family-level features include non-volatile configuration that eliminates the need for external configuration memory and enables rapid power-up.
  • In-Field Reconfiguration — Supports TransFR reconfiguration for in-system logic updates while the system remains operational (family feature).
  • Low-Power Modes — Family supports a sleep mode capable of large static current reduction for power-sensitive applications.
  • Clocking — Up to four analog PLLs available per device for clock multiply/divide and phase shifting (family feature).
  • Package & Mounting — Surface-mount 388-ball fpBGA (388-BBGA / 388-FPBGA, 23 × 23 mm) for compact board integration.
  • Commercial Grade — Rated for 0 °C to 85 °C operating temperature.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Embedded Control — Implement control logic, protocol bridging and system glue in compact commercial products using the device’s programmable fabric and abundant I/O.
  • Communications & Networking — Use instant-on and in-field reconfiguration to deploy field-updatable logic and interface handling in communications equipment.
  • Memory Interface & Buffering — Leverage embedded RAM and family DDR support for buffering and memory controller functions in data-path designs.
  • Consumer & Commercial Electronics — Rapid power-up and flexible I/O make the device suitable for products requiring fast boot and multiple interface standards.

Unique Advantages

  • Non-volatile instant-on capability: Eliminates external configuration memory and enables rapid power-up.
  • Field reconfigurability: TransFR support lets you update logic in-system, reducing service cycles and enabling feature upgrades.
  • Flexible I/O support: Multiple supported logic levels and high-performance serial/parallel interfaces simplify board-level design and reduce interface translation requirements.
  • Compact, high-density package: 388-ball fpBGA delivers high I/O count and dense logic in a 23 × 23 mm footprint for space-constrained designs.
  • Power management features: Sleep mode capability provides significant static current reduction for low-power operation.
  • Commercial-grade robustness: Specified for 0 °C to 85 °C operation to meet mainstream commercial deployment needs.

Why Choose LFXP10E-5FN388C?

The LFXP10E-5FN388C pairs a reconfigurable non-volatile architecture with a balanced mix of logic density, embedded memory and I/O capability to address a broad range of commercial embedded designs. Its instant-on behavior, in-field reconfiguration capability and flexible I/O support reduce system complexity and accelerate development cycles.

This device is well suited to teams building compact, upgradeable products that benefit from fast boot, on-chip memory resources and a high I/O count in a compact fpBGA package. The LatticeXP family ecosystem and documented family features provide a clear upgrade path and support for scalable designs.

Request a quote or submit an inquiry to receive pricing and availability for the LFXP10E-5FN388C.

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