LFXP10E-5FN388C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA |
|---|---|
| Quantity | 353 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 244 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1216 | Number of Logic Elements/Cells | 10000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of LFXP10E-5FN388C – XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA
The LFXP10E-5FN388C is a LatticeXP family FPGA offering a non-volatile, infinitely reconfigurable architecture optimized for commercial embedded designs. It integrates 10,000 logic elements, approximately 0.22 Mbits of on-chip embedded memory, and up to 244 I/Os in a 388-ball fpBGA (23 × 23 mm) package.
Designed for applications that require instant-on behavior, flexible I/O standards and in-field reconfiguration, this device delivers configurable logic, embedded block RAM and multiple clocking resources while operating over a commercial temperature range of 0 °C to 85 °C and a core supply of 1.14 V to 1.26 V.
Key Features
- Core Logic — 10,000 logic elements provide the programmable fabric for complex glue logic, control and signal processing.
- Embedded Memory — Approximately 0.22 Mbits of on-chip RAM (total RAM bits: 221,184) with both embedded block RAM and distributed memory options.
- I/O and Interfaces — Up to 244 I/Os in a 388-ball fpBGA; the LatticeXP family supports a wide range of I/O standards including multiple LVCMOS levels, LVDS and common memory interfaces.
- Non-Volatile, Instant-On Architecture — Family-level features include non-volatile configuration that eliminates the need for external configuration memory and enables rapid power-up.
- In-Field Reconfiguration — Supports TransFR reconfiguration for in-system logic updates while the system remains operational (family feature).
- Low-Power Modes — Family supports a sleep mode capable of large static current reduction for power-sensitive applications.
- Clocking — Up to four analog PLLs available per device for clock multiply/divide and phase shifting (family feature).
- Package & Mounting — Surface-mount 388-ball fpBGA (388-BBGA / 388-FPBGA, 23 × 23 mm) for compact board integration.
- Commercial Grade — Rated for 0 °C to 85 °C operating temperature.
- RoHS Compliant — Meets RoHS environmental requirements.
Typical Applications
- Embedded Control — Implement control logic, protocol bridging and system glue in compact commercial products using the device’s programmable fabric and abundant I/O.
- Communications & Networking — Use instant-on and in-field reconfiguration to deploy field-updatable logic and interface handling in communications equipment.
- Memory Interface & Buffering — Leverage embedded RAM and family DDR support for buffering and memory controller functions in data-path designs.
- Consumer & Commercial Electronics — Rapid power-up and flexible I/O make the device suitable for products requiring fast boot and multiple interface standards.
Unique Advantages
- Non-volatile instant-on capability: Eliminates external configuration memory and enables rapid power-up.
- Field reconfigurability: TransFR support lets you update logic in-system, reducing service cycles and enabling feature upgrades.
- Flexible I/O support: Multiple supported logic levels and high-performance serial/parallel interfaces simplify board-level design and reduce interface translation requirements.
- Compact, high-density package: 388-ball fpBGA delivers high I/O count and dense logic in a 23 × 23 mm footprint for space-constrained designs.
- Power management features: Sleep mode capability provides significant static current reduction for low-power operation.
- Commercial-grade robustness: Specified for 0 °C to 85 °C operation to meet mainstream commercial deployment needs.
Why Choose LFXP10E-5FN388C?
The LFXP10E-5FN388C pairs a reconfigurable non-volatile architecture with a balanced mix of logic density, embedded memory and I/O capability to address a broad range of commercial embedded designs. Its instant-on behavior, in-field reconfiguration capability and flexible I/O support reduce system complexity and accelerate development cycles.
This device is well suited to teams building compact, upgradeable products that benefit from fast boot, on-chip memory resources and a high I/O count in a compact fpBGA package. The LatticeXP family ecosystem and documented family features provide a clear upgrade path and support for scalable designs.
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