LFXP15C-3FN256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA |
|---|---|
| Quantity | 491 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15C-3FN256C – XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA
The LFXP15C-3FN256C is a commercial-grade, non-volatile FPGA that integrates reconfigurable logic, embedded memory and flexible I/O in a 256-ball fpBGA package. It targets applications that require instant-on operation, in-field reconfiguration and a compact, surface-mount form factor.
Built on the LatticeXP family architecture, this device provides approximately 15,000 logic elements, extensive embedded RAM and 188 I/Os, enabling a balanced platform for communications, consumer and general-purpose embedded system designs that need on-chip memory and versatile I/O support.
Key Features
- Core Logic Approximately 15,000 logic elements and 1,932 PFU/PFF fabric resources for implementing mid-density logic and glue-logic functions.
- Embedded Memory Approximately 324 Kbits (331,776 bits) of on-chip RAM with both distributed and block memory options to support buffers, FIFOs and small data stores.
- I/O and Interfaces 188 user I/Os in a 256-ball fpBGA (17 × 17 mm) package, with programmable I/O buffer support across common standards listed for the LatticeXP family.
- Non-volatile Configuration Instant-on architecture with no external configuration memory required and protected bitstream storage for secure start-up and operation.
- In-field Reconfiguration Support for TransFR™ Reconfiguration (TFR) enabling logic updates while the system operates and rapid SRAM reconfiguration in milliseconds.
- Clocking Up to four analog PLLs on-device for clock multiplication, division and phase shifting to support complex timing regimes.
- Power and Modes Operates across a supply range of 1.71 V to 3.465 V and includes a sleep mode capability for significant static current reduction.
- Packaging and Temperature 256-FPBGA (17 × 17 mm) surface-mount package; commercial temperature grade with operating range 0 °C to 85 °C.
- System-Level Support Family-level features include IEEE 1149.1 boundary-scan and on-chip tools for configuration and embedded debug.
Typical Applications
- Communications and Networking Protocol adaptation, interface bridging and packet-processing logic that benefit from high I/O count and on-chip memory for buffering.
- Consumer Electronics User-interface control, peripheral bridging and feature upgrades where instant-on behavior and reprogrammability improve product flexibility.
- Embedded Control and Instrumentation Glue logic, signal aggregation and timing-critical tasks that use on-chip PLLs and embedded RAM for deterministic operation.
- Memory Interface Prototyping Designs requiring dedicated DDR support up to DDR333 and flexible I/O standards for memory and high-speed interfacing.
Unique Advantages
- Instant-on, non-volatile operation: Starts up without external configuration memory, simplifying system design and improving startup time.
- In-field logic updates: TransFR reconfiguration allows targeted logic changes while the system remains operational, reducing downtime for updates.
- Balanced integration: A mid-density FPGA with ~15,000 logic elements and ~324 Kbits of embedded RAM that reduces external component count for common embedded functions.
- Flexible clocking: Up to four PLLs provide on-chip clock management for multi-domain timing and phase control.
- High I/O density in a compact package: 188 I/Os in a 17 × 17 mm 256-FPBGA make the device suitable for board-level space-constrained designs.
- Commercial temperature rating: Designed for 0 °C to 85 °C operation to meet general-purpose application requirements.
Why Choose LFXP15C-3FN256C?
The LFXP15C-3FN256C offers a practical mid-density FPGA solution where non-volatile instant-on behavior, in-field reconfigurability and a high I/O count are required. Its combination of approximately 15,000 logic elements, roughly 324 Kbits of embedded RAM and four on-chip PLLs provides a flexible platform for communications, consumer and embedded control designs that need integrated memory and versatile interface options.
As a commercial-grade device in a compact 256-ball fpBGA, it is well suited to designers seeking scalable density within the LatticeXP family architecture, backed by family-level system features like boundary-scan and embedded configuration/debug capabilities.
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