LFXP15C-3FN256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA

Quantity 491 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15C-3FN256C – XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA

The LFXP15C-3FN256C is a commercial-grade, non-volatile FPGA that integrates reconfigurable logic, embedded memory and flexible I/O in a 256-ball fpBGA package. It targets applications that require instant-on operation, in-field reconfiguration and a compact, surface-mount form factor.

Built on the LatticeXP family architecture, this device provides approximately 15,000 logic elements, extensive embedded RAM and 188 I/Os, enabling a balanced platform for communications, consumer and general-purpose embedded system designs that need on-chip memory and versatile I/O support.

Key Features

  • Core Logic  Approximately 15,000 logic elements and 1,932 PFU/PFF fabric resources for implementing mid-density logic and glue-logic functions.
  • Embedded Memory  Approximately 324 Kbits (331,776 bits) of on-chip RAM with both distributed and block memory options to support buffers, FIFOs and small data stores.
  • I/O and Interfaces  188 user I/Os in a 256-ball fpBGA (17 × 17 mm) package, with programmable I/O buffer support across common standards listed for the LatticeXP family.
  • Non-volatile Configuration  Instant-on architecture with no external configuration memory required and protected bitstream storage for secure start-up and operation.
  • In-field Reconfiguration  Support for TransFR™ Reconfiguration (TFR) enabling logic updates while the system operates and rapid SRAM reconfiguration in milliseconds.
  • Clocking  Up to four analog PLLs on-device for clock multiplication, division and phase shifting to support complex timing regimes.
  • Power and Modes  Operates across a supply range of 1.71 V to 3.465 V and includes a sleep mode capability for significant static current reduction.
  • Packaging and Temperature  256-FPBGA (17 × 17 mm) surface-mount package; commercial temperature grade with operating range 0 °C to 85 °C.
  • System-Level Support  Family-level features include IEEE 1149.1 boundary-scan and on-chip tools for configuration and embedded debug.

Typical Applications

  • Communications and Networking  Protocol adaptation, interface bridging and packet-processing logic that benefit from high I/O count and on-chip memory for buffering.
  • Consumer Electronics  User-interface control, peripheral bridging and feature upgrades where instant-on behavior and reprogrammability improve product flexibility.
  • Embedded Control and Instrumentation  Glue logic, signal aggregation and timing-critical tasks that use on-chip PLLs and embedded RAM for deterministic operation.
  • Memory Interface Prototyping  Designs requiring dedicated DDR support up to DDR333 and flexible I/O standards for memory and high-speed interfacing.

Unique Advantages

  • Instant-on, non-volatile operation: Starts up without external configuration memory, simplifying system design and improving startup time.
  • In-field logic updates: TransFR reconfiguration allows targeted logic changes while the system remains operational, reducing downtime for updates.
  • Balanced integration: A mid-density FPGA with ~15,000 logic elements and ~324 Kbits of embedded RAM that reduces external component count for common embedded functions.
  • Flexible clocking: Up to four PLLs provide on-chip clock management for multi-domain timing and phase control.
  • High I/O density in a compact package: 188 I/Os in a 17 × 17 mm 256-FPBGA make the device suitable for board-level space-constrained designs.
  • Commercial temperature rating: Designed for 0 °C to 85 °C operation to meet general-purpose application requirements.

Why Choose LFXP15C-3FN256C?

The LFXP15C-3FN256C offers a practical mid-density FPGA solution where non-volatile instant-on behavior, in-field reconfigurability and a high I/O count are required. Its combination of approximately 15,000 logic elements, roughly 324 Kbits of embedded RAM and four on-chip PLLs provides a flexible platform for communications, consumer and embedded control designs that need integrated memory and versatile interface options.

As a commercial-grade device in a compact 256-ball fpBGA, it is well suited to designers seeking scalable density within the LatticeXP family architecture, backed by family-level system features like boundary-scan and embedded configuration/debug capabilities.

Request a quote or submit an inquiry to obtain pricing and availability for the LFXP15C-3FN256C.

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