LFXP15C-3F484I

The LFXP15C-3F484I is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs. It integrates approximately 15,000 logic elements, around 0.33 Mbits of on-chip RAM, and up to 300 user I/Os in a 484-ball BGA (23 × 23 mm) package.

Designed for industrial-grade applications, this device targets embedded and system designs that require instant-on operation, flexible I/O support, and field reconfiguration while delivering a broad supply voltage range and wide operating temperature range.

Key Features

• Non-volatile, instant-on architecture — Powers up in microseconds with no external configuration memory required, protecting design security by eliminating an external bitstream.
• Reconfigurable in-field — TransFR™ reconfiguration enables in-field logic updates while the system operates and supports rapid reconfiguration of SRAM-based logic.
• Logic density — Approximately 15,000 logic elements to implement medium-complexity designs.
• Embedded memory — Approximately 331,776 bits (≈0.33 Mbits) of on-chip RAM for block and distributed memory needs.
• High I/O count — Up to 300 I/Os supporting diverse interface requirements in the 484-BBGA (484-FPBGA 23×23) package.
• Flexible voltage support — Operates across a wide supply range (1.71 V to 3.465 V) to accommodate multiple I/O standards and system rails.
• Analog and clocking — Up to four sysCLOCK™ analog PLLs for clock multiply/divide and phase shifting (family feature).
• Low-power mode — Sleep mode provides substantial static current reduction (up to 1000× as documented for the family).
• Industrial temperature rating — Specified for operation from −40 °C to 100 °C.
• Package — 484-ball BGA footprint (supplier device package 484-FPBGA, 23 × 23 mm) for compact board integration.

Typical Applications

• Industrial control and automation — Industrial-grade temperature range and robust I/O count enable real-time control, sensor aggregation, and interface bridging in automation systems.
• Embedded systems — Instant-on, non-volatile configuration and on-chip memory make the device suitable for embedded designs requiring rapid boot and secure configuration storage.
• Communications and connectivity — High I/O density and flexible I/O standards support data interface bridging, protocol adaptation, and board-level interface consolidation.

Unique Advantages

• Secure, no-external-boot architecture: Eliminates the need for external configuration memory and reduces the risk of bitstream interception.
• Fast system availability: Instant-on capability enables microsecond-scale power-up, shortening system initialization time.
• Field-upgradeable logic: TransFR™ reconfiguration supports in-field updates without removing the device from service, simplifying maintenance and upgrades.
• Flexible power and I/O: Wide supply-voltage support (1.71–3.465 V) and up to 300 I/Os enable heterogeneous I/O standards and mixed-voltage board designs.
• Industrial robustness: Rated for −40 °C to 100 °C operation and specified as Industrial grade for deployment in demanding environments.
• Integrated clocking resources: Multiple PLLs for clock management help implement complex timing and memory interfaces.

Why Choose LFXP15C-3F484I?

The LFXP15C-3F484I combines non-volatile, instant-on operation with mid-range logic capacity and flexible memory resources to serve a wide set of embedded and industrial designs. With robust temperature specifications, a high I/O count, and support for in-field reconfiguration, it is positioned for systems that demand secure, fast-booting, and maintainable FPGA-based logic.

Designed within the LatticeXP family, this device benefits from density migration options and a documented tool/IP ecosystem to accelerate development and scale designs across device densities.

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