LFXP15C-3FN256I

The LFXP15C-3FN256I is a LatticeXP family field-programmable gate array (FPGA) featuring 15,000 logic elements and approximately 0.33 Mbits of on-chip RAM in a 256-ball fpBGA (17 × 17 mm) surface-mount package. Its non-volatile, instant-on architecture and flexible I/O make it suited for mid-density embedded and industrial designs that require fast startup, in-field reconfiguration and a broad voltage range of 1.71 V to 3.465 V.

Key Features

• Logic Capacity — 15,000 logic elements with architecture resources consistent with the LatticeXP family (PFU/PFF total 1,932).
• Embedded and Distributed Memory — Total on-chip RAM of 331,776 bits (approximately 0.33 Mbits), supporting block and distributed memory configurations for data buffering and packet processing.
• Flexible I/O — 188 user I/O pins; programmable sysIO buffer supports a wide range of interfaces and standards including multiple LVCMOS levels, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
• Non‑volatile Instant‑On — ispXP non-volatile technology delivers instant-on startup without the need for external configuration memory and protects design bitstreams from read-back.
• In-field Reconfiguration — TransFR™ Reconfiguration enables in-field logic updates while the system operates and allows SRAM-based logic to be reconfigured in milliseconds.
• Low‑Power Modes — Sleep mode capability reduces static current by up to 1000× for power-sensitive applications.
• Clocking and Memory Interfaces — Up to four analog PLLs for clock multiply/divide and phase shifting; dedicated DDR memory interface support up to DDR333 (166 MHz).
• System Diagnostics & Configuration — IEEE 1149.1 boundary scan, ispTRACY™ internal logic analyzer capability, and an onboard oscillator for configuration.
• Package, Power & Temperature — 256-FPBGA (17 × 17 mm) surface-mount package; nominal supply range 1.71 V to 3.465 V; industrial operating range −40 °C to 100 °C. RoHS compliant.

Typical Applications

• Industrial Control — Real-time I/O aggregation, protocol bridging and control logic where industrial temperature range and robust reconfiguration are required.
• Communications & Networking — Mid-density packet processing, interface bridging and DDR memory interfacing using the device’s flexible I/O and DDR support.
• Embedded Systems — Instant-on, non-volatile operation and on-chip memory enable compact, secure embedded designs with fast startup and in-field updates.

Unique Advantages

• Instant-on, non-volatile architecture: Eliminates the need for external configuration memory, simplifying the BOM and improving system security.
• Field-updatable logic: TransFR reconfiguration allows safe in-system updates and rapid SRAM reprogramming, reducing maintenance downtime.
• Broad I/O flexibility: Programmable I/O buffers support numerous signaling standards, letting designers consolidate interface components.
• Compact, industrial-grade package: 256-FPBGA 17 × 17 mm package with −40 °C to 100 °C rating supports space-constrained, industrial applications.
• Power management options: Sleep mode provides major static current reduction for low-power or battery-backed systems.

Why Choose LFXP15C-3FN256I?

The LFXP15C-3FN256I combines a mid-range logic capacity (15,000 logic elements) with flexible embedded memory and a rich set of system features from the LatticeXP family—non-volatile instant-on behavior, in-field reconfiguration, multiple PLLs and extensive I/O standards support. This combination is well suited to designers who need fast startup, secure configuration and the ability to update logic in the field without added external components.

Choose this device for industrial and embedded projects that require a balance of logic density, on-chip RAM and interface flexibility in a compact 256‑ball fpBGA package with industrial temperature range and RoHS compliance.

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