LFXP15C-3F256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA

Quantity 819 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15C-3F256C – XP FPGA, 15,000 logic elements, 256-FPBGA

The LFXP15C-3F256C is a Lattice Semiconductor XP-family field programmable gate array (FPGA) offered in a 256-ball fpBGA (17 × 17 mm) package. It combines non‑volatile, reconfigurable logic with embedded memory and flexible I/O to support system-level implementations where instant-on operation, in-field reconfiguration and compact board integration are required.

With 15,000 logic elements, 188 I/Os and approximately 0.33 Mbits of on‑chip RAM, this commercial‑grade device targets developers building compact embedded systems, communications interfaces and memory‑centric designs that benefit from integrated PLLs and a wide supply voltage range.

Key Features

  • Core Logic 15,000 logic elements provide mid-range programmable logic capacity for control, glue logic and custom datapath implementation.
  • Embedded Memory Approximately 0.33 Mbits of on-chip RAM (total RAM bits: 331,776) supporting distributed and block memory use within designs.
  • I/O Flexibility 188 programmable I/Os in a 256‑ball fpBGA package (256-FPBGA, 17 × 17 mm) to support wide interfacing options on space-constrained boards.
  • Non‑volatile, Instant‑on Architecture LatticeXP family features non‑volatile, infinitely reconfigurable technology enabling immediate start-up without external configuration memory.
  • Reconfiguration and Low‑Power Modes Family capabilities include in-field reconfiguration (TransFR) and a sleep mode that can significantly reduce static current.
  • Clocking and Memory Interface Up to four analog PLLs per device for clock management and dedicated DDR memory interface support up to DDR333.
  • Power and Thermal Operates across a broad supply range (1.71 V to 3.465 V) and is specified for commercial temperature operation (0 °C to 85 °C).
  • Compliance and Packaging Surface-mount 256-FPBGA (17 × 17 mm) package; RoHS compliant.

Typical Applications

  • Embedded System Control Implement control logic, state machines and interface bridging in compact embedded platforms where integrated memory and instant-on behavior are advantageous.
  • Communications and I/O Bridging Use the flexible I/O and programmable logic to implement protocol conversion, SERDES front-ends and custom interface logic.
  • Memory Interface and Buffering Leverage on-chip RAM and dedicated DDR support for buffering, packet handling or temporary data storage in dataflow designs.
  • In-field Upgradable Systems Deploy designs requiring fast in-system updates and secure configuration, benefiting from non‑volatile instant-on and reconfiguration features.

Unique Advantages

  • Non‑volatile instant-on: Eliminates the need for external configuration memory and enables immediate device startup.
  • In-field reconfiguration: TransFR capability allows logic updates while the system remains in operation, enabling feature upgrades and bug fixes without board replacement.
  • Compact, high‑I/O package: 256-FPBGA (17 × 17 mm) footprint provides 188 I/Os for dense connectivity in space‑restricted designs.
  • Integrated memory resources: Approximately 0.33 Mbits of on‑chip RAM reduces external memory dependencies for many buffering and state storage needs.
  • Flexible clocking and DDR support: Up to four PLLs and dedicated DDR333 interface support simplify timing and high‑speed memory interfacing.
  • Wide supply range and commercial grade: Operates from 1.71 V to 3.465 V and is specified for 0 °C to 85 °C operation for standard commercial applications.

Why Choose LFXP15C-3F256C?

The LFXP15C-3F256C delivers a balanced combination of mid‑range logic capacity, embedded memory and extensive I/O in a compact 256‑ball fpBGA package. Its non‑volatile, instant‑on architecture and in‑field reconfiguration capabilities make it suitable for systems that require fast startup and live updates without external configuration components. The device’s integrated clocking and DDR support further simplify system-level design where memory interfaces and precise timing are required.

This FPGA is a practical choice for engineers and teams building embedded controllers, communications interfaces and memory‑adjacent functions who need an integrated, commercially rated FPGA solution with accessible power and thermal specifications and RoHS compliance.

Request a quote or submit an inquiry for pricing and availability of LFXP15C-3F256C to begin integrating this compact, reconfigurable FPGA into your next design.

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